Новини світу мікро- та наноелектроніки

This is my ongoing build that is working now after i put a lm317/lm337 regulator in it untill i figure out how to build a series pass regulator. Going to add filters on the dc side aswell. Softstart/emi filter/transformer/rectifier, 15000uF + 10000uF + 5630uF with capacitance multiplier and ifcourse the regulator. submitted by /u/Whyjustwhydothat [link] [comments]

I had to stop sorting at this point. My tweezer fingers started to hurt. submitted by /u/Ryzen-Sunn [link] [comments]

Photonic simulation CAD software developer Photon Design Ltd of Oxford, UK has updated its PICWave photonic integrated circuit (PIC) design and simulation tool with an intuitive new graphic user interface (GUI) and an enhanced feature set...

Polyn Technology Ltd. announces the successful manufacturing and testing of its first silicon-implementation of its neuromorphic analog signal processing (NASP) technology. It includes the validation of both the NASP technology and design tools, which automatically convert trained digital neural network models into ultra-low-power analog neuromorphic cores ready for manufacturing in standard CMOS processes. The first product chip features an analog neuromorphic core of a voice activity detection (VAD) neural network model.

(Source: Polyn Technology Ltd.)

This platform uses trained neural networks in the analog domain to perform AI inference with much lower power consumption than conventional digital neural processors, according to the company. Application-specific NASP chips can be designed for a range of edge AI applications, including audio, vibration, wearable, robotics, industrial, and automotive sensing.

This is the first time that Polyn generated an asynchronous, fully analog neural-network core implementation in silicon directly from a digital model. This opens up a “new design paradigm— neural computation in the analog domain, with digital-class accuracy and microwatt-level energy use,” said Aleksandr Timofeev, Polyn’s CEO and founder, in a statement.

Targeting always-on edge devices, the NASP chips with AI cores process sensor signals in their native analog form in microseconds, using microwatt-level power, which eliminates all overhead associated with digital operations, Polyn explained.

Recommended Neuromorphic analog signal processor aids TinyML

The first neuromorphic analog processor contains a VAD core for real-time voice activity detection and offers fully asynchronous operation. Key specs of this NASP VAD chip include ultra-low-power consumption of about 34 µW during continuous operation and ultra-low latency at 50 microseconds per inference.

In addition to the VAD core, Polyn plans to develop other cores for speaker recognition and voice extraction, targeting home appliances, communications headsets, and other voice-controlled devices.

In April 2022, the company announced its first NASP test chip, implemented in 55-nm CMOS technology, demonstrating the technology’s brain-mimicking architecture. This was followed in October 2022 with the introduction of the NeuroVoice tiny AI chip, delivering on-chip voice extraction from any noisy background. In 2023, Polyn introduced VibroSense, a Tiny AI chip solution for vibration monitoring sensor nodes. (Polyn was ranked as an EE Times Silicon 100 company to watch in 2025.)

Customers who are developing products with ultra-low-power voice control can apply online for the NASP VAD chip evaluation kit. Polyn will demonstrate its first NASP chips, available for ordering, at CES 2026 in Las Vegas, Nevada, January 6-9, in Hall G, Booth #61701. A limited selection will be showcased at CES Unveiled Europe in Amsterdam, October 28, Booth HB143.

The post Polyn delivers silicon-implementation of its NASP chip appeared first on EDN.

Printed-circuit boards (PCBs) are an integral part of most electronic devices today, and as PCBs become smaller, electronics engineers must remain aware of the tiny defects that can affect how these components function, especially when they involve high-frequency signals. Surface roughness may seem minor, but it can significantly affect PCB performance, including impedance and signal transmission. What should electronics engineers know about it, and how can they minimize this issue?

Path length

Rough PCB surfaces increase the signal’s path length. This is due to the skin effect, which occurs because high-frequency electrical signals are more likely to flow along a conductor’s outer surface instead of through its core. A longer path length can also increase resistance and cause energy loss.

(Source: Adobe Stock)

Engineers can reduce these issues by choosing the appropriate surface finishes for different PCB parts. Immersion silver is a good choice for balancing performance and affordability, although it must be handled carefully to prevent tarnishing.

Electroless nickel immersion gold offers a flat and smooth surface with a gold layer that promotes excellent solderability and conductivity and a nickel layer that offers oxidation protection. This surface finish minimizes signal distortion, making it a popular option for microwave and radio-frequency applications.

Although immersion tin features a smooth surface, it has lower corrosion resistance than other options, making it less frequently selected for high-frequency PCBs. Because hard gold has good conductivity and resists wear, engineers often use it in high-frequency applications, such as on contact points and connectors. This approach minimizes signal loss and increases overall durability.

If you plan to outsource finishing or other manufacturing steps to a specialty provider, consider choosing one with extensive experience and the equipment and expertise needed for your PCB design.

