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Nvidia CEO Jensen Huang calls Palladium the only appliance more important to him than the refrigerator. At Cadence Design Systems annual event in Santa Clara, California, he also acknowledged that Nvidia has the largest installation of Palladium emulation systems.

Earlier, during a fireside chat, Huang said that Blackwell AI processor would not exist without Palladium. So, what’s Palladium and why is it making waves for large and powerful chip designs? It’s an emulation tool built around Cadence’s custom processors, and it’s used for pre-silicon hardware debugging.

Figure 1 Palladium Z3 and Protium X3 deliver fast pre-silicon verification and validation of the large, complex chip designs. Source: Cadence

At CadenceLive, held on 17 April 2024, the EDA toolmaker unveiled Palladium Z3 alongside Protium X3. “The supercharged Palladium Z3 and Protium X3 are built to deliver fast pre-silicon verification and validation of the largest and most complex devices,” said Dhiraj Goswami, corporate VP of hardware system verification R&D at Cadence.

Palladium Z3, which offers approximately 1.5 times the performance of its predecessor Palladium Z2, can scale from 16 million gates to all the way 48 billion gates. It also features specialized apps for tasks such as 4-state emulation, mixed-signal emulation, safety emulation, and fine-grained power analysis.

Next, the Protium X3 system, built around AMD Epyc processors paired to AMD Versal Premium VP1902 adaptive system-on-chips (SoCs), provides physical prototyping to accelerate bring-up times for pre-silicon software validation of complex, multi-billion gate chip designs. It’s also 1.5 times faster than its predecessor, Protium X2.

Palladium and Protium create a virtual version of a chip to start writing software while waiting for the physical chip to return from the fab. That’s how chip design emulation accelerates time to market. However, though Palladium Z3 and Protium X3 work in tandem, as explained above, they facilitate different types of workloads.

Figure 2 Palladium Z3 and Protium X3 feature a unified compiler and common virtual and physical interfaces. Source: Cadence

Nvidia, which used Palladium Z3 and Protium X3 predecessors in designing just-announced Blackwell AI processors, is already testing these upgraded systems in some of its AI processor designs. “The next-generation Palladium and Protium systems push the boundaries of capacity and performance to help enable a new era of generative AI computing,” said Scot Schultz, senior director for networking at Nvidia.

Today’s large chip designs serving applications like AI and high-performance computing (HPC) increasingly demand emulation solutions that offer higher performance along with faster and more predictable compile debug. New emulation systems such as Palladium fill the need with early software development, hardware-software verification, and debug tasks.

Related Content

• Hardware emulation for everyone
• On-chip debug eases MCU-based design
• Design Compilation in Hardware Emulators
• Maximizing hardware emulation’s value for networking designs

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My Blackmagic Design video cameras are compatible with numerous editing software packages, but the company’s own DaVinci Resolve is a particularly compelling option. For one thing, there’s a close-knit synergy—or at least the natural potential for one—whenever the hardware and software come from the same company. DaVinci Resolve, for example, is able to access the camera’s gyroscope-generated metadata in order to implement post-capture stabilization of video footage; an admittedly inferior alternative to the in-body stabilization (IBIS) offered by competitors’ cameras, which operates during initial footage capture, but better than nothing.

The baseline DaVinci Resolve suite is also completely free, and robustly featured to boot. That said, Blackmagic’s cameras come bundled (at least from the factory…this is something often in-advance stripped out of used units offered for resale) with license keys for the paid DaVinci Resolve Studio variant, which offers some key enhancements for more advanced videography use cases. Each license key allows for two concurrent-use “seats”, and deactivating (at least temporarily) one installation associated with your key and account in order to activate another is straightforward…but it requires a “live” Internet connection to Blackmagic’s server farm, which may not be feasible if you’re “in the field” at the time.

Alternatively, therefore, the company also sells (through its various retail partners) USB activation dongles. Here’s an example, from Sweetwater’s site:

As you can see, they cost the same as a software license key: $295, which is a bit “salty”, both absolutely and relative to “free”. But last May, shortly after buying my two cameras (only one of which came with a key), I came across a claimed “used” one on eBay for just over $100. For the flexibility of two additional concurrent active “seats”, if no other reason, I took the plunge.

