ELE Times

Automotive Grade Device Delivers Luminous Intensity to 2800 mcd, Enables Every Color Within the Gamut Triangle Inside the CIE 1931 Color Space

Vishay Intertechnology, Inc. introduced a new tricolor LED that provides luminous intensity to 2800 mcd at 20 mA for interior automotive lighting, RGB displays, and backlighting. Featuring separate anode and cathode connections for the red, green, and blue LED chips inside its compact 3.5 mm by 2.8 mm by 1.4 mm PLCC-6 surface-mount package, the Automotive Grade VLMRGB6122..enables individual control of each chip, making it possible to realize every color within the color room defined by the gamut triangle area inside the CIE 1931 color space through color mixing.

With its wide color range, the Vishay Semiconductors LED released, is ideal for ambient lighting, switch illumination, status indicators, and dashboard signal and symbol illumination in automobiles; large-format, full-color message and video display boards; backlighting in consumer devices, home appliances, medical instrumentation, and telecom equipment; and a wide range of accent and decorative lighting. For these applications, the device utilizes the latest high brightness AllnGaP and InGaN technologies to deliver 70 % higher brightness than previous-generation solutions in a package with a 22 % lower profile than competing products.

Providing high reliability, the VLMRGB6122..offers a wide temperature range from -40 °C to +110 °C, which is 25 °C higher than standard solutions, and Class B1 corrosion robustness. The LED is AEC-Q102 qualified, offers a Moisture Sensitivity Level (MSL) of 3, and withstands ESD voltages up to 2 kV for red and 8 kV for blue and green in accordance with JESD22-A114-B. RoHS-compliant, halogen-free, and Vishay Green, the device is compatible with IR reflow soldering and categorized per reel for luminous intensity, color, and forward voltage.

The post Vishay Intertechnology RGB LED in PLCC-6 Package Provides Independent Control of Red, Green, and Blue Chips for Wide Color Range appeared first on ELE Times.

In an exclusive interview with ELE Times, Mr. Brahmanand Patil, President & Managing Director of Vector Informatik India Pvt. Ltd., shed light on how Vector is driving the transformation of aerospace networks. The conversation ranged from TSN adoption to state-of-the-land cybersecurity, FACE compliance, and digital twins, with Vector sharing some insights about the technologies driving the current aerospace platforms. Excerpts.

ELE Times: What Vector is seeing in aerospace in the latest trends in the implementation of Time Sensitive Networking (TSN)?

Brahmanand Patil: We are seeing a growing adoption of Ethernet-based TSN for deterministic, synchronized, high-bandwidth avionics data. Aerospace OEMs increasingly prefer TSN over legacy buses (e.g., ARINC 429/FIBRE) to meet scaling demands for data communications among flight control, sensors, and mission systems.

At Vector, we are responding to this shift with TSN support in test tools, enabling aerospace developers to validate deterministic timing, redundant paths, and strict QoS behaviors on Ethernet.

ELE Times: How do Vector tools like CANoe.AFDX and VN interface hardware assist in testing high-reliability aerospace communication systems?

Brahmanand Patil: Reliability is non-negotiable in aerospace—and our tools are designed with that in mind. CANoe.AFDX supports simulation and conformance testing of AFDX (ARINC 664) and Ethernet-based avionics networks. It can inject faults, simulate redundant virtual links, verify timing requirements, and validate configuration against STDs like DO-160.

VN interface hardware like VN1600, VN5610 enables real-time physical-layer interaction, traffic generation, and measurements over Ethernet/AFDX/TSN. This lets engineers capture jitter, latency, packet errors, and link redundancy performance in real aircraft or Hardware-In-Loop (HIL) setups. These tools ensure avionics comms meet stringent reliability and timing metrics.

ELE Times: How does Vector support the development of software for FACE-compliant avionics platforms?

Brahmanand Patil: Vector’s toolchain integrates with model-based development (Simulink, SCADE, etc.) and supports code generation tailored to FACE Technical Standard running on POSIX or specialized FACE OS platforms. CANoe’s test framework can simulate face component interfaces, verify misuse cases, and perform regression testing across FACE segments: Safety-critical, Portable, and I/O.

Vector also enables integration testing in multi-vendor FACE environments, ensuring interoperability and that interfaces meet FACE conformance.

ELE Times: How is Vector integrating cybersecurity features (like secure communication or authentication) into its tools for aerospace applications?

Brahmanand Patil: At Vector, cybersecurity is not an afterthought—it’s embedded into the DNA of our tools for avionics. Our solutions enable rigorous testing and validation of secure communication protocols such as TLS, DTLS, IPsec, and secure extensions of AFDX. Using CANoe, aerospace developers can simulate and verify handshake mechanisms, certificate-based authentication, encryption throughput, and resilience against protocol-level anomalies.

Our network interfaces, including VN adapters, support precise packet-level timestamping and real-time capture of secure traffic—empowering developers to assess encryption overhead and identify tampering or injection attempts.

To further strengthen avionics systems, CANoe integrates powerful cyber-attack simulation capabilities like fuzzing, allowing stress testing against DoS, replay, and malformed packet attacks in Ethernet or AFDX-based networks.

On the software assurance front, VectorCAST delivers high-integrity testing across all development phases—from unit to system-level—aligned with DO-178C and DO-330 guidelines. With its data/control coupling analysis, VectorCAST ensures that inter-component communication adheres strictly to intended interfaces, helping eliminate side-channel risks and unauthorized data paths.

For static code analysis, PC-lint Plus acts as a robust SAST (Static Application Security Testing) tool. It enables early detection of vulnerabilities such as buffer overflows, memory corruption, and unsafe typecasts, aligned with industry standards like CWE, CERT C, MISRA, and AUTOSAR—minimizing attack surfaces in mission-critical avionics code.

By combining simulation, attack emulation, runtime monitoring, and static analysis under one roof, Vector provides aerospace engineers with an integrated platform to design, validate, and secure next-generation embedded systems.

ELE Times: What advancements is Vector making in cybersecure data communication in avionics networks?

Brahmanand Patil: Vector is enhancing its toolset with secure gateway emulation—including cybersecurity policies, firewall rules, and key-management scenarios—aligned with industry standards like DO-326A/ED-202A.

They’re also enabling encrypted redundant TSN path validation, where tools simulate failover in secure real-time Ethernet environments.

Support for capturing PHY-level anomalies, example ARINC 429 vulnerabilities hints at path toward intrusion detection, signal anomaly capture, and side-channel audit—it aligns with academia’s move toward voltage-based IDS

On the software side, Vector integrates Common Weakness Enumeration (CWE) into its PC-lint Plus static analysis tool. This enables early detection of critical vulnerabilities such as buffer overflows, memory mismanagement, and logic flaws—common risks in avionics data communications. Catching such issues early in development is vital for maintaining the integrity of flight-critical systems.

PC-lint Plus further acts as a Static Application Security Testing (SAST) solution aligned with DO-178C objectives. It supports high-integrity development through structural code analysis and enforces compliance before integration phases.