For example, in 2024, PCB company OKI Circuit Technology created an ultra-high, multilayer PCB line. This expansion boosted its capacity potential by approximately 1.4× while also helping the company cater to customers with smaller orders. The company has also invested in numerous enhancements that increase its precision and equip it to meet the needs of next-generation communications, robotics, and semiconductors.

Signal integrity

Rough surfaces compromise signal integrity and can cause parasitic capacitance. This issue can also increase crosstalk if it results in uneven electromagnetic field distribution. Smoother surfaces enable faster signal speeds while preventing distortion and delays.

Because surface roughness is one of many factors that can interfere with signal integrity, electronics engineers should scrutinize all design aspects to find other potential culprits. Some companies offer specialized tools to make the task easier.

One provider sells software that uses artificial intelligence to assess proposed designs. Users can also check trace path routing by studying cross-sectional diagrams that show various layers, identifying potential issues more quickly.

Component placement and PCB layout configurations can affect signal integrity, so designers should consider those aspects before assuming rough surfaces have degraded performance. Digital twins and similar tools allow engineers and product designers to experiment with various layouts before committing to a final PCB layout. Keeping a log of all design changes also allows engineers to revert to previous iterations if newer versions worsen signal integrity.

If companies notice ongoing signal integrity problems or other challenges, examining the individual industrial processes may highlight the causes. This usually starts with data collection because the information provides a baseline. Once companies begin tracking trends, they can discover the most effective ways to tighten quality control and meet other goals that improve PCB performance.

Tailored assistance

If electronics engineers conclude that rough surfaces are among the primary contributors to signal issues in their high-frequency PCBs, they can then address the problem by partnering with third-party providers that understand the complexities of finishing small parts. These companies can detail the various finish types available and provide pricing and lead times, depending on the unit order of PCBs.

Companies that need PCB finishing for prototypes or small production runs may request manual processes. Skilled technicians use tools and magnification on parts with complex geometries or other characteristics that make them unsuitable for mechanical methods.

Controlled combustion, electrolytic action, and vibratory containers are some of the other options for finishing small parts through non-manual means. Specialist finishers can examine the PCB designs and recommend the best strategies to achieve consistent smoothness with maximum efficiency.

Because many manufacturers have high-volume finishing needs, some startups have emerged to fill the need while supporting producers’ automation efforts. Augmentus is one example, focusing on physical AI to scale automated surface finishing for high-mix environments. The company has built a fully autonomous system for today’s factory floors. In July 2025, the company secured $11 million in a Series A+ funding round to scale for high-mix, complex robotic surface finishing and welding.

Augmentus views surface finishing as one of the most challenging problems in automation, but the company believes its technology will break new ground. Although it is too early to know how this option and others like it may change PCB production, automated processes could offer better repeatability, making surface roughness less problematic.

Ongoing awareness

Because surface roughness can negatively affect high-frequency PCB signals, engineers should explore numerous ways to address it effectively. Considering this issue early in the design process and selecting appropriate finishes are proactive steps for strengthening component quality control.

About the author

Emily Newton is a technical writer and the editor-in-chief of Revolutionized. She enjoys researching and writing about how technology is changing the industrial sector.

The post Are rough surfaces on PCBs impacting high-frequency signals? appeared first on EDN.

Not my first time doing this but my second and for some reason the first tike was successful and this wasnt😂😂 submitted by /u/vIp_bLACK444 [link] [comments]

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has received multiple orders for its advanced wet processing and lithography systems from a leading specialist foundry. The systems will be deployed for advanced packaging and silicon photonics applications, supporting critical end markets including AI, automotive, aerospace & defense, and communications. Scheduled deliveries for the most recent orders will start in first-quarter 2026...

Skyworks Solutions Inc of Irvine, CA, USA (which manufactures analog and mixed-signal semiconductors) and Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) have agreed to merge in a cash-and-stock transaction that values the combined enterprise at about $22bn, creating a US-based supplier of high-performance RF, analog and mixed-signal semiconductors...

The ovens in this two-part Design Idea (DI) can’t even warm that leftover half-slice of pizza, let alone cook dinner, but they can keep critical components at a constant temperature. In the first part, we’ll look at a purely analog approach, saving something PWM-based for the second.

Perhaps you want to build a really wide-range LF oscillator with a logarithmic sweep, using no more than a resistor, an op-amp, and a diode for the log element. That diode needs to be held at a constant temperature for accuracy and stability: it needs ovening (if there is such a verb).

Wow the engineering world with your unique design: Design Ideas Submission Guide

I made such a device some years ago, and was reminded of it when spotting how a bead thermistor fitted rather nicely into the hole in a TO-220’s tab. (Cluttered workbenches can sometimes trigger interesting cross-fertilizations.) Now, can we turn that tab into a useful temperature-stabilized hotplate, suitable for mounting heat-sensitive components on? Ground rules: aim at a rather arbitrary 50°C, make the circuitry as simple as possible, use a 5-V supply, and keep the consumption low.