When the dongle arrived (from a Vietnam-based seller, it turns out, contrary to the upfront U.S.-sourced claim, and which in retrospect should have been my first warning sign), the packaging was admittedly a bit sketchy:

But the dongle itself looked legit, at least at initial quick glance (as-usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes):

And it was recognized by both MacOS and Windows systems, along with (at least at the time, keep reading) correctly activating DaVinci Resolve Studio installs on both O/Ss:

(keen-eyed readers will notice that I’ve gone ahead and added the Satechi hub to the Mac mini “stack” covered in one of last month’s blog posts, to give me easy front-panel access to various interface and expansion connectors)

More recently, however, I decided to update my various DaVinci Resolve Studio “seats” to latest-version 18.6. Afterwards, my ability to continue activating them via the dongle abruptly ceased. Jumping on Google, I learned that I wasn’t alone in my dismay (not to mention its root cause):

Like some previous releases we also have blocked some dongle key ids that are counterfeit. If you purchased second hand or not from an authorized reseller you may have one of those.

Unsurprisingly, the original seller (whose eBay account is still active as I write these words; note, too, that the seeming same person(s) was/were also selling “used” dongles on Amazon at the same time I bought mine on eBay) hasn’t responded to my outreach. That said, I give eBay plenty of kudos; the rep to whom I reported the issue promptly issued me a future-purchase coupon for the full amount.

But I was still curious to see what else I could find out about this forgery. I’ll probably eventually do a proper teardown, so stay tuned for that, although note that I’m not going to also drop $300 on a legit one for comparison purposes (!!!). For now, I’ll share some screenshots of how the dongle self-identifies to both MacOS:                                           

and Windows:

I’m pretty sure the first time I heard the adage “if it sounds too good to be true, it probably is” was as a child, and came from my parents. Decades later, the wisdom still applies. Caveat emptor, folks! Sound off with your thoughts in the comments.

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

Related Content

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• A deep dive inside a USB flash drive
• Peering inside a multiport USB-C (and Thunderbolt 3?) hub
• Guide for spotting counterfeit Cisco equipment

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Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today expanded its timing solutions portfolio with a new ultra-low 25fs-rms clock solution for wireline infrastructure, data center and industrial applications. The new FemtoClock 3 family includes ultra-low jitter clock generators and jitter attenuators with 8 and 12 outputs, enabling high-performance, easy-to-use, and cost-effective clock tree designs for next-generation, high-speed interconnect systems. Target applications for the new devices include telecom switches and routers, top-or-rack data center switches, medical imaging, broadcast audio & video and more.

FemtoClock 3 devices provide industry leading phase noise and jitter required to meet the needs of 112Gbps SerDes rates, as well as next generation 224Gbps SerDes designs using commonly available 48MHz to 73MHz crystals. The highly integrated devices can generate up to four frequency domains and offer integrated LDOs (Low Drop Out regulators) with superior PSRR, reducing board complexity and cost.

“Renesas leads the industry with best-in-class timing solutions built from decades of experience and patented technology,” said Zaher Baidas, Vice President of the Timing Division for Renesas. “FemtoClock 3 devices extend that leadership by providing multiple clock and synchronization functions in a single device with ultra-low jitter, simplifying printed circuit board design and reducing solution area and cost.”

“FemtoClock 3 was the only timing solution that offered us the ultra-low jitter performance while maintaining low power dissipation and simplifying the PCB design and lowering solution area on our next-generation switches,” said Vincent Ho, CEO at UfiSpace. “We count on Renesas to deliver the timing solutions that enable us to deliver leading-edge products quickly and cost-effectively.”

Key Features of the FemtoClock 3 Family

• Industry-leading 25fs-rms jitter exceeds next-generation 112Gbps and 224Gbps SerDes reference clock requirements
• Up to 4 frequency domains allow all system clocks to be generated from a single device
• Device variants with jitter attenuation, synchronization and clock generation capabilities and with 8 or 12 outputs
• Low power dissipation of 1.2W and operating a single 1.8V supply
• Integrated non-volatile memory allows for device customization in factory at no additional cost to customer
• Small 7 x 7mm 48-pin VFQFPN and 9 x 9mm 64-pin VFQFPN packages
• Compliant with ITU-T G.8262 and G.8262.1 for enhanced synchronous Ethernet
• Single chip with multiple operating modes simplifies overall clock tree

FemtoClock 3 supports multiple operating modes, including synchronization, jitter attenuation, and clock generation. Customers can combine the new FemtoClock 3 solution with the broader ClockMatrix, VersaClock, buffer and oscillator portfolio of timing solutions to address challenging timing needs for their high-performance wireline infrastructure and data center designs.

