Новини світу мікро- та наноелектроніки

motor speed controller from random parts on my desk submitted by /u/a_certain_someon [link] [comments]

I am starting a family or a addiction 😅 -The arduino nano with the led is a tv b gone -the orange thing is a m5stickc plus2 -the usb purple thing is a cjmcu badusb -and the white thing is a flipper zero with external antenna submitted by /u/Kulderzipke_ [link] [comments]

submitted by /u/AutoModerator
[link] [comments]

If you have your TV attached to a good, mid 2000 Hi-Fi, probably you have two remotes laying around, or if you are a retro gamer, you probably have to get up from your couch to restart or turn off tour PS2. This device allows you to control all from a single remote It respond to a received IR code with a previously programmed, corresponding IR command to control a second device. It is fully open source and there’s a github repository for all the work I’ve done so far submitted by /u/Shyne-on [link] [comments]

All Calls Now Open for Maker Faire Rome 2024 From 25th to 27th October, the festival on innovation, promoted and organized by the Rome Chamber of Commerce, will return to the Gazometro Ostiense. The calls for Maker Faire Rome 2024 are now open! The event, promoted and organized by the Rome Chamber of Commerce (www.makerfairerome.eu), […]

The post Join Maker Faire Rome 2024: Innovation Unleashed at Gazometro Ostiense | Calls Now Open! appeared first on Open Electronics. The author is Boris Landoni

Semiconductor foundry United Microelectronics Corp of Hsinchu, Taiwan has announced what it claims is the first 3D IC solution for radio-frequency silicon-on-insulator (RFSOI) technology. Available on UMC’s 55nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of RF performance, enabling customers to efficiently integrate more RF components to address the greater bandwidth requirements of 5G...

By: Nijas Kunju, Technical Manager in Application Engineering, ANSYS Inc

India’s robust investment in the aviation sector, exemplified by the substantial budgetary allocation of $72 billion for defense aviation in 2023, with $20 billion of domestic earmarking, points to an era of growth and innovation for the sector. This strategic investment has catalyzed the emergence of a vibrant private sector engagement in the development of cutting-edge drones, UAVs, and HAPS (high-altitude platform systems), complementing the government’s initiatives on 5th and 6th-generation fighter aircraft.

This transformative landscape includes initiatives such as the Indian Defense Offset and Make in India programs, fostering an environment conducive to heightened global participation in India’s Aerospace and Defense sector. Leading Aerospace and Defense OEMs, recognizing the imperative of technological advancement to maintain competitiveness, are steadfastly embracing modern innovations to elevate their product offerings.

With burgeoning market demands and a compelling investment climate, stakeholders increasingly advocate for expedited time-to-market for advanced stealth vehicles. Achieving this goal necessitates a paradigm shift towards minimizing prototype iterations and striving for “first-time-right” design success. Herein lies the pivotal role of Digital Engineering solutions, seamlessly integrating data management, Model-based System Engineering, and multidisciplinary analysis and optimization through physics-based simulations. Embracing these cutting-edge methodologies expedites product development and ensures enhanced agility and precision, propelling the Aerospace and Defense industry into unparalleled innovation and efficiency.

Prevailing challenges

Developing defense technologies involves strict requirements and limitations. In military aircraft, achieving stealth capability is crucial to evade detection by radar and other detection methods. This involves shaping the aircraft to minimize its visibility on radar and reducing its visual, acoustic, and infrared signatures. However, creating a stealthy design has drawbacks, including compromises in aerodynamic performance, longer development times, reduced fuel capacity, higher maintenance needs, and higher costs.

Among the various stealth technologies, radar avoidance is critical because radar can detect aircraft from long distances, regardless of weather or time of day. Therefore, reducing the aircraft’s radar cross-section (RCS) is a primary focus. Several methods exist, such as smoothing sharp edges, changing the aircraft’s shape (which can affect aerodynamics), using radar-absorbing materials (which can pose challenges at high speeds and specific frequencies), and employing active RCS cancellation techniques.