This is a practical exploration of how to use a transistor, a thermistor, and as little else as possible to get the job done. It lacks the elegance and sophistication of designs that use a transistor as both a sensor and a source of heat, but it is simpler.

Figure 1 shows the schematic of a simple version needing only a 2-wire connection, along with two photos indicating its construction. It was slimmed down from a more complex but less successful initial idea, which we’ll look at later.

Figure 1 A simple oven circuit, heated by both R2 and Q2. The NTC thermistor Th1 provides feedback, the set point being determined by R1. Note how critical components are thermally tied together as they are all built onto the TO-220 package, as shown in the photos. Also note the fine lead wires to reduce heat loss once the assembly is heat-insulated.

Both R2 and Q2 can contribute to heating. On a cold start (literally) Th1’s resistance is high so that the Darlington pair Q1 and Q2 has enough base voltage to saturate it, with (most of) the rail voltage across R2. As the assembly heats up, Th1’s resistance drops, reducing the drive to Q1/2. The rail now appears across both R2 and Q2, with the latter taking over as the main, though now reduced, source of heat. This gives a degree of proportional control, reducing the drive as the set-point is approached. That base drive depends not only on the ratio of R2 to Th1 but also on Q1/2’s effective VBE, which needs to be temperature-stabilized—as indeed it is. Consumption varies from ~90 mA when cold to ~30 mA when stable.

Setting and measuring the temperature

R1 sets the stabilization temperature, the target being 50°C. Experimentally, 12k worked best, giving a stable hotplate temperature of 49.6°C for an ambient of 19.5°C. Cooling the surroundings to -0.5°C left the hotplate at 48.8°C, so that the hotplate temperature falls by 0.04°C for each degree drop outside. Better thermal insulation would have reduced that.

The measuring probe was a 10k thermistor equipped with fine wires and stuck to the hotplate with thermal paste, the module being wrapped in ~12 mm of foam—and we’ll come back to that. Thermal paste and heat shrink could have been used for the main assembly but dabs of epoxy worked well and kept the hotplate surface flat. Metal-loaded, high-temperature epoxy conducts heat several times better than the plain-vanilla variety while still being an electrical insulator, though that may make little difference given reasonable physical contact.

Other resistors and transistors

R2 is fairly critical. A higher value than 47R heats up slower than is necessary, while a lower one does so too fast, leading to the temperature overshooting because of the limited proportional control. Experiments showed that 47R was close to optimal, with minimal overshoot and thus the fastest stabilization time. The hotplate temperature settles to within a degree in around two minutes and is almost spot-on after three minutes.

Neither Q1 nor Q2 is critical, but the E-line package of a ZTX300 (for example) fits better than a TO-92 would. But why not use an integrated Darlington like the TIP122? Alas, such devices incorporate base–emitter resistors, nominally 10k and 150R, which load Th1 unpredictably. Trying one picked at random showed that R1 needed to be ~7k8 for a set-point of 50°C.

Similarly, this also works with Q1/2 replaced by a MOSFET, with R1’s value now depending on the gate threshold; 3k9 was close for a BUK553. BJTs are far more predictable: build this as drawn, and it should be within a degree, with Q1/2’s VBE settling at ~1.18 V; use a random MOSFET, and it could be anywhere.

Access all areas

The next variant, shown in Figure 2, is electrically similar but provides access to useful circuit nodes to help monitor its performance. It was also easier to experiment with.

Figure 2 While electrically the same as Figure 1, this brings out most circuit nodes to help with experimentation and monitoring, including the LEDs on “pin 3”.

Now we can see what we’re doing! The LEDs give a simple status indication, the green one lighting when it’s close to the set-point rather than fully stable. Figure 3 shows the effect, along with traces for Q1/2’s Vcc—allowing us to read the current in the transistors and R2—and the hotplate temperature. The latter is accurate, but the voltage and current scales are less so because they assume a precise 5-V supply and a 50-Ω load rather than the measured 4.94 V and 47Ω plus stray resistance. This module stabilized at ~50.6°C.

Figure 3  Measurements taken from Figure 2’s circuit for about three minutes after a cold start.

So much for the basic circuit. Now, it needs thermal insulation to keep the heat in, a block of foam being the obvious choice. But foams have widely differing thermal conductivities. Expanded polystyrene or polyethylene will work, but the foamed polyisocyanurate or similar used for wall insulation panels is around twice as good—and offcuts are often freely available from builders’ skips/dumpsters! Figure 4 shows the module from Figure 2 mounted on/in a block of it, with at least 10 mm of foam around any part of the circuit module.