To ensure industry-grade secure coding, PC-lint Plus supports coding standards including:

• CERT C – Secure programming practices.
• MISRA C/C++ – Reliable and safe coding for critical systems.
• AUTOSAR C++14 – Standardized architecture for embedded automotive and avionics platforms.

Together, these capabilities enable aerospace developers to build secure, interoperable, and standards-compliant communication systems that are resilient against modern cybersecurity threats.

ELE Times: How does Vector leverage digital twin technologies in aerospace network validation?

Brahmanand Patil: The capabilities of CANoe and Interface hardware offer high-fidelity virtual replication of avionics networks; this effectively serves as a digital twin.

Through link-level simulation (AVIONICS + TSN), fault injection, deterministic latency modeling, and integration with physical hardware in HIL (hardware-in-the-loop) configurations, Vector supports the same iterative validation, anomaly detection, and real-time monitoring goals touted in digital twin use cases.

The post Powering Intelligent Avionics: How Vector is Advancing TSN, FACE, and Cybersecurity appeared first on ELE Times.

Keysight Technologies held its flagship Keysight World Tech Day India on July 8, 2025, at The Leela Palace, Bengaluru, bringing together CXOs, engineers, researchers, and innovators from the electronics and high-tech sectors. The event showcased key technologies shaping the future across multiple industries including telecom, AI, and automotive, offering attendees expert-led sessions, live demonstrations, and in-depth technical tracks designed to accelerate innovation and market readiness in a rapidly evolving technology landscape.

The event also highlighted four key domains shaping the future of technology: 6G and Wireless, AI Infrastructure, Automotive, and AI Networks. Industry experts joined Keysight to explore AI-native 6G networks, THz communication, non-terrestrial networks (NTN), and digital twin-based design for ultra-fast, intelligent connectivity. Experts also discussed advancements in AI infrastructure highlighting compute fabrics, chiplets, optical interconnects, memory, and PCIe Gen7, which are critical enablers of next-gen AI. The automotive segment covered EV battery testing, V2X, autonomous driving, and cybersecurity for smarter mobility and finally AI Networks focused on network emulation, multi-cloud testing, and cybersecurity validation.

Keysight World Tech Day India 2025 brought together professionals from companies working on deep tech offering a unique platform for networking, knowledge sharing, and experiencing next-gen innovations that empower the electronics and high-tech community to stay ahead in a complex ecosystem.

The post Keysight World Tech Day India: Annual Conference Highlights Future-Defining Innovations in 6G, AI, Automotive, and Network Technologies appeared first on ELE Times.

ANRITSU CORPORATION announced the successful verification and support of 3GPP RAN5 Rel-17 NR NTN test cases on its 5G NR Mobile Device Test Platform ME7834NR.

Non-terrestrial Networks (NTNs) are wireless communication systems that operate above the Earth’s surface, utilizing platforms in the air and in Earth’s orbit. These platforms include satellites in Low Earth Orbit (LEO), Medium Earth Orbit (MEO), and Geostationary Orbit (GEO).

3GPP Release 17 introduces “NR NTN” – the inclusion of Non-Terrestrial Networks into the 5G New Radio (NR) standards. This advancement enables 5G devices to connect to satellites using the same protocols as terrestrial base stations, paving the way for global 5G coverage beyond traditional infrastructure.

“Anritsu support for NR NTN test cases will enable ubiquitous connectivity for uninterrupted mobile data, voice and messaging—anywhere on Earth empowering individual users, businesses and industries that need to be connected with always-on access,” said Yokoo Daizaburo, General Manager of Mobile Solutions Division at Anritsu Corporation.

The conformance tests are defined by 3GPP in TS 38.523-1 and aligned with the core requirements in TS 38.331. These tests have been submitted by Anritsu to 3GPP’s Radio Access Network Working Group 5 (RAN WG5).

The post Anritsu Validates 3GPP Rel-17 NR NTN Test Case appeared first on ELE Times.

Power electronics lie at the center of the revolution taking place in the mobility sector. With the world mobility trend moving towards electrification, power electronics have found their place as a foundation technology with efficient energy conversion and management in hybrid electric vehicles (HEVs) and electric vehicles (EVs). To enhance efficiency, reliability and sustainability, power electronics are integral to hybrid transportation systems and electric vehicles.

Advancements in Automotive Power Electronics

The automotive industry faces a transformation with the advent of high-profile power electronics, improving EVs for efficiency, safety and energy management. Perhaps WBG semiconductor adoption is unique, especially that of silicon carbide and gallium nitride. These materials present switched speeds triple that of silicon, with low losses and fairly high thermal endurances that allow physically much smaller and rugged designs. SiC finds use mainly in high-voltage traction inverters and onboard chargers to the extent that 800V+ architectures are employed for ultra-fast charging and enormous range, while GaN cashes in with DC-DC converters and onboard chargers for an efficiency higher that 96%.

IPMs can be considered another game-changing technology as they package and integrate high-voltage switches, gate drivers and protection circuits into a compact, thermally optimized package waterproofing the simplifying set of design parameters for the EV powertrain.

Bidirectional power conversion is what is required for vehicle to grid (V2G) and vehicle to home (V2H) working using DAB and CLLC resonant converters. These achieve efficient transfer of energy while safeguarding the EV platform in a forward-looking perspective. Solid-State Transformers introduce megawatt charging for electric vehicles, interfacing compatibility and with dynamic power facilitation.

Contention is with the battery technical part: Next-gen Battery Management Systems incorporate AI, auto-diagnostics and edge computing for real-time health monitoring, predictive maintenance and adaptive balancing, Furthermore, 48 V power electronics provide an edge to mild hybrids and ADAS by relieving loads from 12 V architecture while powering electric turbochargers and active chassis systems. This kind of innovation is placing energy ecosystems at the smart and connected core of EVs for greater performance, reliability and efficiency in the future of mobility.

The Future of mobility is being rewritten by the rise of electric vehicles (EVs) and power electronics are at its core. At the core of the metamorphosis, another transformation is upon the world: Infineon Technologies AG, a leading power semiconductor company. Infineon inculcates a new benchmark of performance, reliability, energy efficiency with its 800V traction systems, up to bidirectional charging and battery management. Speaking with two senior executives ELE Times sought exclusive insights into the changing function of power electronics in e-mobility:

Together they offered thorough observations on recent developments in wide-bandgap semiconductors, smart gate drivers, battery management systems and EV charging technologies influencing the future of sustainable transportation.

ELE Times: What are the latest developments in SiC (Silicon Carbide) and GaN (Gallium Nitride) power devices for EV applications?

Martin Spiteri & Dr Kok Wai Ma: GaN-based on-board chargers and DC-DC converters in electric vehicles will contribute to a higher charging efficiency, power density, and material sustainability, with a shift towards 20 kW+ systems. Infineon is now introducing a trench-based superjunction (TSJ) SiC technology concept. The combination of trench and charge-compensating superjunction technology enables higher efficiency and more compact designs – an important step for applications requiring the highest levels of performance and reliability. The first products based on the new technology will be 1200V in Infineon ID-PAK package for automotive traction inverters. This scalable package platform supports power levels of up to 800 kW. Key benefits of the technology include increased power density, achieved through an up to 40 percent improvement in RDS(on)*A. The 1200 V SiC trench-superjunction concept in ID-PAK package enables up to 25 percent higher current capability in main inverters without compromising short-circuit capability. Together with high-end SiC solutions, GaN will also enable more efficient traction inverters for both 400 V and 800 V EV systems, contributing to an increased driving range.  The use of GaN-based power semiconductor in EV traction is a topic of intense research and development.