Advanced electromagnetic simulations, such as Finite Element Method (FEM), Finite Difference Time Domain (FDTD), Integral Equation (IE), physical optics (PO), and Signature-based Reduction (SBR), are used to virtually implement and accurately predict the RCS of aircraft structures (Figure 1-2).

Figure 1: shows the RCS of a corner reflector measured (red dotted) against HFSS IE and SBR+ solver

Navigating the complexities of identifying areas on aircraft or vehicles that contribute to high RCS poses a significant challenge for designers. Implementing effective mitigation strategies, such as employing radar-absorbing paints and structures, realizes pinpoint accuracy in identifying these problematic regions. Leveraging advanced 2D and 3D ISAR imaging techniques provides invaluable insights into these critical areas. Figure 3 vividly illustrates that the RCS spikes dramatically when electromagnetic energy aligns with an incident wave direction of approximately +/-98 degrees. The ISAR image comprehensively depicts these high-return regions, empowering designers to select and apply optimal RCS reduction methods strategically.

Figure 2: Graphs shows measured Vs HFSS Simulated RCS value (Source: the University of Texas Austin CEM Benchmarks)

 

Figure 3 Cessna aircraft (RCS), ISAR image, Project of RCS Hotspot area on aircraft

Transforming the defense landscape through stealth technology

Our airborne devices are protected by stealth technology, but the need for advanced radar systems to identify and classify targets remains just as important. Different types of radar are used to identify targets: bistatic, monostatic, etc. More recently, there has been an increase in the use of low-flying unmanned aerial vehicles (UAVs) and drones for defense applications. Distinguishing them from birds or other civilian objects requires high-resolution radar with a sophisticated signal processing system that can extract specific features of the target movement. AI/ML methods for classification are also being used, such as ISAR imaging, micro-Dopple effects, etc. However, these AI/ML methods require a large set of training data for each target type, such as drones, birds, UAVs, etc. For example, you need training data from different radar perspectives while in flight to identify a drone. One also needs different radars with different operating frequencies and bandwidths to capture the full spectrum of the target signatures. However, this diversity in radar systems makes it challenging to acquire comprehensive training data.

Advanced simulations can produce synthetic data mirroring real-world object behavior through numerical computation techniques. This facilitates the virtual recreation of electromagnetic properties at target frequencies and radar antennas, resulting in simulated radar raw IQ data. Users can use this raw data directly or apply their signal-processing algorithms to the simulated data. The processed data then serves as input for training AI/ML models [Figure 4]. The accompanying image depicts the detection of a drone using a 40GHz radar with a range resolution of 0.1 meters (achieved through a bandwidth of 1499 MHz). The Range-Doppler image illustrates the Doppler shift produced by rotating the drone’s front and back blades. Since rotating blades have components moving towards and away from the radar, they generate positive and negative Doppler velocity spreads in the spectrum.

Figure 4: Micro Doppler generation from the Drone, with and without Rotar blade rotation.

Observing a target over an extended duration (approximately 100-200ms) and analyzing its micro-Doppler signature can extract additional details such as rotor blade speed. This process assumes the target has already been identified using AI/ML techniques applied to the Range-Doppler image [Figure 5].

Figure 5: Spectrogram of Micro-doppler Signature from Quadcopter Drone.

To summarize, many challenges will continue to permeate, pushing the boundaries of innovation in this ever-evolving landscape of advanced stealth and radar technology. Yet, within these challenges lie unparalleled opportunities to redefine the capabilities of modern defense systems and the future of warfare. As we strive to overcome obstacles such as detection evasion and signal manipulation, we are compelled to harness the full potential of emerging technologies and interdisciplinary collaboration. To fulfill the market demand today, digital missions and high-fidelity behavioral models, virtual twins are the way of the future. Organizations such as Ansys are collaborating closely to expedite the development of products, aiming to bring this vision to reality. We will only unlock new frontiers in stealth and radar technology through perseverance, ingenuity, and technological innovations, paving the way for enhanced security and strategic advantage for India in an increasingly dynamic world.