Wikipedia has an illuminating plot of the thermal conductivities of many materials, including our foams and epoxies. The article of which it is a part has a lot of useful background, too.

Figure 4 The module from Figure 2 mounted on a block of foam. The intermediate connecting wires are meandered across its surface to minimize heat loss. Note the diode, typical of a component needing stabilization, stuck to the hotplate, ready for its new connections to be treated similarly.

The fine lead wires—0.15 mm diameter, as used with wiring pencils—are meandered over the surface to lengthen the thermal paths. Copper has a thermal conductivity some 19,000 times greater than the foam: 384 W/m·K vs ~0.02 W/m·K. In very crude terms, for a given thermal path length and temperature gradient, a single, short 0.11-mm-diameter copper wire will leak heat at about the same rate as the entire surface area of our foam block (~6000 mm2). Ironically, perfect insulation would be bad, as the innards could never cool to recover from an overshoot. This build took 620 seconds to cool by 63% of the way to ambient.

Hot stuff

Disconnecting Th1 in Figure 2’s circuit let the module heat up to the max while still allowing monitoring—or would have done, had I not chickened out when its resistance dropped to 720 Ω, for just over 100°C. (The epoxy was rated to 110°C.) That was with the full insulation; in free air, it struggled to reach 70°C—the rating for other components.

One subtle problem is the inevitable mismatch between the sensing thermistor and the target device, as analyzed in a Stephen Woodward DI, which also implies that the position of the target on the hotplate will affect its actual temperature. We’ll ignore that for the moment, because we’re more interested in constancy than precision, but will return to it in Part 2.

Finishing at the starting point

The foregoing circuits were actually simplifications of my starting point, which is shown in Figure 5. When the temperature is stable at ~50°C, point A is at half-rail. R3 is chosen so that U1’s output will turn Q1/2 on just enough to maintain that. However, while the extra gain improves the temperature regulation, it also causes some overshoot. R3 or R2 must be trimmed to set the temperature: fiddly, and not really designable. R3 was calculated at 4k12 but needed ~5k6 in reality. That’s why I gave up on this approach.

Figure 5 The original circuit that suffered from overshoot. The LEDs give a too-high/too-low temperature indication.

The long-tailed pair of Darlingtons (Q3, Q4) sense the difference between the thermistor voltage—half the rail when stable, as noted—and a half-rail reference, so that the red LED will be on when the temperature is low, the green one lighting while it’s high, with both on at the stable point. Full-red to full-green takes ~300 mV differential, or ~±3°C. This works but gives no better indication than the LEDs in Figure 2. (The low-power Darlingtons used seem to omit those extra, internal resistors. Q1/2 could now be replaced by that TIP122, as it’s driven by a low-impedance source. R4 is purely to protect against current surges.)

Figure 6 plots its performance when starting from cold, showing the overshoot and recovery. Compare this with Figure 3.

Figure 6 The start-up performance of Figure 5’s circuit.

If I were building something similar in any quantity, I wouldn’t do it like this: SMDs and a flexible circuit would be much cleaner. For example, a 2512 power resistor for R2 (or R5 in Figure 5), pressed flat, with some insulation, against the power transistor’s tab would probably be ideal.

In Part 2, we’ll see how even a simple PWM-based circuit can give better proportional control and hence generally better performance. The bad news: we may eventually abandon the TO-220 tab in favor of another way of assembling our hotplate.

Related Content

• Fixing a fundamental flaw of self-sensing transistor thermostats
• Self-heated ∆Vbe transistor thermostat needs no calibration
• Take-back-half thermostat uses ∆Vbe transistor sensor
• Dropping a PRTD into a thermistor slot—impossible?

The post 5-V ovens (some assembly required)—part 1 appeared first on EDN.

Announced today, the platform includes displays, drive electronics, software and custom integration engineering services.

In a significant effort to enhance India’s electronics ecosystem, the Union Government has cleared investment of ₹5,532 crore for seven projects under the Electronics Components Manufacturing Scheme (ECMS). The initiative is to further India’s transition from assembling imported components to manufacturing core electronic materials and parts within the country.

Union Electronics and IT Minister Ashwini Vaishnaw announced that the projects are a “transformational step” towards developing a self-reliant and innovation-led electronics manufacturing ecosystem.

The projects cleared recently distributed across Tamil Nadu (5 units), Andhra Pradesh (1 unit), and Madhya Pradesh (1 unit) will create over ₹36,000 crore worth of component production and generate over 5,000 direct employment opportunities.

The ECMS will facilitate local manufacturing of key components like Multi-Layer and HDI PCBs, Camera Modules, Copper Clad Laminates (CCL), and Polypropylene Films. These components form the backbone of thousands of diverse products, ranging from smartphones and electric vehicles to medical devices and defence technology.