ELE Times: What technologies in gate drivers and power management ICs are advancing high-voltage systems?

Martin Spiteri & Dr Kok Wai Ma: Infineon gate driver ICs covering the usage of MOSFET, IGBT, and SiC in automotive 12 V to 1200 V applications with built-in protection and diagnosis. We have gate drivers which are with ISO 26262-compliant for safety critical applications in addition to isolated gate driver ICs for HV EV applicationsproviding galvanic isolation for automotive applications above 5 kW such as the traction inverter, DC-DC converter and onboard charger and support IGBT and SiC technologies up to 1200 V. Recently introduced gate drivers to replace relays and standard fuses and provide additional protection and diagnostic functions. They increase the reliability of the power net thanks to fast fault isolation in less than 100 µs, additional diagnostics, and improved protection functions like integrated wire protection.

• Infineon’s OPTIREG PMIC products are power management integrated circuits consisting of integrated, multi-rail supply solutions for demanding automotive systems in segments such as body, power distribution, chassis, ADAS, infotainment, powertrain electric drivetrain featuring ISO 26262-compliance, Boost capability, Pre/post-regulator architecture and Multiple voltage rail supplies.

ELE Times: What new technologies in bidirectional power converters are boosting EV charging and regenerative braking capabilities?

Martin Spiteri & Dr Kok Wai Ma: Regenerative braking capabilities for EV traction using bidirectional power converter is a mature technology, and in many cases can be provided without significant cost premium. On the other hand, bidirectional power conversion for on-board EV charging is an application trend driven by the increasing vehicle-to-everything (V2X) functionality requirement. To achieve such requirement, the popular choice of AC-DC PFC stage will change from Vienna rectifier to Active Front End (AFE), and DC-DC converter topologies will change from LLC to CLLC or dual active bridge (DAB).

ELE Times: How are new battery management systems (BMS) maximizing power handling and lifespan for high-voltage applications?

Martin Spiteri & Dr Kok Wai Ma: Infineon’s cell monitoring and balancing (CMB) device, also known as the BMS IC or Analog Front End (AFE), measures cell voltages and temperatures for state of charge (SoC), ensuring safe operation within the safe operating area (SOA). It performs low-power diagnostics and housekeeping and communicates with the main controller for cell balancing and pack thermal management triggering disconnection and alerts when needed.

Over time, the small differences between cells in multicell battery stacks are magnified during each charge and discharge cycle. Weaker cells with lower capacity reaching maximum voltage sooner than others force the charging process of the entire pack to stop; in this case, the full capacity of the battery cannot be used. Using Infineon’s automotive BMS cell monitoring and balancing (CMB) device to compensate the weaker cells by equalizing the charge across the entire stack will enable extending an electric vehicle’s driving range and battery lifetime. Additionally, to achieve extremely low-power dedicated housekeeping functions, such as periodically scheduled cell measurements and state analysis required for functional safety, the Cell Monitoring and Balancing IC can operate independently of the BMS’s master controller. Safety features such as signalling over- or under-voltage, thermal stress, and emergency alarms are triggered autonomously.

ELE Times: What are the trends in high-power fast-charging architectures and how are they affecting grid integration?

Martin Spiteri & Dr Kok Wai Ma: Truck electrification is driving up EV charging voltage and capacity beyond 1000V and megawatts level. Standardization activities around the world is ongoing to enable high-voltage high-power DC fast chargers be developed and be interoperable, e.g. CCS, CHAdeMO, GB/T for High Power Charging (HPC), and SAE J3400, Ultra-ChaoJi, X-MCS and NACS for Megawatt Charging System (MCS).

To construct high-power fast DC charging park,

• DC microgrid is seen as a promising approach for interconnection of the AC grid with different renewable energy sources like solar photovoltaic and battery energy storage,
• Solid-state transformer (SST) is the key enabling technology for such architecture,

Matrix switch network will facilitate flexible power distribution amongst energy sources and charging loads.

Conclusion:

Driving Toward the Electrified Tomorrow

Power electronics will change across industries, primarily in electric vehicles and sustainable-energy systems. UWBG semiconductors such as diamond and gallium oxide will creep in as the second-generation materials that can promise better efficiency, power density and thermal performance. AI-based power electronics will predictively maintain and monitor system health in real-time to ensure it is performing at its optimum and has its life further extended. Now, the rising 800V+ architecture for EVs and the emerging trend of 48V will allow for better thermal management, efficiency and fast charging. SSTs will enable the integration of DC microgrid, allowing the power to be distributed flexibly and interfacing into renewable energy sources. Megawatt charging system (MCS) is expected to provide high-power EV charging, especially for heavy-duty vehicles and global standardization schemes are underway. Fast charging, better charging and safer battery technologies are being developed one semiconductor at a time. With the emergence of SiC, GaN advanced gate drivers and megawatt chargers, a new electrified era stands before mobility.

The post Power Electronics in the Mobility Sector: Insights on Trends, Technology, and Transformation appeared first on ELE Times.

STMicroelectronics (ST), a leading global semiconductor company that serves clients in a variety of electronics applications, recently announced ST Presence Gen 5, its fifth-generation Human Presence Detection (HPD) technology, at a virtual media briefing. The most recent version of ST’s turnkey solution marks a major advancement in protecting user privacy while improving security, power efficiency, and user engagement in personal computing devices, including laptops, monitors, tablets, webcams, and accessories.

Personal Electronics, Industrial & Mass Market Business-Line Director at Imaging Sub-Group, STMicroelectronics

The briefing included in-depth discussions from David Maucotel, Business-Line Director at the Imaging Sub-Group, assisted by Herve GROTARD (Subject Matter Expert on ST Presence) and Olivier LEMARCHAND (SME on AI-powered Human Presence Detection). The event provided a holistic view of the technology’s evolution, market relevance, and functional impact, concluding with live feature demonstrations and a technical walkthrough.

The outlook for the imaging market and ST’s strategic priorities

David Maucotel gave a thorough market analysis at the beginning of the session, referencing statistics from analysts at Yole Group who projected a compound annual growth rate of 4–5% for the image sensor market until 2029. Mobile, computer vision, and industrial applications are important growth areas. By 2030, 3D sensing is predicted to triple in revenue due to robots, indoor/outdoor navigation, and people monitoring.

In this trajectory, ST’s Imaging Sub-Group is essential. The company has naturally developed a diverse product range that targets laptops, PCs, industrial robotics, and car in-cabin monitoring, building on its prior capabilities in front-facing smartphone sensors and rear camera assistance. ST is currently a world leader in 3D depth sensing and camera modules thanks to its proprietary technologies, which include the well-known FlightSenseTM time-of-flight (ToF) sensors.