FemtoClock 3 functions seamlessly in conjunction with the state-of-the-art Renesas IC Toolbox (RICBox) application, empowering users to configure and program devices on the evaluation board. Additionally, RICBox interfaces with the Renesas Lab on the Cloud platform, providing users with the capability to connect virtually to an actual laboratory setting.

Winning Combinations

Renesas has combined FemtoClock 3 with numerous compatible devices from its portfolio to offer Winning Combinations, including the 1600G Fixed Form Factor Switch. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.

Availability

The FemtoClock 3 devices and evaluation boards are available today from Renesas and its distribution partners. For more information, including ordering samples and factory customization, please visit www.renesas.com/femtoclock3.

The post Renesas’ New FemtoClock 3 Timing Solution Delivers Industry’s Lowest Power and Leading Jitter Performance of 25fs-rms appeared first on ELE Times.

• New STM32MP2 MPUs with 64-bit processing and edge AI acceleration
• Built for speed, security, and reliability
• Leverage the STM32 ecosystem for rapid development and secure provisioning

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.

Digital transformation is happening everywhere, driving improvements including greater business productivity, better healthcare, and enhanced safety and energy management throughout buildings, utilities, and transport networks. Critical enabling technologies include cloud computing, data analytics, artificial intelligence (AI), and the Internet of Things (IoT). ST’s new STM32MP2 MPUs will power the next generations of equipment that create the fabric of this evolving digital world. These include industrial controllers and machine-vision systems, scanners, medical wearables, data aggregators, network gateways, smart appliances, and industrial and domestic robots.

“Our embedded MPUs address the trend that’s pushing more workloads and greater demands to smart devices, often deployed at the IoT edge, for faster response and increased efficiency,” said Stephane Henry, General Purpose MPU Division General Manager, STMicroelectronics. “The new STM32MP2 devices we are announcing today extend the performance trajectory, introducing our most powerful processing engine, now adding edge AI, and supported by the STM32 ecosystem to accelerate product development.”

Architected for demanding and time-sensitive workloads, AI inferencing, and communication, and featuring state-of-the-art cyber security, the STM32MP2 MPUs are built to withstand up to 10 years of continuous operation.

State-of-the-art security of the new STM32MP2 devices leverages ST’s proprietary secure hardware, anti-tamper controls, protected firmware, and secure provisioning, working with Arm’s TrustZone architecture, to keep sensitive data and keys secret. Certification to SESIP Level 3, the leading security test methodology for IoT devices and compliance, is ongoing for STM32MP2 MPUs to satisfy forthcoming tougher cyber-protection requirements in key territories worldwide. These include the US CyberTrust mark and stipulations in the EU’s Radio Equipment Directive that are due to become mandatory in 2025.

“Together with ST, we tackled the challenge of connecting our devices to the cloud. From opening locks remotely to granting new access rights, our products are shaping the future of access management,” said Marco Temporiti, R&D Software Manager, ISEO. “Thanks to the STM32MP2 microprocessor with its strong encryption capabilities, we are able to build an industrial-grade gateway with unmatched reliability and security. The seamless integration with Yocto Linux has streamlined our development process, allowing us to innovate with ease. And, ST’s 10-year longevity program also ensures a long product lifecycle at reduced cost, setting a new standard in the industry.”

“We worked with ST to build a 2-channel network audio adapter, leveraging the STM32MP1 series microprocessors to handle tasks like converting network digital audio signals for transmission and reception. The robust processing power, Ethernet connectivity and adaptable audio output interfaces were key considerations in choosing the STM32MP1 series for integration into our products,” said Yue XIONG, CEO, S-TRACK. “Now, we’re enthusiastic about the possibilities presented by ST’s latest MPUs, particularly the STM32MP2 series, which deliver improved power efficiency, enabling us to minimize cooling requirements in our enclosed casings. Additionally, the integrated Cortex-M co-processor eliminates the need for a separate microcontroller, and support for Gigabit Ethernet with precision time protocol (PTP) enables accurate data transfer and synchronization among devices. With this advanced technology, our goal is to broaden our product range to include 16-channel offerings.”