The cleared projects will satisfy some 20% of India’s domestic demand for PCBs and 15% of its camera module needs, while the production of CCLs will be entirely localized, with 60% of the output being export-focused.

The ECMS initiative has drawn a strong response from industry players, with 249 applications already submitted, signaling robust interest in the program. Combined, they amount to potential investments of ₹1.15 lakh crore, production value of ₹10.34 lakh crore, and 1.42 lakh job opportunities the largest-ever pledge in India’s electronics industry.

The program is likely to sharply reduce import dependence, improve supply chain resilience, and attract high-skill employment in manufacturing and R&D. The components produced under ECMS will help feed key industries like defence, telecommunication, renewable energy, and electric vehicles.

Vaishnaw highlighted that ECMS synergizes with flagships such as the Production Linked Incentive (PLI) scheme and the India Semiconductor Mission (ISM).

“India is transforming from being an assembling country to a product country designing, producing, and exporting sophisticated electronic gear. ECMS fills the critical gap between devices and components and manufacturing and innovation,” he added.

With this approval, India makes another decisive step towards becoming a world electronics manufacturing hub, driven by indigenous innovation, large-scale investment, and increasing self-reliance.

The post Centre Clears ₹5,532 Crore Investment for Seven Electronics Manufacturing Projects appeared first on ELE Times.

Nuvoton Technology has launched its latest generation AI microcontroller, the NuMicro M55M1, specifically designed for edge applications such as AI data recognition and intelligent audio. Positioned as a rare entry-level AI solution in the market, the M55M1 integrates an NPU delivering up to 110 GOPS of AI computing power, providing over 100 times the inference performance compared to traditional 1GHz MCUs. Paired with Nuvoton’s self-developed NuML Tool Kit, it enables developers to quickly get started with AI applications in a familiar MCU development environment. A variety of AI models are also available for trial, including face recognition, object detection, audio command recognition, and anomaly detection, effectively lowering the technical barrier and accelerating product deployment.

To meet diverse AI application scenarios, the M55M1 is a 32-bit microcontroller based on the Arm Cortex-M55 core, equipped with Arm Ethos-U55, offering up to 110 GOPS of computing power and a built-in Helium vector processor. Compared to Arm’s existing DSPs, it delivers up to 15 times higher performance. To address AI model requirements, it provides up to 1.5 MB of RAM, 2 MB of Flash, and supports external HyperRAM/OctoSPI expansion. The M55M1 not only features powerful computing capabilities and a flexible architecture but also offers a highly integrated development environment. Through the NuML Tool Kit, developers can easily port AI models to the M55M1 platform using familiar MCU firmware development methods. This architecture is suitable for a wide range of edge AI applications, such as predictive maintenance analysis for factory equipment, analysis for various home appliances and medical sensing devices, as well as endpoint AI applications like keyword spotting, echo cancellation, and image recognition.

On the general MCU operation side, the M55M1 is equipped with a Cortex-M55 core running at up to 220 MHz and offers five low-power modes. It also supports a wide range of peripherals, including CCAP, DMIC, I2C, SPI, Timer, UART, ADC, and GPIO, all of which can operate in low-power modes. In addition, the M55M1 features multi-level security mechanisms, including secure boot, Arm TrustZone, a hardware crypto engine, and Arm PSA Certified Level 2 compliance, providing reliable protection for IoT and embedded applications.

The post Nuvoton’s M55M1 AI MCU Debuts with Built-in NPU for Entry-Level AI Performance appeared first on ELE Times.

submitted by /u/SpecialistRare832 [link] [comments]

ANRITSU CORPORATION has enhanced the functions of its New Radio RF Conformance Test System ME7873NR to support 5G wireless device conformance tests and compliance with the ETSI EN 301 908-25 standard under the European Radio Equipment Directive (RED).

By using these enhanced functions, manufacturers can ensure regulatory compliance for 5G wireless devices sold in the EU and guarantee product quality and reliability. Anritsu is dedicated to supporting smooth market entry for products into the EU.

RED is an EU legal framework defining the safety, electromagnetic compatibility (EMC), radio-spectrum efficiency, and cybersecurity requirements of wireless devices in the EU. With the spread of wireless technologies, such as 5G, the ETSI EN 301 908-25 standard for 5G NR devices has been established based on 3GPP Release 15 regulating 5G specifications, and wireless products now sold in the EU must comply with this standard.

Through this latest enhancement, Anritsu continues to play a key role in deployment of commercial 5G services, helping create a 5G-empowered society.

The New Radio RF Conformance Test System ME7873NR is a 5G test platform compliant with 3GPP standards and is certified by both the Global Certification Forum (GCF) and PCS Type Certification Review Board (PTCRB).