Engineering Excellence in ST’s Imaging Portfolio

The Imaging Sub-Group’s technical foundation is rooted in over 25 years of R&D, dating back to its acquisition of Vision Group in Scotland. From early success with Nokia to winning the CES Innovation Award in 2019, ST has continuously pushed the envelope in camera and ToF technologies. Its current portfolio includes:

• 3D Depth Sensing: Mastery of both indirect and direct time-of-flight sensors capable of generating from 2,000 to 500,000 points in a 3D environment. 
• Direct ToF Modules: Compact modules with 64 to 256 zones, enabling accurate distance measurement up to 10 meters in multi-zone configurations. 
• Optical Light Sensors (ALS): Ultra-small form-factor ambient light sensors for screen dimming and colour tone adjustments. 
• 2D Global Shutter Cameras: Over one billion units shipped, with applications ranging from smartphones to face authentication and VR.
  

ST’s competitive edge lies in its ability to vertically integrate manufacturing, design, to production across its fabs in France and Singapore, assembly sites in Shenzhen and Calamba, and R&D hubs in Grenoble and Edinburgh.

ST Presence Gen 5: Turnkey, AI-Powered, Privacy-Centric

Herve Grotard introduced ST Presence Gen 5, ST’s flagship turnkey solution that integrates its multi-zone ToF sensor with proprietary AI algorithms to deliver advanced human sensing capabilities—without using a camera.

“At the core is an 8×8 time-of-flight ranging sensor that calculates real-time distance data using invisible infrared light,” said Grotard. “On top of this hardware, we’ve added a stack of AI and analytic algorithms to build privacy-respecting, low-power, real-time features.”

Key advantages include:

• Privacy: No images are captured; the system operates entirely on depth data.
• Power Efficiency: Consumes under 2 milliwatts, reducing CPU wakeups and enabling ultra-low power operation.
• Low Computational Overhead: Software optimized for small microcontrollers and sensor hubs, not requiring GPUs or high-performance CPUs. 

Breakthrough Features in Gen 5

Olivier Lemarchand took the audience through each of the seven major features of ST Presence Gen 5, each enabled by a unique AI network or advanced analytics:

1. Walk-Away Lock
   Detects when a user leaves their PC and triggers automatic lock and sleep mode. Combines distance tracking, motion analytics, and an in-house “Presence AI” network to distinguish human presence from background objects. 
2. Adaptive Dimming
   A new feature that uses head orientation detection to reduce screen brightness when the user isn’t looking—improving power savings without compromising experience. “Achieving this with just 64 pixels of depth data is a technical marvel,” Lemarchand noted. 
3. Wake-on-Attention
   An upgrade from “Wake-on-Approach,” this feature wakes the device and triggers Windows Hello login only when the user is both near and visually engaged. It leverages two parallel AI networks: Body Posture and Head Orientation. 
4. Multi-Person Detection (MPD)
   Enhances on-screen privacy by identifying up to three individuals behind the primary user, issuing alerts when potential onlookers linger—a valuable security feature in public workspaces. 
5. Hand Gesture Recognition
   Introduces two new interaction modes: motion gestures (swipe, tap) and hand postures (like, dislike, love, flat hand), powered by a fourth, publicly available AI network accessible via ST’s Edge AI Suite. Developers can fine-tune or expand gesture sets and deploy them to STM32 microcontrollers. 
6. User Posture Monitoring
   As a proof-of-concept aimed at wellness, this feature detects poor seating postures and encourages users to adjust their position—addressing the growing health concerns of prolonged screen time. 
7. Body Posture Detection
   Supports features like Wake-on-Attention by ensuring the user is seated in a login-compatible posture. Also paves the way for ergonomic analytics in future workplace setups. 

Real-World Impact: ESG, User Experience & AI Efficiency

Highlighting the environmental benefits, Grotard emphasized that ST Presence Gen 5 could reduce energy consumption by over 20% per PC per day. If deployed across ST’s own 50,000 employees, it could save 118 tons of CO₂ daily—equivalent to 120 transatlantic flights. At a global scale, this equates to the carbon footprint of 123,000 fully charged electric vehicles per day.

This combination of high-impact ESG outcomes, enhanced user convenience, and seamless privacy makes ST Presence Gen 5 a compelling choice for OEMs looking to differentiate on sustainability and user experience.

AI at the Edge, Built for Integration

What makes ST Presence particularly scalable is its minimal footprint. Despite running four AI networks, the solution is designed for low-resolution, edge-AI environments. All algorithms run on a sensor hub, with no need to activate the main CPU. This enables integration into any STM32-based microcontroller platform, reducing BOM cost and design complexity.

ST also offers a complete ecosystem—from sensor modules and microcontrollers to reference designs and evaluation kits—streamlining OEM adoption.

Closing Remarks

“This is all about delivering a smart, secure, and power-efficient user experience without compromising privacy,” Grotard concluded. “ST Presence Gen 5 is a testament to what’s possible when innovation in sensing, optics, and AI converge on the edge.”

With ST Presence Gen 5, STMicroelectronics reaffirms its leadership in smart sensing and edge AI—creating meaningful impact across personal computing, sustainability, and user wellness.

The post STMicroelectronics Unveils Fifth Generation of Human Presence Detection Technology: Redefining Privacy, Power Efficiency, and User Experience in PCs appeared first on ELE Times.

Offered in the Compact SlimSMA HV (DO-221AC) Package, 1 A and 2 A Devices Offer Low Capacitive Charge and High Minimum Creepage Distance of 3.2 mm

Vishay Intertechnology, Inc. introduced three new Gen 3 650 V and 1200 V silicon carbide (SiC) Schottky diodes in the compact, low profile SlimSMA HV (DO-221AC) package. Featuring a merged PIN Schottky (MPS) design and minimum creepage distance of 3.2 mm, the 1 A VS-3C01EJ12-M3 and 2 A VS-3C02EJ07-M3 and VS-3C02EJ12-M3 combine low capacitive charge with temperature-invariant switching behavior to increase efficiency in high speed, hard-switching power designs.

For high voltage applications, the high creepage distance of the Vishay Semiconductors devices provides improved electrical isolation, while their SlimSMA HV package features a molding compound with a high CTI ≥ 600 to ensure excellent electrical insulation. For space-constrained designs, the diodes offer a low profile of 0.95 mm compared to 2.3 mm for competing SMA and SMB packages with a similar footprint.

Unlike silicon diodes, the VS-3C01EJ12-M3, VS-3C02EJ07-M3, and VS-3C02EJ12-M3 maintain a low capacitive charge down to 7.2 nC irrespective of temperature, resulting in faster switching speeds, reduced power losses, and improved efficiency for high frequency applications. In addition, the devices have virtually no recovery tail, which further improves efficiency, while their MPS structure delivers a reduced forward voltage drop down to 1.30 V.