The first STM32MP2 MPUs are scheduled to enter volume production in June 2024. Sample requests and pricing information are available from local ST sales offices.

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Printed Circuit Board Assembly (PCBA) is a pivotal process in electronics manufacturing, facilitating the creation of fully functional circuit boards essential for various electronic devices. Understanding the nuances of PCBA, including its types, manufacturing process, and applications, is crucial for professionals in the electronics industry and enthusiasts alike. Let’s explore the complete details about it!

Types of PCBA Technologies:

PCBA employs two primary technologies: Surface-Mount Technology (SMT) and Through-Hole Technology (THT). SMT mounts components directly onto the surface, ideal for small and sensitive components, optimizing space utilization and production efficiency. THT, an earlier method, involves inserting components through holes in the PCB, which is suitable for more significant components requiring robust bonding.

Steps in Manufacturing Process:

Its manufacturing process comprises several critical steps:

• Solder Paste Stenciling: Solder paste Application onto designated PCB areas. 
• Pick and Place: Precise positioning of electronic components and Surface Mount Devices (SMDs). 
• Reflow Soldering: Heating the board to melt solder paste, securing components upon cooling. 
• Inspection and Quality Control: Thorough examination to ensure proper component attachment. 
• Insertion of Through-Hole Components: Add PTH components if required. 
• Manual and Wave Soldering: Manual or automated soldering methods for PTH components. 
• Testing and Final Inspection: Functional testing to detect any performance issues.

Uses and Applications of PCBA:

PCBA finds extensive applications across various industries:

• Consumer Electronics: Essential for smartphones, tablets, TVs, and home appliances, enabling compact designs and advanced features. 
• Computing and Networking: Vital components in computers, servers, routers, and switches for data processing and connectivity. 
• Automotive Industry: Integral to vehicle electronics for navigation, infotainment, safety, and electrification. 
• Industrial Applications: Utilized in machinery control systems, robotics, and automation technology for industrial processes. 
• Medical Devices: At the forefront of wearable health monitors, diagnostic imaging equipment, and medical technology, ensuring reliability and precision.

Advanced Technologies:

Technology upgrades always roll out new challenges and opportunities for PCB assembly, resulting in a bumpy but steady road of innovation and productivity. One of the current trends is 3D packaging and System-in-Package (SiP), which are examples of the new wave of APT. APT contains a wide range of functions from one package, which diminishes their size, improves operations extent, or is effective with changing ambient temperatures.

Besides that, the development of embedded component packaging (ECP) facilitates putting passive components into the PCB substrate, which not only helps reduce the use of the board but also provides the circuit with improved operation. Similarly, advanced technologies such as PCBA are also very capable of providing solutions for low-size, high-speed, and high-density designs that fit the modern requirements of the electronics industry.

Automation and Robotics:

Automation and robotics dramatically help the PCBA procedure speed up successfully and render more productivity, precision, and repeatability. With the automated pick-and-place machines that exactly position all parts of the PCB on the pallet, the time required to assemble the motherboards is significantly decreased and human errors are greatly eliminated.

Incorporating robot arms with soldering facilities allows for accurate and uniform soldering joints, consequently improving the product’s overall reliability. Furthermore, there is Automatic Optical Inspection (AOI) to identify defects and anomalies; therefore, quality control is achieved, and rework is minimized. Automation and robotics can speed up the PCBA process as well as make products of high quality with their significant role in the field of modern electronics manufacturing.

Challenges and Solutions in PCBA:

However, PCBA’s merits are often shadowed by several complex production-line issues. One of the main problems that the scaling down of parts presents is their manipulation and arrangement; thus, a higher level of devices must be used, and advanced technologies must be applied to reach precision. Matching the electrical and mechanical specifications of the components with the PCB material is of utmost importance to avoid solder joint breaking and warping of the board.

Significantly higher complexity in the designs also brings through the testing and inspection procedures to find any defects, and it has to be product reliability. However, even though these problems seem unsolvable at this moment, the possibilities offered by automated equipment, material science, and improved testing methods hold the key to finding the solution.

Future Trends:

The growth of IoT gadgets and wearable technology are the niche areas that will increase the need for smaller, more efficient PCBAS with high connectivity. In additive manufacturing, which includes 3D printing, the process allows for fast prototyping and individual designs with the aid of PCB.