In addition to supporting Frequency Range 1 (FR1, Sub-6 GHz), combining the system with an OTA (CATR) chamber 2 adds support for Frequency Range 2 (FR2, mmWave). The flexible configuration and customizable design provide an upgrade path from current ME7873LA systems, offering enhanced 5G compatibility at a lower capital cost.

The post Anritsu Supports EU Market Expansion by Ensuring Safety and Compliance of 5G Wireless Devices appeared first on ELE Times.

Governments across the globe are requesting critical infrastructure operators to adopt additional time sources alongside GNSS to enhance resilience and reliability, ensuring uninterrupted operations in the face of potential disruptions or service limitations. Microchip Technology announced the release of the TimeProvider 4500 v3 grandmaster clock (TP4500) designed to deliver sub-nanosecond accuracy for time distribution across 800 km long-haul optical transmission.

This innovative solution provides critical infrastructure operators with the missing link the industry has been waiting for in terms of complementary Positioning, Navigation and Timing (PNT). The TP4500 provides a resilient, terrestrial solution in the absence of Global Navigation Satellite Systems (GNSS) for precise timing, alleviating physical obstruction, security and signal interference costs associated with GNSS-dependent deployments.

Most current deployments require GNSS at grandmaster sites, but the TP4500 enables highly resilient synchronization without relying on GNSS. The TP4500 supports time reference provided by UTC(k) UTC time provided by national labs, and is the first grandmaster to offer a premium capability that delivers High Accuracy Time Transfer (HA-TT) as defined by ITU-T G.8271.1/Y.1366.1 (01/2024) to meet 5 nanoseconds (ns) time delay over 800 km (equating to 500 picoseconds (ps) average per node, assuming 10 nodes), setting a new industry benchmark for accuracy.

The TP4500 system can be configured with multiple operation modes to form an end-to-end architecture known as virtual PRTC (vPRTC), capable of delivering PRTC accuracy over a long-distance optical network. vPRTC is a carrier-grade architecture for terrestrial distribution of HA-TT, which has been widely deployed in operator networks throughout the world.  HA-TT is a proven and cost-effective approach, as opposed to  other alternative PNT solutions that have no wide adoption into critical infrastructure networks to date, have low Technology Readiness Levels (TRL) and are still dependent on GNSS as the ultimate source of time.

“The TimeProvider 4500 v3 grandmaster is a breakthrough solution that empowers operators to deploy a terrestrial, standards-based timing network with unprecedented accuracy and resilience,” said Randy Brudzinski, corporate vice president of Microchip’s frequency and time systems business unit at Microchip. “This innovation reflects Microchip’s commitment to delivering the most advanced and reliable timing solutions for the world’s most essential services.”

TimeProvider 4500 v3 is a key steppingstone towards support of the ITU-T G.8272.2 standard, which defines a coherent network reference time clock (cnPRTC) in amendment 2 (2024). An cnPRTC architecture ensures highly accurate, resilient, and robust timekeeping throughout a telecom network. This allows stable, network-wide ePRTC time accuracy, even during periods of regional or network-wide GNSS unavailability or other failures and interruptions.

Key features of the TimeProvider 4500 v3 series:

• Sub-nanosecond accuracy: Delivers 5 ns time delay over long distances up to 800 km Terrestrial alternative to GNSS: Enables critical infrastructure to operate with resilient synchronization mechanisms independent of GNSS
• Seamless integration: Standards-based terrestrial network for time transfer, easily integrated with off-the-shelf small form-factor pluggable and existing Ethernet and optical deployments
• Exclusive capability: Premium software features available only on the TP4500 v3, integrating Microchip’s PolarFire FPGA and Azurite synthesizer for unmatched precision

Optimized for telecom, utilities, transportation, government, and defense, the TP4500 grandmaster ensures precise and resilient timing where it matters most. This latest version provides operators with a scalable solution for secure and reliable time distribution over long distances.

The post High-Accuracy Time Transfer Solution Delivers Sub-Nanosecond Timing Up to 800 km via Long-Haul Optical Networks appeared first on ELE Times.

Trailing-edge dimmers offer smoother, quieter control for modern lighting systems—but their inner workings often remain overlooked. This post sheds light on the circuitry behind the silence. Sometimes, the most elegant engineering hides in the fade, where silence is not a flaw but a feature.

Let’s get started.

Dimmers serve as an effective interface for controlling energy-efficient lighting systems. And dimming methodologies are broadly categorized into forward-phase dimming (leading-edge), reverse-phase dimming (trailing-edge), and four-wire dimming, commonly referred to as 0–10 V analog dimming.

This post specifically examines reverse-phase dimming, also known as trailing-edge dimming, which is particularly well-suited for electronic low-voltage (ELV) transformers and modern LED drivers. Its smoother voltage waveform and inherently lower electromagnetic interference (EMI) make it ideal for applications requiring silent operation and compatibility with capacitive loads.