The post Challenges and Opportunity in Developing Advanced Stealth and Radar Technology appeared first on ELE Times.

Uncontrolled vibration can cause semiconductor damage and decreased performance. Many sources of vibration challenge semiconductor manufacturers, including people’s footsteps, running machines, wind blowing in the building and passing vehicles. These sources can pose a significant challenge for design and manufacturing engineers.

Working in environments with poorly controlled vibrations can mean these professionals waste time and raw materials while designing and manufacturing new components or improving existing ones. What sources of vibration control should engineers consider?

1. Facilities for vibration control

People involved with semiconductor manufacturing facilities under construction should be proactive and insist that those buildings have appropriate vibration controls. That was the approach of the design team associated with a $279 million project for a three-story semiconductor research lab.

The designers knew even tiny vibrations could negatively impact a semiconductor’s performance, potentially delaying or complicating research and manufacturing. Similarly, they recognized that the new facility must have contamination-mitigation features.

For instance, the building must have a clean room with a vibration-isolated floor. While working with those overseeing the construction details, the design professionals created a set of specifications adhering to their vibration-dampening and contamination-preventing needs.

Designers considering temporarily or permanently working at existing semiconductor facilities should ask which measures those buildings have, ensuring they reflect industry standards. That proactive measure helps designers work at places where they will spend their time well.

2. Specialized products to interrupt and absorb vibration

Semiconductor manufacturing plants must have integrated products that absorb incoming vibrational energy and dampen external vibration sources. For example, a company may need to put thousands of spring mounts inside pipes and ductwork. However, the size and placement of the required spring mounts vary depending on the length and diameter of the building’s infrastructure.

It’s also often necessary to suspend pipes and ductwork from acoustic hangers after wrapping them in special housing. Some semiconductor facilities also have pipe connectors designed for specific types of vibration.

Those overseeing the construction or upgrading of a semiconductor fabrication facility should familiarize themselves with the off-the-shelf and custom-made products available to meet such needs. It’s also wise to get input from at least one consultant about how best to dampen the known or suspected types of vibration that will affect a fab.

3. Install sensors to measure machine conditions

When electronics product designers consider the aspects of new items, they must think about whether such components could be manufactured on a facility’s existing equipment. Another thing to verify is whether the fab’s infrastructure has sensors to detect abnormal vibrations.

Due to the semiconductor industry’s heavy dependence on water during manufacturing, a pump failure could be an extremely costly and disruptive problem. Rotor pumps spin as fast as 30,000 rotations per minute and vibrate more when rotor damage occurs. This issue generally requires a total pump replacement.

Advanced sensors can measure tiny changes—such as progressively increasing vibration—and warn technicians that failures will happen soon. Such information allows fab professionals to order new parts or schedule service calls before outages occur. Decision makers could also use these sensors as vibration monitoring tools and act quickly to mitigate new issues.

Vibration control is essential

Poor or non-existent vibration-control measures in a semiconductor plant affect manufacturers and design team members. The above mentioned strategic measures can reduce or eliminate problems, helping everyone stay productive and get the best results from their work.

Ellie Gabel is a freelance writer as well as an associate editor at Revolutionized.

Related Content

• AI Edges to Factory Floor
• MEMS vibration sensor debuts
• IMEC opens research-scale 300-mm wafer fab
• Cars That Listen: External Sound Pickup With Vibration Sensors

The post 3 basic considerations for vibration control in chip manufacturing appeared first on EDN.

Enables longer battery runtime in wearables, trackers, and activity monitoring

The LSM6DSV32X 6-axis inertial module (IMU) from STMicroelectronics has a large accelerometer full-scale range of 32g and 4000 degrees-per-second (dps) gyroscope to measure intensive movements and impacts, including freefall height estimation. Ready to drive future generations of edge-AI applications, the new sensor device enables extra features and longer battery runtime in consumer wearables, asset trackers, and impact and fall alarms for workers.