With a high operating temperature of +175 °C, typical applications for the VS-3C01EJ12-M3, VS-3C02EJ07-M3, and VS-3C02EJ12-M3 will include bootstrap, anti-parallel, and PFC diodes for DC/DC and AC/DC converters in server power supplies; energy generation and storage systems; industrial drives and tools; and X-ray generators. For easy paralleling in these applications, the devices offer a positive temperature coefficient.

RoHS-compliant and halogen-free, the diodes feature a Moisture Sensitivity Level of 1 in accordance with J-STD-020 and meet the JESD 201 class 2 whisker test.

The post Vishay Intertechnology Gen 3 650 V and 1200 V SiC Schottky Diodes Increase Efficiency While Enhancing Electrical Insulation appeared first on ELE Times.

New Devices from MCU Leader Meet Demands for Performance and Compact Size; Offer Peripheral Set Targeted for Motor Control

Renesas Electronics Corporation introduced the RA2T1 microcontroller (MCU) group based on the Arm Cortex -M23 processor optimized for motor control systems. RA2T1 devices are specifically designed for single-motor applications such as fans, power tools, vacuum cleaners, refrigerators, printers, hair dryers and many more.

Feature Set Optimized for Motor Control

The new RA2T1 devices include a number of features designed to enhance motor control function, specifically in single-motor systems. One of the notable features is a 3-channel S&H function that simultaneously detects the 3-phase current values of Brushless DC (BLDC) motors. This method provides superior control accuracy as opposed to sequential measurement methods. The RA2T1 MCUs also offer complementary Pulse Width Modulation (PWM) function of the timer, which enables automatic insertion of dead time and generation of an asymmetric PWM. This function is optimized for inverter drive, which facilitates control algorithm implementation.

The RA2T1 devices offer safety features that are critical in motor control applications. They provide a Port Output Enable function and a high-speed comparator that work together to quickly shut off the PWM output when an overcurrent is detected. The shutdown state can be selected according to the inverter specifications.

Renesas Leadership in Embedded Processing for Motor Control

Renesas has shipped motor-control specific MCUs for over 20 years. The company ships over 230 million motor control embedded processors per year to thousands of customers worldwide. In addition to multiple RA MCU groups, Renesas offers motor-control specific devices in its 32-bit RX Family, its 16-bit RL78 MCUs and its 64-bit RZ MPUs.

“Customers have trusted Renesas motor control solutions for many years across thousands of systems,” said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas. “The RA2T1 MCUs enhance our leadership in this area with market-leading technology, low-power operation, and legendary Renesas quality and safety standards for single-motor systems.”

Key Features of the RA2T1 Group MCUs

• Core: 64 MHz Arm Cortex-M23

• Memory: 64KB Flash, 8KB SRAM, 2KB Data Flash
• Analog Peripherals: 12-bit ADC with 3-channel Sample and Hold, temperature sensor, internal reference voltage, 2-channel high-speed comparators
• System: High-, mid- and low-speed On-chip Oscillators; clock output; power-on reset; voltage detection; data transfer, event link and interrupt controllers; low-power modes
• Safety: PWM forced shutdown, SRAM parity error check, ADC self-diagnosis, clock frequency accuracy measurement, illegal memory access detection
• Operating Temperature Range: Ta = -40°C to 125°C

• Operating Voltage: 1.6V to 5.5V

• Packages: 48LQFP, 32-LQFP, 48-QFN, 32-QFN, 24-QFN (4mm x 4mm)

The new RA2T1 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions.

The post Renesas Debuts Best-in-Class MCUs Optimized for Single-Motor Applications Including Power Tools, Home Appliances and More appeared first on ELE Times.

The IoT Platform specifically designed for industrial applications, integrating Ethernet, RS485, CAN, and SD interfaces into a single system, and fully compatible with Arduino.

Nuvoton Technology introduced the NuMaker-UNO-M4 development board, an IoT platform based on the NuMicro M467 Ethernet / Crypto microcontroller series. It continues the classic design with industrial-grade standards, offering both ease of use and professional performance. The development board is fully compatible with Arduino pinout and additionally integrates essential industrial communication interfaces: Ethernet, RS485, CAN bus, and an SD card interface. It’s suitable for diverse application scenarios such as smart transportation, smart healthcare, smart industry, and smart homes.

The NuMaker-UNO-M4 features robust network connectivity, supporting wired connections and extendable wireless communication. It is equipped with an SD card interface for convenient long-term data logging and local storage, eliminating the need for additional data recording devices. This is particularly useful for applications requiring extensive data collection, such as smart agriculture, smart transportation, and health monitoring.

Powered by an Arm Cortex-M4 processor, it boasts hardware floating-point operations and DSP acceleration capabilities, supporting audio processing, vibration analysis, and small-scale AI applications, enhancing system performance and intelligence.

The NuMaker-UNO-M4 seamlessly integrates with the Arduino integrated development environment (IDE) and Nuvoton’s exclusive libraries, lowering development barriers. It also supports USB direct programming, streamlining the development process. Through Nuvoton’s comprehensive software development tools, combined with Nuvoton NuForum resources and a rich collection of example codes, even novice programmers can quickly generate code with the assistance of generative AI, accelerating development efficiency. This affordable and powerful industrial-grade development board offers developers an ideal choice that combines ease of use with professional capabilities.

Key Features of the NuMaker-UNO-M4 Development Board:

• Integrated Industrial Communication Interfaces: Ethernet, RS485, CAN bus, and SD card interface.
• Designed for Industrial-Grade Applications: Supports Modbus RTU/Modbus TCP, CAN, and MQTT applications.
• Suitable for Data Collection and Processing: Up to 1024 KB Flash Memory and 512 KB SRAM, with SD card support for long-term data logging.
• Compatible with Arduino Development Interface: Provides a high-quality and user-friendly development experience.
• Supports Network Functionality: Wired network support with optional WiFi / Sub-GHz connectivity for real-time monitoring and remote transmission.

The post NuMaker-UNO-M4: Industrial Intelligence Within Inches appeared first on ELE Times.

Leveraging its expertise in magnetic position sensors, Infineon Technologies AG has launched the third generation of the XENSIV 3D magnetic Hall-effect sensor family, comprising three product series: TLE493D-W3B6-Bx, TLE493D-P3B6, and TLE493D-P3I8. Developed in accordance with ISO26262, the sensor family provides integrated diagnostic functions to support functional safety applications up to ASIL-B. Due to their high flexibility, the devices are ideal for a wide range of industrial, consumer, and automotive applications, such as long-stroke linear position measurement, angular position measurement, automotive controls, and pedal or valve position sensing. In automotive applications, they enable control in the interior and under the hood, leveraging three-dimensional measurement functions and high-temperature resistance.

The new sensor family measures the magnetic field in three orthogonal dimensions and operates as an I²C or SPI bus slave. The devices offer enhanced magnetic performance and accuracy, with very low deviation over their lifetime (X/Y < 1.7% X-Y/Z = 6.75%). The 3D magnetic measurement principle and platform adaptability enabled by the device’s configurability allow for a reduction in the number of required components. Additionally, the system’s power consumption is very low due to its wake-up mode. The TLE493D-X3XX supports a supply voltage of 3.3 V and 5 V and offers 3D magnetic field measurement ranges of ±50 mT, ±100 mT, and ±160 mT. With these linear magnetic range options, the sensors are well-suited for controlling elements in infotainment and navigation systems and multifunction steering wheels. Furthermore, the devices operate reliably in a temperature range of -40°C to 150°C.