Leading and trailing edge dimming

In a leading-edge dimmer—also known as a triac dimmer or incandescent dimmer—the electrical current (sinusoidal signal) is interrupted at the beginning of the AC input waveform, immediately after the zero crossing. This dimming method is traditionally used with incandescent lamps or magnetic low-voltage transformers.

On the other hand, a trailing-edge dimmer interrupts the current at the end of the AC input waveform, just before the zero crossing (Figure 1). This technique is better suited for electronic drivers or low-voltage transformers with capacitive loads.

Figure 1 In trailing-edge dimming waveform, conduction begins mid-cycle, and current is interrupted before zero crossing to suit capacitive loads. Source: Author

In a nutshell, a trailing-edge dimmer is an electrical device used to adjust the brightness of lights in a room or space. It operates by reducing the voltage supplied to the light source, resulting in a softer, dimmer glow.

Unlike leading-edge dimmers—which cut the voltage at the beginning of each AC waveform—trailing-edge dimmers reduce the voltage at the end of the waveform. This “trailing edge” approach enables smoother, more precise dimming, especially at lower brightness levels.

Trailing-edge dimmers are particularly well-suited for LED lighting. They tend to be more efficient, generate less heat, and offer better compatibility with modern electronic drivers. The result is a quieter, flicker-free dimming experience that feels more natural to the eye.

Figure 2 The popular DimEzy brand for trailing-edge rotary dimmers embodies compact engineering optimized for retrofit installations. Source: LiquidLEDs

It’s important to note that most mains-powered LED bulbs are not dimmable. Even among those labeled as dimmable, compatibility with dimmer types can vary. Many require dedicated trailing-edge dimmers to function correctly; using the wrong dimmer may lead to flickering, limited dimming range, or even premature failure. Always check the bulb’s specifications and pair it with a suitable dimmer for reliable, smooth performance.

Moreover, since LED bulbs and dimmers are mains-operated, even minor mishandling can lead to electric shock or fire hazards. Always choose compatible components and follow safety guidelines.

Trailing-edge dimmer design: The starting point

Building a trailing edge dimmer is not trivial; but it’s far from overcomplicated. Below is a conceptual block diagram for those poised at the starting line.

Figure 3 A conceptual block diagram highlights the key functional units coordinating trailing-edge dimming. Source: Author

From the block diagram above, several distinct functional stages interact with each other to perform the overall dimming functionality. In a trailing-edge dimmer circuit, the power supply delivers a stable low-voltage DC source to power control and switching stages. The zero-crossing (ZC) detector pinpoints the exact moment the AC waveform crosses zero volts, providing a timing reference for phase control.

Based on this, the timing control block calculates a delay to determine when to switch off the load during each half-cycle, shaping the trailing edge of the waveform. This delayed signal is then fed to the gate driver, which conditions it to reliably switch the power MOSFETs, the primary switching elements that interrupt current partway through each cycle, enabling smooth dimming with minimal noise and flicker.

So, for your trailing-edge dimmer, the selection of components involves careful consideration of their roles in the dimming process.

• Power supply (DC): This supply will power the control circuitry, including the digital logic and gate drivers. Its voltage and current rating must be sufficient to reliably operate these components, especially under varying load conditions.
• Zero-crossing (ZC) detector: This detector is fundamental for timing the dimming cycle. It senses when the AC waveform crosses zero, providing a synchronization point. The ZC detector should be fast and accurate to ensure precise dimming.
• Timing control: This element, often integrated with digital logic, dictates the duration for which the power MOSFET remains on during each AC half-cycle. For trailing-edge dimming, the gate pulse is enabled at the ZC signal and disabled after a specific ON-time pulse width.
• Digital logic: This is the brain of the dimmer, interpreting user input—for instance, from a potentiometer or button—and controlling the timing logic. It might involve simple logic gates or a microcontroller. One document mentions a triple 3-input NOR gate for control, indicating the use of basic digital logic.
• Gate drivers: Gate drivers are essential for efficiently switching power. They provide the necessary current and voltage levels to turn the MOSFETs on and off quickly, minimizing switching losses and heat generation. Proper selection ensures a clean gate drive signal.
• Power MOSFETs: The power MOSFET acts as the main switching element, controlling the power delivered to the load. It must be chosen based on the load’s voltage and current requirements, with low on-state resistance (Rdson) for efficiency and adequate heat dissipation capabilities. For AC dimming, devices capable of handling the AC voltage and current, such as specific MOSFETs or IGBTS designed for phase control, are necessary.

Recall that a trailing-edge dimmer operates using transistor switches that begin conducting at the start of each half sine wave. These switches remain active for a defined conduction angle, after which they turn off, effectively truncating the AC waveform delivered to the load.