The LSM6DSV32X extends the family of smart sensors that contain ST’s machine-learning core (MLC) with AI algorithms based on decision trees. With the MLC for context sensing and a finite state machine (FSM) for motion tracking, these sensors let product developers add new features, minimize latency, and save power. Leveraging the embedded features LSM6DSV32X slashes the power budget for functions such as gym-activity recognition to below 6µA. The LSM6DSV32X also embeds ST’s Sensor Fusion Low-Power (SFLP) algorithm to perform 3D orientation tracking at just 30µA. And by supporting adaptive self-configuration (ASC), the module autonomously reconfigures sensor settings in real-time to continuously optimize performance and power.

In addition to the accelerometer and gyroscope, the LSM6DSV32X integrates ST’s Qvar electrostatic charge-variation sensing to handle advanced user-interface functions such as touching, swiping, and tapping. The module also contains an analog hub for acquisition and processing of external analog signals.

Product developers can rely on a large selection of ready-to-use libraries and tools to accelerate the time to market for new products. These include the intuitive MEMS Studio environment, which supports evaluation and use-case development, and a dedicated GitHub repository that provides code examples such as sports activity and head-gesture recognition. Resources also include hardware adapters for connecting the IMU to ST’s evaluation and proof-of-concept boards such as the ProfiMEMS board, Nucleo sensor expansion board, and Sensortile.box PRO.

The LSM6DSV32X is scheduled to enter volume production in May 2024 in a 2.5mm x 3mm x 0.83mm 14-lead LGA package. Sample requests and pricing information are available from local ST sales offices. Pricing starts from $2.98 for orders of 1000 pieces.

Please visit https://www.st.com/lsm6dsv32x for more information.

The post STMicroelectronics extends edge-AI sensor family with inertial module for intensive movement analysis appeared first on ELE Times.

Hi my laptop died and started to troubleshoot it. I found capacitors in these portion of motherboard to be shorting. Upon injecting voltage on one of the caps, this chip “eHCSA” was getting hot on FLIR camera. Does anyone know what this chip is and where can I order one? Can’t seem to find any on Aliexpress submitted by /u/TotallyFakeEngineer [link] [comments]

submitted by /u/LEDLABS [link] [comments]

Keysight announced additional testing capabilities for its Inspector security platform to assess the robustness of post-quantum cryptography (PQC). Keysight Inspector, part of the recent Riscure Security Solutions acquisition, enables device and chip vendors to identify and fix hardware vulnerabilities during the design cycle.

The development of PQC encryption algorithms capable of withstanding quantum computer attack is crucial for protecting sensitive electronic information. However, new technologies assumed to be resilient against post-quantum threats may be vulnerable to existing hardware-based attacks. To tackle this issue, Keysight has added post-quantum algorithm testing to the Inspector device security platform.

Inspector can now be used to test implementations of the CRYSTALS-Dilithium digital signature algorithm, one of the encryption algorithms selected by NIST for PQC standardization. Hardware designers adopting this algorithm will be able to verify that products are secure against these threats. Government institutions and security test labs can also use Inspector to verify the strength of third-party products.

With ongoing standardization, many more new security algorithms will become available for multiple applications and industries. Ensuring their effectiveness demands verifiable implementations. Keysight will furnish the requisite test tools alongside certification services via Inspector.

To read more about Inspector and Riscure Security Solutions by Keysight, click here.

Keysight Technologies 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Keysight hones post-quantum algorithm testing appeared first on EDN.

HMI’s HL8518 is a single-channel high-side power switch for automotive low-watt lamps, high-side relays and valves, and other general loads. The device integrates a power FET and charge pump, providing a typical on-resistance of 80 mΩ.

The HL8518 operates from 3.5 V to 40 V and provides 3-V/5-V compatible logic inputs. Current limiting is programmable via an external resistor. AEC-Q100 Grade 1 qualified, the switch operates over a temperature range of -40°C to +125°C and has a low standby current of <0.5 µA.