The post XENSIV magnetic 3D sensor enables high-precision position detection in automotive, industrial, and consumer applications appeared first on ELE Times.

Taking place from October 28 to 30, 2025 at the Shenzhen World Exhibition & Convention Center (Bao’an), NEPCON ASIA is the premier platform to discover the latest technologies and market trends, connect with new suppliers and products, and explore potential partnerships and distribution opportunities.

Featuring an ever-expanding showcase of automation equipment and technologies, the show empowers you to optimize your supply chain, reduce costs, and ensure quality and yield — all driving sustained growth in the electronics manufacturing industry.

Hundreds of New Product Launches

NEPCON ASIA 2025 will showcase hundreds of new products and solutions across SMT, testing and measurement, soldering, dispensing, semiconductor packaging, and automation. The show will feature over 600 leading exhibitors, including Yamaha, Hanwha, Fuji, Kurtz Ersa, Rehm, Tamura, Koh Young, TRI, ALEADER, Unicomp, Anda, and Axxon, connecting them with millions of buyers from high-growth sectors such as automotive electronics, semiconductors, and new energy.

The event aims to engage more than 2,000 buyers from emerging fields like low-altitude flight, embodied robotics, and AI, offering exhibitors invaluable exposure to new sectors.

Breakthrough Areas Driving Innovation

Several standout themed areas will debut, integrating industry resources and cutting-edge technologies, while showcasing packaging, testing, flexible manufacturing, assembly, and key components.

Key themed areas include:

• AI Smart Glasses Disassembly Area
• Flexible Manufacturing and Intelligent Transport System Area
• Low-Altitude Flight Components Disassembly Area
• Embodied Intelligence Robot Core Parts Disassembly Area
• Electronic Finished Products Automated Packaging Demonstration Area
• IGBT & SiC Packaging and Testing Demo Line

Conferences Empowering Industry Growth

NEPCON ASIA 2025 will host 40 high-level conferences covering advanced manufacturing, semiconductors, power electronics, robotics, and AI, empowering businesses to explore future technologies and seize new growth opportunities.

The SMTA South China High-Tech Workshop will feature global experts from China, the US, Japan, and Thailand, providing forward-looking insights for businesses.

The post NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities appeared first on ELE Times.

Under the scheme of the Ministry of Electronics and Information Technology (MeitY), the Government of India has given an in-principle approval to set up a ₹417 crore Electronics Manufacturing Cluster (EMC 2.0) in Gautam Buddha Nagar, Uttar Pradesh. Located on a vast, opulent 200-acre piece of land that is overseen by the Yamuna Expressway Industrial Development Authority (YEIDA), the project is estimated to garner investments of around ₹2,500 crore and generate approximately 15,000 direct jobs.

The cluster enjoys strategic location along the corridors of Yamuna Expressway, Eastern Peripheral Expressway, and the upcoming Palwal-Khurja Expressway. The Noida International Airport, which is being developed in Jewar, and the essential logistics hub of a railway station are both conveniently located nearby. Adjacent to this will be complementary zones like the Medical Device Park, MSME & Apparel Park, and planned Aviation Hub which will enhance things up in the regional industrial ecosystem.

Targeted Areas in the EMC 2.0:

Sectors	Examples
Consumer Electronics	TVs, Audio Systems, Smart Appliances
Automotive Electronics	Sensors, EV Controllers, Infotainment
Medical Devices	Diagnostics Devices, Monitors, Wearable Tech
Communication Equipment	Routers, Base Stations, 5G Infrastructure
Computer Hardware	Laptops, Servers, Data Storage Devices

 

The clusters are essentially ready-to-use factory sheds, supported by substantial power supply, water supply, sewage treatment, on-site accommodations, a healthcare system, and skill development centres.

Increasing Employment and Innovation:

Union Minister Ashwini Vaishnaw mentioned that components like this, conceived to generate 15,000 jobs and also enhance innovation and manufacturing excellence. It is furthered by this project to reduce the country’s import dependence by fostering high-growth sub-sectors such as semiconductors, IoT devices.

Government’s Vision:

Union Minister Ashwini Vaishnaw commented that this project is in alignment with PM Modi’s vision of Atmanirbhar Bharat and is a catalyst toward making India into a global electronics hub.

Besides, the upliftment of Uttar Pradesh in the electronics manufacturing sector is an emerging proposition on account of some of the really well-conceived policy initiatives, such as the UP Semiconductor Policy 2024, that encourage strategic location near burgeoning logistics and transport corridors.

Road Ahead:

With nearly ₹30,000 crore invested under the National EMC Scheme so far, more than 520 companies, and 86,000-plus jobs, the Noida EMC is yet another important tier towards India becoming a global electronic manufacturing hub.

While infrastructure and bureaucratic efficiency remain focal areas, UP’s consistent policy support, along with multimodal connectivity and cluster synergy, strongly position it to capture a significant share of India’s electronics future.

India’s digital production ecosystem has observed rapid growth over recent years. Over 55% of India’s smartphone production occurs in Uttar Pradesh, showcasing the state’s dominance in the sector. More than 86,000 jobs have been created, and more than 520 companies have come into existence across the country under the EMC initiatives. It further got a boost with the approval of the Foxconn-HCL Joint Venture near Jewar wherein an amount of ₹3,706 crore is being invested, and by 2027, this joint venture is expected to chip out 36 million semiconductor chips per month

Conclusion:

The ₹417 crore EMC in Noida is not just an infrastructure project but the cornerstone for creating a sustainable, job-rich, and globally competitive electronics ecosystem. With strong support from the state and union governments, this cluster will turn UP into a national leader in the electronics value chain.

The post Government-Backed EMC in UP to Accelerate India’s Electronics Growth appeared first on ELE Times.

Anritsu Corporation announced that its receiver test (SINK Test) solution for the latest DisplayPort 2.1 standard has been certified by the Video Electronics Standards Association (VESA), the international standards organization. Combining Anritsu’s Signal Quality Analyzer-R MP1900A with automation software from Granite River Labs (GRL) or Teledyne LeCroy achieves automated verification of data transmission quality and calibration.

DisplayPort 2.1 enables the digital transmission of high-definition and high-refresh-rate video, such as 8K. The standard is still being developed. Recently, the integration of the USB Type-C specifications has led to a significant expansion in the versatility of DisplayPort 2.1 and its adoption across a wide range of applications. However, a challenge facing the development of products that comply with the new standard is that manually verifying transmission signal quality and calibrating are time-consuming due to the complexity of the test equipment settings and the lengthy configuration and test procedures. This solution improves development efficiency and ensures the quality of video data transmission by automating the testing and calibration processes.

The post Anritsu Gains Certification for Latest DisplayPort 2.1 Video Interface Standard Testing Solution appeared first on ELE Times.