This approach results in smoother current transitions. The electronic load benefits from the gentle rise of the sine wave, and once the switch turns off, any residual energy stored in inductive or capacitive components naturally dissipates to zero. This behavior contributes to quieter operation and improved compatibility with sensitive electronic loads.

Up next is the practical schematic of a trailing edge phase control rotary wall dimmer designed without a microcontroller and originally introduced by STMicroelectronics over a decade ago.

Although this elegant concept now calls for a few updates—mainly due to the unavailability of certain key components (fortunately, drop-in replacements exist)—it remains an invaluable design reference, at least to me. I could not have expressed it better myself, so here is the link to its full documentation.

Figure 4 Rotary wall dimmer circuit employs reverse-phase control to regulate mixed lighting loads. Source: STMicroelectronics

Happy dimming

In summary, there is not much more to add regarding trailing-edge dimmers for now. However, it’s worth noting that these dimmers can also be built using a microcontroller, which is especially useful for smart lighting systems. Compared to specialized dimmer ICs, microcontrollers provide more freedom to create custom dimming profiles, incorporate user interfaces, and connect with smart home technologies like Wi-Fi or Bluetooth.

That is all for now. But don’t let the dimming stop here.

Dive deeper into the fascinating world of trailing-edge dimmers. Experiment with different component combinations, explore their impact on dimming performance, and share your discoveries with us.

What will you create next? Let’s know your thoughts or any challenges you encounter as you build your own dimming solutions. Your insights could light the way for others.

Happy dimming!

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

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The post Behind the curve: A practical look at trailing-edge dimmers appeared first on EDN.

Based on 3 nm process technology, Microchip’s Switchtec Gen 6 PCIe switches deliver fast data movement, low latency, and high security for modern AI infrastructure.

submitted by /u/ScienceDIY [link] [comments]

Infineon Technologies AG claims the industry’s first radiation-hardened (rad-hard) buck controller with an integrated gate drive. The RIC70847 buck controller targets point-of-load power rails in commercial space systems and other extreme environments. Applications include distributed satellite power systems and digital processing payloads, including FPGA and ASIC systems. 
 

(Source: Infineon Technologies AG)

The RIC70847 comprises a 17.1-V buck controller with a 5-V (output) half-bridge gate drive, suited for applications with a power input range of 4.75 V to 15 V and power output range of 0.6 V to 5.25 V. The device meets the MIL spec temperature range of -55°C to 125°C and applications that require a total ionizing dose rating of up to 100 krad (Si) and single event effects characterized up to a linear energy transfer of 81.9 MeV·cm²/mg.

The rad-hard buck controller incorporates load line regulation and fixed-frequency peak current mode control, which is reported to deliver exceptional transient response while reducing the number of output capacitors required. In addition, the high step-down voltage ratios, combined with the 5-V half-bridge gate driver, simplify the design process and minimize component count for a more compact and efficient power management design.

The high level of integration also improves system reliability and reduces the risk of component failure, Infineon said.

The RIC70847 buck controller is housed in a hermetically-sealed 24-lead flatpack or die form, and works seamlessly with logic-level transistors, such as Infineon’s rad-hard R8 power FET. It is available now, along with the RIC70847EVAL1 DC/DC buck controller evaluation board. The eval board features an integrated dynamic load step circuit for transient testing and supports a range of output capacitance and inductor configurations.

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Vishay Intertechnology, Inc. launches a new series of insulated, surface-mount inrush current limiting positive temperature coefficient (PTC) thermistors. The Vishay BCcomponents PTCES series devices offer maximum energy handling up to 340 J with high maximum voltages of 1,200 VDC in a compact package, providing increased board-level efficiency and lower costs in automotive and industrial applications.

Vishay said the new PTCES PTC thermistors offer up to 260% higher energy-handling capabilities compared to competing devices, which helps to reduce component count to save board space and lower overall costs. These devices also offer 20% higher maximum voltages than competing devices.

(Source: Vishay Intertechnology, Inc.)

The PTC thermistors provide current limitation and overload protection in AC/DC and DC/DC converters; DC-Link, energy dump, and emergency discharge circuits; on-board chargers and battery charging equipment; and motor drives. They withstand >100,000 inrush power cycles and are AEC-Q200 qualified for shock and vibration, eliminating the need for reinforced mounting adhesives, Vishay said.

The series is comprised of solder-connected homogeneous ceramic PTCs encapsulated in a UL 94 V-0 compliant, self-extinguishing, washable plastic housing with insulation up to 3 kVAC. The devices feature a low profile of 9.6 mm and can be automatically mounted by pick-and-place equipment to reduce placement costs.

The PTC thermistors are RoHS-compliant and halogen-free. Samples and production quantities are available now, with lead times of 10 weeks. Pricing for U.S. delivery starts at $0.90 each in quantities of 1,000. Click here for the datasheet.

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