Protection functions of the HL8518 include overvoltage, short-circuit, undervoltage lockout, thermal shutdown, and reverse battery. When tested in accordance with AEC-Q100-12, the power switch achieved Class A certification by enduring 1 million short circuits to ground.

Samples of the HL8518 high-side switch can be ordered online.

HL8518 product page

HMI

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post High-side switch suits automotive loads appeared first on EDN.

Powered by an Arm Cortex-M33 core, Microchip’s PIC32CK 32-bit MCUs leverage both a hardware security module (HSM) and Arm’s TrustZone security architecture. This level of embedded security enables designers to meet upcoming cybersecurity compliance requirements set to take effect in 2024 for most IoT-connected devices.

The HSM subsystem of these mid-range MCUs integrates a dedicated CPU, memory, secure DMA controllers, cryptographic accelerators, and firewalled communications with the host. It provides symmetric and asymmetric cryptographic operations, true random number generation, key management, and authentication for automotive, industrial, medical, and communication applications. TrustZone, a hardware-based secure privilege environment, provides an additional layer of protection for key software functions.

PIC32CK microcontrollers support ISO 26262 function safety and ISO/SAE 21434 cybersecurity standards. Devices offer a range of options to tune the level of security, memory, and connectivity bandwidth. They furnish up to 2 Mbytes of dual-panel flash with ECC and 512 kbytes of SRAM. Connectivity options include 10/100-Mbps Ethernet, CAN FD, and USB.

The PIC32CK family is available now for purchase in high-volume production quantities.

PIC32CK product page

Microchip Technology 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post 32-bit MCUs embed high level of security appeared first on EDN.

Operating from a supply voltage down to 2.3 V, the PI5USB212 signal conditioner IC from Diodes automatically detects a USB 2.0 high-speed connection. The part, which is intended for use in PCs, docking stations, cable extenders, and monitors, preserves signal integrity when driving long PCB traces or cables extending up to 5 meters.

The PI5USB212 symmetrically boosts the USB D+ and D- channels to maintain common-mode stability. It also applies pre-emphasis to compensate for intersymbol interference (ISI). The IC’s wide supply range of 2.3 V to 5.5 V simplifies system design and extends the operating window of portable and battery-powered equipment.

To converse energy, the PI5USB212 automatically detects when a USB device is not attached and reduces its supply current to just 0.7 mA typical. When the IC is disabled via the RSTN disable pin, it minimizes current consumption to just 13 µA typical. In addition to USB 2.0, the PI5USB212 is compatible with USB On-The-Go (OTG 2.0) and Battery Charging (BC 1.2) specifications.

Housed in a 12-pin, 1.6×1.6-mm QFN package, the PI5USB212 signal conditioner costs $2.70 each in lots of 3500 units.

PI5USB212 product page

Diodes

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post USB signal conditioner is self-adapting appeared first on EDN.

The MA24103A inline power sensor from Anritsu performs peak power measurements from 25 MHz to 1 GHz with a power range of 2 mW to 150 W. A dual-path architecture enables the sensor to carry out true-RMS measurements over the entire frequency and power range. This bidirectional plug-and-play device joins the company’s existing MA24105A peak power sensor, which has a frequency range of 350 MHz to 4 GHz.

Critical markets that require peak and average power measurements well below the 1-GHz range, such as public safety, avionics, and railroads, demand reliable communication between control centers and vehicles. Lower frequencies can propagate a longer distance and maintain communication with fast-moving vehicles. Typically, at these lower frequencies, transmitting signals operate within the watt range, making the MA24103A particularly suitable for such applications.

The MA24103A inline peak power sensor communicates with a PC via a USB connection and comes with PowerXpert data analysis and control software. It also works with Anritsu handheld instruments equipped with optional high-accuracy power meter software (Option 19).