Infineon Technologies AG is expanding its offering for universal serial bus (USB) tokens, dongles, security keys, and other hardware authenticators with the introduction of the new Infineon ID Key family. The newest member, the ID Key S USB is a highly secured and versatile product designed for a wide range of USB- and USB/NFC-token devices and applications. It combines the security, performance, and reliability of the Infineon SLC38 security controller with a USB bridge controller in one single package. It is a unique system-in-package solution that enables high flexibility and simplifies complex application deployments while reducing the bill of materials and related costs. Certified to highest security levels, it supports a range of use cases, including certificate-based authentication, Fast Identity Online (FIDO) authentication with device-bound passkeys, digital signatures, encryption, access control, software protection, and cryptocurrency hardware wallets.

The increasing need for secured online transactions and the growing threat of cyber-attacks have created a surge in demand for secured and hardware-backed authentication solutions. “As the market shifts towards more secured and convenient authentication methods, we see a growing trend towards the adoption of advanced security solutions,” said Maurizio Skerlj, Senior Vice President and Product Line Head Authentication & Identity Solutions at Infineon’s Connected Secure Systems Division. “With the ID Key S USB, we are well-positioned to address this trend and provide our customers with a robust solution that meets their needs.”

The ID Key S USB offers a range of key features that support its secured and versatile design and boasts a comprehensive array of features. Its high-performance capabilities are driven by a 32-bit CPU clocked at 100 MHz and a large 24 kB RAM, enabling ultra-fast and secured execution of applications and delivering excellent operating system performance for a wide range of use cases. The device also offers sufficient memory, with non-volatile memory sizes of up to 800 kB providing ample storage for large amounts of data, cryptographic keys, software, and multiple applications. Furthermore, the ID Key S USB has achieved highest security levels, with certification to CC EAL 6+ (high) and compliance with FIPS 140-3 hardware requirements, allowing customers to apply for FIPS 140-3 certification for their product. The ID Key S USB features a compact footprint of 4 x 4 x 0.85 mm, making it ideal for integration into space-critical token devices.

The post Infineon expands security controller portfolio for USB tokens with new ID Key S USB for more security and versatility appeared first on ELE Times.

Texas Instruments (TI) has wrapped up the fourth edition of its month-long Women in Semiconductors and Hardware (WiSH) program. WiSH is TI’s flagship mentorship initiative aimed at inspiring and empowering second-year female engineering students across India to pursue impactful careers in core engineering, with a focus on semiconductors and hardware. Built on the previous three editions’ success, the 2025 program attracted over 1,500 registrations and more than 190 participants, reflecting a growing interest in the initiative over the years.

“The semiconductor industry is evolving rapidly, and the need for skilled talent is greater than ever,” said Santhosh Kumar, Managing Director, Texas Instruments India. “With women representing less than 20% of the people in the technical roles in the industry the WiSH program expands access, builds confidence, and fosters engineering capabilities among aspiring women engineers in India. By investing in this next generation of talent, we are helping shape a stronger semiconductor ecosystem.”

This year’s WiSH program participants gained hands-on experience through simulation projects, lab visits, technical deep dives, and networking sessions with TI leaders. The program included three weeks of virtual mentoring, culminating in an immersive, in-person week at TI’s Bengaluru campus. During this phase, students engaged directly with mentors, industry experts, and women leaders from TI.

“The WiSH program provided me the right platform to go beyond classroom learning. We had access to labs where we gained hands-on experience in simulation and circuit design,” said Poornima Kulkarni, Analog Engineer at TI India and a previous WiSH participant. “What makes it unique is the mentorship by subject matter experts to guide aspiring engineers through the course of the program.”

Texas Instruments remains committed to fostering diversity and inclusion within the technology sector. Through initiatives such as WiSH, TI helps to bridge the gender gap in STEM fields and empower the next generation of engineers to lead and innovate in the semiconductor industry.

The post Texas Instruments India concludes fourth annual WiSH program appeared first on ELE Times.

Following the resounding success of the Pune and Ahmedabad sessions, Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is geared-up to continue the 6th edition of its India Technical Roadshow with upcoming stops in Chennai on July 11 and Bengaluru on July 17, 2025.

The roadshow serves as a platform for design engineers, technology leaders, FAEs, OEMs, EMS professionals and ecosystem enablers to engage with emerging developments in IoT through in-depth technical sessions, live demonstrations, and valuable networking. Our technology partners – Analog Devices, Littelfuse, Molex, Phoenix Contact, Samtec, Silicon Labs, Taiyo Yuden, Bel Fuse and Würth Elektronik  showcase their newest innovations and solutions to support next-generation electronic design at the India Technical Roadshow.

“We are thrilled by the energy and enthusiasm we have experienced at the India Technical Roadshow in the past years,” said Daphne Tien, Vice President of Marketing and Business Development for Mouser APAC. “India’s technology ecosystem is evolving rapidly, and this roadshow reflects our commitment to supporting that momentum. With tailored themes and practical sessions, our aim is to deliver knowledge that truly resonates with local engineers and empowers them to turn ideas into impactful innovations.”

The Chennai event, to be held at Hyatt Regency, will focus on smart manufacturing. Participants will explore strategies to future-proof factory floors using edge computing, industrial machine vision, advanced automation, and intelligent communication protocols that enhance efficiency and reliability.

India Technical Roadshow at the Taj, MG Road, Bengaluru, will bring the series to a close with a deep dive into rugged electronics. The sessions will delve into design principles for building high-resilience systems suited for harsh environments, with insights into thermal management, shock resistance, and standards-compliant design, including MIL-STD and IP-rated components.

Mouser Electronics provides comprehensive design support through its vast technical resource library on engineering topics that will shape the future. You can access exclusive technical information through our Empowering Innovation Together series, eBooks, newsletters and new product emails, and online tools to accelerate your project.

As a global authorized distributor, Mouser offers the widest selection of the newest semiconductors, electronic components and industrial automation products. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Engineers can stay abreast of today’s exciting product, technology and application news through Mouser’s complimentary e-newsletter. Mouser’s email news and reference subscriptions are customizable to the unique and changing project needs of customers and subscribers. No other distributor gives engineers this much customization and control over the information they receive. Learn about emerging technologies, product trends and more by signing up at https://sub.info.mouser.com/subscriber/.

The post Mouser Electronics Heads South with India Technical Roadshow appeared first on ELE Times.

Author: STMicroelectronics

Over the past decade, smartphones have evolved far beyond their original purpose, integrating everything from complex applications to higher-quality cameras. Yet with each new capability comes the demand for more power – and with it, the need for more regular recharging. Given the need to be connected to a power socket for charging, it’s usually an act that takes the “mobile” out of mobile phone. 

Several innovations are exploring solutions to this issue of ‘battery drain’. The development of more energy-efficient chips will provide the processing needed for the next generation of app and smartphone capabilities while consuming less energy. Alongside this, advances in energy management chips will more efficiently convert and distribute power within the device. And research into new energy harvesting materials and techniques may, ultimately, see smartphones able to charge themselves.