Additionally, it will help gain an advantage as a result of introducing AI and ML algorithms in PCBA processes, which will enhance production efficiency and ensure predictive maintenance and quality control. The trend of sustainable manufacturing practices, consisting of utilizing materials and eco-processes, is increasing and more customer-demanding and regulatory-based.

Conclusion

PCBA is a multifaceted process crucial for developing electronic devices across diverse industries. PCBA enables innovation, functionality, and reliability in consumer electronics, automotive, and medical applications. Understanding the intricacies of PCBA is essential for professionals involved in electronics manufacturing, contributing to the advancement of technology and the development of cutting-edge products.

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Infineon Technologies AG supplies its power semiconductor devices to FOXESS, a fast-growing leader in the green energy industry and a manufacturer of inverters and energy storage systems. The two sides aim at promoting the development of green energy. Infineon will provide FOXESS with its CoolSiC MOSFETs 1200 V, which will be used with EiceDRIVER gate drivers for industrial energy storage applications. At the same time, FOXESS’ string PV inverters will use Infineon’s IGBT7 H7 1200 V power semiconductor devices.

The global market for photovoltaic energy storage systems (PV-ES) has grown at a high speed in the last years. As competition in the PV-ES market accelerates, improving power density has become key to success, and how to improve efficiency and power density for energy storage applications has attracted much attention. Infineon’s CoolSiC MOSFET 1200 V and IGBT7 H7 1200 V series power semiconductor devices adopt the latest semiconductor technologies and design concepts that are tailored to industrial applications.

Mr. Yu Daihui, Senior Vice President and Head of Industrial & Infrastructure of Infineon Technologies Greater China said, “As an industry leader in power semiconductors, we are proud to work closely with FOXESS. We will continue to drive decarbonization by enabling higher power density and more reliable systems for PV-ES applications.”

Mr. Zhu Jingcheng, Chairman of FOXESS, said, “Thanks to the support of Infineon’s advanced components, FOXESS’ products have been significantly improved in terms of reliability and efficiency. This has been an important driving force for FOXESS’ growth. Infineon’s technical support and product quality have not only strengthened our competitiveness, but also expanded our presence in the market. We are confident about the future and look forward to further cooperation with Infineon to jointly promote the development of the industry and create greater value for our customers.”

With a high power density, Infineon’s CoolSiC MOSFETs 1200 V can reduce losses by 50 percent and provide ~2 percent additional energy without increasing the battery size, which is especially beneficial for high-performance, lightweight, and compact energy storage solutions. FOXESS’ H3PRO 15 kW-30 kW energy storage series uses Infineon’s CoolSiC MOSFETs 1200 V for all models. Thanks to Infineon’s excellent performance, the H3PRO series has achieved an efficiency of up to 98.1 percent and excellent EMC performance; with superior performance and reliability, the H3PRO series has seen rapid sales growth in the global market.

Infineon’s TRENCHSTOP IGBT7 H7 650 V / 1200 V series has lower losses and helps improve the overall efficiency and power density of inverters. In high-power inverter projects, high-current mold packaged discrete devices with current handling capability above 100 A can reduce the number of IGBTs in parallel and replace the IGBT module solution, further improving system reliability and reducing costs; in addition, the H7 series has become an industry benchmark for its high-quality performance and greater resistance to humidity. At present, FOXESS’ main industrial and commercial model, the R Series 75-110 kW, redefines the overall design of the 100 kW model by using IGBT7 H7 series discretes, and the efficiency of the whole machine can reach up to 98.6 percent. Thanks to the low power loss and high power density of the IGBT7 H7 series in discrete packages, technical problems such as current sharing in the paralleling process can be simplified and optimized.

Every power device needs a driver, and the right driver can make the design a lot easier. Infineon offers more than 500 EiceDRIVER gate drivers with typical output currents of 0.1 A~18 A and comprehensive protection functions including fast short-circuit protection (DESAT), active Miller clamp, shoot-through protection, fault reporting, shutdown, and overcurrent protection, suitable for all power devices including CoolSiC and IGBTs.