MA2410xA product page 

Anritsu

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Inline power sensor covers low frequencies appeared first on EDN.

The industrial, scientific, and medical (ISM) radio frequency bands find common use in electronics systems, by virtue of their comparatively lightly regulated nature versus (for example) spectrum swaths used by cellular, satellite, and terrestrial radio and television networks. As Wikipedia explains:

The ISM radio bands are portions of the radio spectrum reserved internationally for industrial, scientific, and medical (ISM) purposes, excluding applications in telecommunications. Examples of applications for the use of radio frequency (RF) energy in these bands include RF heating, microwave ovens, and medical diathermy machines. The powerful emissions of these devices can create electromagnetic interference and disrupt radio communication using the same frequency, so these devices are limited to certain bands of frequencies. In general, communications equipment operating in ISM bands must tolerate any interference generated by ISM applications, and users have no regulatory protection from ISM device operation in these bands.

 Despite the intent of the original allocations, in recent years the fastest-growing use of these bands has been for short-range, low-power wireless communications systems, since these bands are often approved for such devices, which can be used without a government license, as would otherwise be required for transmitters; ISM frequencies are often chosen for this purpose as they already must tolerate interference issues. Cordless phones, Bluetooth devices, near-field communication (NFC) devices, garage door openers, baby monitors, and wireless computer networks (Wi-Fi) may all use the ISM frequencies, although these low-power transmitters are not considered to be ISM devices.

FCC certification of such products is still necessary, of course, to ensure that a given device doesn’t stray beyond a given ISM band’s lower and upper frequency boundaries, for example, or exceed broadcast power limits. That said, reiterating my first-paragraph point, the key appeal of ISM band usage lies in its no-license-required nature. Plenty of products, including those listed in the earlier Wikipedia description along with, for example, the snowblower-mangled “fob” for my Volvo’s remote keyless system that I finished dissecting two years ago, leverage one-to-multiple ISM bands; Wikipedia lists twelve total defined and regulated by the ITU, some usable worldwide, others only in certain regions.

Probably the most common (discussed, at least, if not also used) ISM bands nowadays are the so-called “2.4 GHz” (strictly speaking, it should be 2.45 GHz, reflective of the center frequency) that spans 2.4 GHz to 2.5 GHz, and “5 GHz” (an even less accurate moniker) that ranges from 5.725 GHz to 5.875 GHz. And echoing the earlier Wikipedia quote that “in recent years the fastest-growing use of these bands has been for short-range, low-power wireless communications systems”, among the most common applications of those two ISM bands nowadays are Bluetooth (2.4 GHz) and Wi-Fi (both 2.4 GHz and 5 GHz, more recently further expanding into the non-ISM “5.9 GHz” and “6 GHz” band options). This reality is reflected in the products and broader topics that I regularly showcase in my blog posts and teardowns.

However, although when you hear the words “Bluetooth” and “Wi-Fi” you might automatically think of things like:

• Smartphones
• Tablets
• Computers and
• Speakers

I’m increasingly encountering plenty of other wirelessly communicating widgets that also abide in one or both of these bands. Some of them also use Bluetooth and/or Wi-Fi, whether because they need to interact with Bluetooth- and Wi-Fi-based devices (a wireless HDMI transmitter that leverages a smartphone or tablet as its associated receiver-and-display, for example) or more generally because high-volume industry-standard chips and software tend to be cost-effective (not to mention stable, feature-rich and otherwise mature) versus proprietary alternatives. But others do take the proprietary route, even if just from a “handshake” protocol standpoint.