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Microchip introduces configurable family of companion driver boards using its Hybrid Power Drive modules available in silicon carbide (SiC) or silicon (Si) technology

The aviation industry’s requirements for the latest, most efficient and lowest-emission aircraft is propelled by an overarching goal towards sustainability and decarbonization. To satisfy these goals, aviation power systems developers are transitioning to electric actuation systems as the trend towards More Electric Aircraft (MEA) continues to grow. To provide the aviation industry with a comprehensive electric actuation solution, Microchip Technology (Nasdaq: MCHP) today announces a new integrated actuation power solution that combines companion gate driver boards with our expansive Hybrid Power Drive (HPD) modules in silicon carbide or silicon technology with a power range of 5 kVA to 20 kVA.

The new integrated actuation power solution maintains the same footprint regardless of the power output. The companion gate driver boards are designed to be integrated with Microchip’s HPD modules to provide an all-in-one motor drive solution for the electrification of systems such as flight controls, braking and landing gear. Microchip’s power solutions are designed to scale based on the requirements of the end application, from smaller actuation systems for drones to high-power actuation systems for Electric Vertical Take-Off and Landing (eVTOL) aircraft, MEA and all-electric aircraft.

“We developed the companion gate driver boards to be used with our existing HPD modules to bring to market a plug-and-play power solution for MEA,” said Leon Gross, vice president of Microchip’s discrete product group. “With this solution, customers no longer need to design and develop their own drive circuitry, which can reduce design time, resources and cost.”

These high-reliability devices are tested to conditions outlined in DO-160, “Environmental Conditions and Test Procedures for Airborne Equipment.” There are multiple protection features including shoot-through detection, short circuit protection, desaturation protection, Under Voltage Lock Out (UVLO) and active miller clamping.

The gate driver boards are designed to be driven with external PWM signals based on Low Voltage Differential Signaling (LVDS) compliant with TIA/EIA-644 for low Electromagnetic Interference (EMI) and good noise immunity. The gate driver board provides differential outputs for telemetry signals like DC bus current, phase current and solenoid current by taking feedback from shunts present in the HPD module and DC bus voltage. It also provides direct output of two PT1000 temperature sensors available in the HPD power module.

The companion gate driver boards are low-weight, low-profile and compact solutions to optimize size and power efficiency of actuation systems. The gate drivers are designed to operate throughout the temperature range of −55°C to +110°C, which is critical for aviation applications that are often exposed to harsh environments.

The isolated companion gate driver boards only require a single 15V DC input for the control and drive circuit; all additional voltages needed are generated on the card. This significantly reduces the number of system components and simplifies system cabling.

Microchip provides comprehensive solutions for MEA by integrating power products with FPGAs, microcontrollers, security, memory and timing. Microchip’s solutions are designed to help customers speed up their development, reduce costs and get to market faster.

The companion gate driver boards are supported with detailed data sheets and device models.

The companion gate driver boards and accompanying HPD modules are available in production quantities. For additional information, contact a Microchip sales representative.

High-res images available through Flickr or editorial contact (feel free to publish):

• Application image: http://www.flickr.com/photos/microchiptechnology/53415024168/sizes/l

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SMD Devices Provide High Luminous Intensity to 2300 mcd, Offer Wavelengths of 525 nm and 465 nm for Heart Rate Monitoring and Smoke Detection

Vishay Intertechnology, Inc. (NYSE: VSH) today introduced new blue and true green surface-mount LEDs in the ultra compact MiniLED package. Measuring 2.2 mm by 1.3 mm by 1.4 mm, the Vishay Semiconductors VLMB2332T1U2-08 and VLMTG2332ABCA-08 utilize the latest ultrabright InGaN chip technology to achieve typical luminous intensity of 440 mcd and 2300 mcd, respectively, which is up to four times higher than previous-generation solutions in PLCC-2 packages.

With their high brightness and small size, the LEDs released today are the perfect choice for small scale, high power products that are expected to work reliably in arduous environments. Typical applications will include medical light treatment; signal lights for agricultural equipment and energy generation systems; indicators and backlighting for office, entertainment, and telecommunications equipment; LCD switches; and symbols for general use.

In addition, with a typical wavelength of 525 nm at 20 mA, the VLMTG2332ABCA-08 is ideal for heart rate monitoring applications in fitness trackers and other devices that rely on variations in green light absorption. Offering a typical wavelength of 465 nm at 20 mA, the VLMB2332T1U2-08 is optimized for smoke detectors that utilize short wavelength blue light for the detection of small particles.

The LEDs’ MiniLED package features a lead-frame embedded in a white thermoplast. The devices offer a ± 60° angle of half-intensity, a wide viewing angle of 120° for homogenous illumination and backlighting, and forward voltage of 2.9 V typical. The VLMB2332T1U2-08 and VLMTG2332ABCA-08 are categorized, per packaging unit, for luminous intensity and color.

RoHS-compliant, halogen-free, and Vishay Green, the LEDs are available in 8 mm tape, offer an ESD-withstand voltage up to 2 kV in accordance with JESD22-A114-B, and are compatible with preconditioning according to JEDEC Level 2a, IR reflow soldering according to J-STD-020, and automatic placement equipment.

Device Specification Table: 

Samples and production quantities of the VLMB2332T1U2-08 and VLMTG2332ABCA-08 are available now, with lead times of 12 weeks.

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Microchip has combined gate driver boards with its Hybrid Power Drive (HPD) modules to ease the aviation industry’s transition to electric actuation systems. Configured with silicon or silicon carbide switches, the HPD modules cover a range of 5 kVA to 20 kVA and maintain the same footprint regardless of the power output.

These integrated actuation power bundles provide a plug-and-play motor drive solution for the electrification of such systems as flight controls, braking, and landing gear. Power components are designed to scale based on application requirements. They can be used to create actuation systems for drones, small planes, electric vertical take-off and landing aircraft, More Electric Aircraft (MEA), and all-electric aircraft.

Gate driver boards are driven with external PWM signals. They provide differential outputs for telemetry signals like DC bus current, phase current, and solenoid current by taking feedback from shunts in the HPD modules and DC bus voltage. The isolated boards operate over a temperature range of -55°C to +110°C and require a single 15-VDC input for the control and drive circuit. Additional required voltages can be generated on the card.

The gate driver boards and accompanying HPD modules are available now in production quantities. To learn more about these integrated actuation power components, click here.

Microchip Technology 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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The AOZ1377DI current-limiting switch from Alpha & Omega improves USB-C safety by providing a maximum load current of 7 A at up to 23 V. In addition to programmable current limiting, the switch offers true reverse current blocking, which prevents unwanted reverse current from flowing from VOUT to VIN.

Useful for both sink and source applications, the AOZ13771DI has an input operating voltage range of 3.4 V to 23 V. Both VIN and VOUT terminals are rated at an absolute maximum of 28 V. Integrated back-to-back N-channel MOSFETs provide a typical on-resistance of 19 mΩ and a high safe operating area. In addition, an internal soft-start circuit controls inrush current from high capacitive loads, and an external capacitor can adjust the slew rate.

The protection switch comes in two variants. The AOZ1377DI-01 automatically restarts once fault conditions are cleared. The AOZ1377DI-02 latches the power switch off, and the enable-input pin must be reset to restart the device.

The AOZ1377DI-01 and AOZ1377DI-02 switches cost $1.356 in lots of 1000 units. They are available in production quantities with a lead time of 16 weeks

AOZ1377DI datasheet

Alpha & Omega Semiconductor 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Microcontrollers in the GD32F5 series from GigaDevice are equipped with 7.5 Mbytes of on-chip flash and 1 Mbyte of SRAM, both supporting ECC verification. Up to 2 Mbytes of code flash can be configured for zero-wait-state operation, improving processing speed and efficiency. A maximum of 2 Mbytes of memory is also available for read-while-write OTA updating. Additionally, the MCUs accommodate a variety of external memories.

The GD32F5 series of MCUs is based on an Arm Cortex-M33 processor. This 32-bit core operates at up to 200 MHz and delivers a performance rating of 3.31 CoreMark/MHz. An integrated 12-bit successive approximation ADC module can sample analog signals from 16 external channels and 2 internal channels, plus the battery voltage channel. MCUs also feature two DACs and multiple timers. Connectivity resources include UART/USART, I2C, SPI, I2S, SDIO, USB, CAN-FD, and Ethernet.

A set of built-in system security features offers protection for both firmware and device private data, as well as service execution assurance. The general-purpose MCUs operate with a supply voltage of 1.71 V to 3.6 V and have 5-V tolerant I/Os. The lineup comprises 10 variants in a choice of packages, including BGA and LQFP.

GD32F5 series product page 

GigaDevice

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