In the remainder of this post, I’ll showcase a few case study examples of the latter that I’ve personally acquired. Before I dive in, however, here are a few thoughts on why a manufacturer might go down either the 2.4 GHz or 5 GHz (or both) development path. Generally speaking…

2.4 GHz is, all other factors being equal:

• Longer range (open-air)
• Comparatively immune to (non-RF) environmental attenuation factors such as chicken wire in walls and the like, and
• Lower power-consuming

but is also:

• Lower-bandwidth and longer-latency, and
• (For Wi-Fi uses) offers fewer non-spectrum-overlapping broadcast channel options

Unsurprisingly, 5 GHz is (simplistically, at least) the mirror image of its 2. 4 GHz ISM sibling:

• Higher bandwidth (especially with modern quantization schemes) and lower latency, and
• (For Wi-Fi) many more non-overlapping channels (a historical advantage that’s, however, increasingly diminished by modern protocols’ support for multichannel bonding)

but:

• Shorter range
• Greater attenuation by (non-RF) environmental factors, and
• Higher power-consuming

Again, I’ll reiterate that these comparisons are with “all other factors being equal”. 5 GHz Wi-Fi, for example, is receiving the bulk of industry development attention nowadays versus its 2.4 GHz precursor, so the legacy power consumption differences between them are increasingly moot (if not reversed). And environmental attenuation effects can to at least some degree be counterbalanced by more exotic MIMO antenna (and associated transmitter and receiver) designs along with mesh LAN topologies. With those generalities and qualifiers (along with others of both flavors that I may have overlooked; chime in, readers) documented, let’s dive in.

Wireless multi-camera flash setups

One of last month’s teardowns was of Godox’s V1 flash unit, which supports the company’s “X” wireless communication protocol, optionally acting as either a master (for other receivers and/or flashes configured as slaves) or slave (to another transmitter or master-configured flash):

In that writeup, I also mentioned Neewer’s conceptually similar, albeit protocol-incompatible Z1 flash unit and its “Q” wireless scheme:

And a year back I covered now-defunct Cactus and its own unique wireless sync approach:

All three schemes are 2.4 GHz-based but proprietary in implementation. Candidly, I’m somewhat surprised, given the limited data payload seemingly required in this application, that even longer-range 900 MHz wasn’t used instead. Then again, the limitations of camera optics and artificial illumination intensity-vs-distance may “cap” the upper-end range requirement, and comparative latency might also factor into the 2.4 GHz-vs-900 MHz selection.

Wireless HDMI transmitter and receiver

Vention’s compact system, which I purchased from Amazon at the beginning of the year, has found a permanent place in my travel satchel. The Amazon product page mentions both 2.4 and 5 GHz compatibility, but I think that’s a typo: Vention’s literature documents (and promotes, versus the company-positioned inferior 2.4 GHz alternative) only 5 GHz support, and the FCC certification records (FCC ID: 2A7Z4-ADC) also only document 5 GHz capabilities. The perhaps-obvious touted 5 GHz advantages are resolution (1080p max) and frame rate (60 fps), along with decent range; up to 131 feet (40 m), but only “in interference-free environments”, along with a further qualifier that “range is reduced to 32FT/10M when transmitting through walls or floors.” Regardless, since this is a “closed loop” (potentially multiple) transmitter to receiver setup, Wi-Fi compatibility isn’t necessary.

Wireless video-capture monitoring systems

Accsoon and Zhiyun’s approaches to wirelessly connecting a camera’s external video output to a remote monitor, which I previously covered back in July of last year, are conceptually similar but notably vary in implementation. The two Accsoon “mainstream” units I own are designed to solely stream to a remote smartphone or tablet and are therefore 2.4 GHz Wi-Fi-based, generating a Wi-Fi Direct-like beacon to which the mobile device connects. That said, Accsoon also sells a series of CineEye “Pro” models come as transmitter-plus-dedicated receiver sets and support both 2.4 GHz and 5 GHz transmission capabilities.

Zhiyun’s TransMount gear is intended to be used with the company’s line of gimbals, and like Accsoon’s hardware you can also “tune into” a transmitter directly from a smartphone or tablet using a company-developed Android or iOS app. That said, Zhiyun also sells a dedicated receiver to which you can connect a standalone HDMI field monitor. And for peak potential image quality (at a range tradeoff), everything runs only on 5 GHz Wi-Fi.

Wireless lavalier microphone sets

I got the Aikela set from Amazon last spring, and the Hollyland system (the Lark 150, to be exact) off eBay a month earlier. Both, as you have probably already discerned from the photos, are two-transmitter (max)/single-receiver setups. The Hollyland is the more professional-featured of the two, among other things supporting both built-in and external-tethered mics for the transmitters; that said, the Aikela receiver has integrated analog and both digital Lightning and USB-C output options…which is why I own both setups. They’re both 2.4 GHz-based and leverage proprietary communication schemes. Newer wireless lav models, such as DJI’s Mic 2, can also direct-transmit audio to a smartphone, tablet or other receiver over Bluetooth.

Joyo wireless XLR transmitter/receiver combo

I picked up two sets of these from Amazon last summer. As the image hopefully communicates effectively, they aren’t full-blown microphone setups per se; instead, they take the place of an XLR cable, with the transmitter mated to the XLR output of a microphone (or other audio-generating device) and the receiver connected to the mixing board, etc. The big surprise here, at least to me, is that unlike the previous 2.4 GHz mic sets, these are 5 GHz-based.

Clearly, as the earlier microphone-set examples exemplify, audio doesn’t represent a particularly large data payload, and any lip sync loss due to latency will be minimal at worst (and can be further time sync-corrected in post-production; that is, if you’re not live-streaming).

Perhaps the developer was assuming that multiple sets of these would be in simultaneous use by a band, for vocals and/or instruments, and wanted plenty of spectrum to play with (each transmitter/receiver combo is uniquely configurable to one of four possible channels). And/or perhaps the goal was to avoid interference with other 2.4 GHz broadcasters (such as a microwave oven backstage). All at a potential broadcast range tradeoff versus 2.4 GHz, of course.

Wireless guitar systems

I got the Amazon Basics setup last summer, and the Leapture RT10 (also from Amazon) last fall. Why both, especially considering the voluminous dust currently collecting on my guitars? The on-sale prices, only ~$30 in both cases, were hard to resist. I figured I could just do a teardown on at least one of them. And hope springs eternal that I’ll eventually blow the dust off my guitars. Both are 2.4 GHz-based; the Leapture setup also offers Bluetooth streaming support.

CPAP (continuous positive airway pressure) machine

Last, but not least, and breaking the to-this-point consistent cadence of multimedia-tailored case studies, there’s my Philips Respironics DreamStation Auto CPAP (living at altitude can have some unique accompanying health challenges). Every morning, I download the previous night’s captured sleep data to my iPad over Bluetooth. Bluetooth Low Energy (LE), to be exact, for reasons that aren’t even remotely clear to me. The machine is AC-powered, after all, not battery-operated. And that the DreamStation doesn’t use conventional Bluetooth connectivity only acts as a potential further complication to initial pairing and ongoing communication. Then again, I suppose Bluetooth connectivity is among the least of Philips’ challenges right now…

Connect with me, wired or wirelessly

As always, I welcome your thoughts on anything I’ve written here, and/or any additional case studies you’d like to share, in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

Related Content

• A Volvo key fob: A post-mortem investigation
• The Godox V1 camera flash: Well-“rounded” with multiple-identity panache
• Multi-source vs proprietary: more “illuminating” case studies
• USB Power Delivery: incompatibility-derived foibles and failures
• Fundamentals of ISM-Band and short range device antennas, Part 1
• Exploring software-defined radio (without the annoying RF) – Part 1

The post ISM bands and frequencies: Comparisons and case studies appeared first on EDN.

The University of Arkansas (U of A) has celebrated a milestone with the topping-out of the Multi-User Silicon Carbide Research and Fabrication Facility...

Aledia S.A of Echirolles, near Grenoble, France (a developer and manufacturer of 3D micro-LEDs for display applications based on its large-area gallium nitride nanowires-on-silicon platform) has announced a series of technical advances that, it claims, set new standards for performance, efficiency and display quality...