Advancements in smartphone chip efficiency and power management 

The semiconductor sector continually looks to deliver increased performance while reducing power consumption. Smartphones make use of the most advanced semiconductor process technologies. Today, this typically means sub-5nm node processes, though even smaller process nodes are in development.  In simple terms, smaller nodes mean smaller transistors, which allows greater transistor density in the same area of silicon. This is key to increased performance but also supports improved energy efficiency.  

Several factors support the enhanced energy efficiency and reduced power consumption of the latest generation of smartphone chips. These include shorter interconnects between transistors, lower operating voltages required by smaller transistors, transistor architectures that reduce power leakage (an issue that can increase as process node size decreases), and chips which dynamically adjust power based on device workload. 

Further to the overall advancement of semiconductor process technologies, there has been an emergence of chips specifically designed for power management in devices. Power Management Integrated Circuits (PMICs) – including those from ST – control, allocate, and regulate power delivery within devices and are fundamental in optimizing performance and extending battery life.  As an endorsement of the importance of power management to the smartphone sector, the PMIC for smartphones market, already valued globally at over $6 billion in 2022, is expected to grow to over $10 billion by 2030. 

The PMIC within a smartphone converts power from the battery to the specific voltages needed by components like the CPU, GPU, modem, display, and memory, ensuring that each component receives stable power, crucial for performance and reliability.  The PMIC also controls how power is routed to different subsystems based on usage, potentially cutting off power to unused modules – for instance GPS or Bluetooth – to save energy. The PMIC also manages battery charging itself, protecting the battery from overcharging, overheating, and over-discharging, enhancing battery life.

While improving the energy efficiency of chips and overall power management within devices will help extend battery life, research and development continues in relation to materials that may ultimately remove the need to physically recharge mobile devices entirely. 

The emergence of energy harvesting materials

Piezoelectric materials, which occur both naturally or can be artificially manufactured, generate an electric charge when subject to pressure. Piezoelectric materials themselves aren’t a new discovery. Indeed, anyone who’s owned a quartz wristwatch has benefitted from their natural capabilities. But their potential in smartphones is just being unlocked. 

The pressure applied to a piezoelectric material’s crystal lattice – the structure of atoms in a solid material – causes the atoms to shift slightly, creating an electric charge. This transformation of mechanical force into electricity is known as the piezoelectric effect. Natural piezoelectric materials include, as mentioned, quartz (or silicon dioxide) but also Rochelle salt, topaz and, in biological systems, bone. Many synthetic piezoelectric materials can also be manufactured. 

There are several ways that the electric charge created by physical interaction with piezoelectric materials can be used by smartphones to self-charge. Users simply touching or swiping a screen, pressing device buttons, or even the movement of the smartphone itself in a bag or pocket, can result in an ongoing series of electric charges to extend battery life and reduce the regularity of charging required. 

Light, heat, movement, and even air: the broader potential for energy harvesting

In addition to piezoelectric materials, research continues into how almost every natural resource could be used as an energy source for smartphones.  Innovations in ultrathin, transparent photovoltaic (PV) cells integrated into smartphone screens or back panels show promising potential in the near-term. Thin film PV cells are relatively low cost, have a high level of technology readiness, and can be integrated easily within the case of a smartphone. Additional advantages are that PV cells add negligible weight to a smartphone and have the best energy per volume generation, particularly outdoors. Working in ambient light, PV cells could provide continuous “trickle charging” to mobile devices. 

Similar in some ways to piezoelectric materials, triboelectric energy harvesting uses friction between materials – for instance when swiping a screen – to generate electricity. Rather than electric charge generation being a property of the material itself, triboelectric energy harvesting works more like static electricity, where electrons move between two materials when they are rubbed or moved apart. 

Thermoelectric energy harvesting converts changes in temperature to electricity. Flexible thermoelectric materials might therefore be able to turn an individual’s body heat into electricity and therefore provide passive energy harvesting for a smartphone or mobile device. Again, some “self-winding” wristwatch wearers will be aware of motion-based battery charging, where simply moving while wearing the watch extends the battery life considerably. Similar kinetic energy harvesting could also be used in smartphones, where tiny mechanical generators convert motion – an individual walking or running, or a device being shaken or tilted – into electricity. 

Future micro-electromechanical system (MEMS) may even focus on converting air to energy through air powered micro fuel cells. The process uses oxygen in ambient air in an electromechanical reaction creating electricity. Such fuel cells could, ultimately, become a replacement for lithium-ion batteries in smartphones.

 

Providing power for our primary computing devices

For many, the smartphone has become the primary computing device used to manage their personal and professional lives. The processing power of current and next-generation smartphones is moving towards equality with that of laptop computers.  

With the need to remain as portable as possible, however, this means that the additional performance must be matched with improved energy efficiency and a significant improvement in battery life.  Ultimately, smartphones will use a combination of many of the techniques described above to optimize device performance while harvesting energy to extend battery life, reducing the reliance on regular charging and contributing to a more sustainable ecosystem. The silver screen vision of smartphones and mobile devices that never need charging may still be a way off, but the ability to access peak performance without an anxious search for a power source is within reach.

The post Power in Motion: how self-charging phones will quite literally put power in consumer’s hands appeared first on ELE Times.

• Rural Rising initiative has reached more than 350,000 individuals across Bangarpet and Mulabagilu Taluks
• New Taluk-Level Community Library launched to enhance educational access

Applied Materials India Private Limited in partnership with United Way Bengaluru (UWBe) celebrated a decade of transformative impact in the Kolar district through their flagship initiative, The Rural Rising. This milestone celebrates a journey of growth, sustainable development, and community empowerment that has reached more than 350,000 individuals across 288 villages in Bangarpet and Mulabagilu taluks.

To commemorate the occasion, a Taluk-level community library was inaugurated, reinforcing the initiative’s commitment to educational access and lifelong learning. Avi Avula, Country President of Applied Materials India and Vice President, Semiconductor Products Group, Asia, along with Rajesh Krishnan, CEO, United Way Bengaluru attended the event.

“This milestone is not just a celebration of what we’ve achieved, but a reaffirmation of what’s possible when business, community, and purpose come together”, said Avi Avula. “The Rural Rising initiative has shown us the power of sustained engagement in driving meaningful change”, he added.

A Model for Sustainable Rural Development

Launched in 2015, The Rural Rising initiative was conceived by United Way Bengaluru and implemented by Applied Materials India to address the unique needs of rural communities through a four-pillar approach: education, environment, health, and livelihood. Key achievements over the past decade include:

• Education:
  • 2,299 students mentored and supported through scholarships and enriched learning environments
  • Launch of a new community library to promote literacy and digital access
• Environment:
  • 7 lakes rejuvenated
  • 434 solar-powered streetlights installed
  • 203 tonnes of CO₂ emissions reduced annually
• Livelihoods:
  • 1,170 women, people with disabilities, and rural youth empowered with income-generating skills
  • 561 farmers supported through soil and water conservation programs
  • 8+ community water ATMs installed, benefiting over 4,000 residents
  • Improved sanitation and hygiene infrastructure across villages

“Collaboration is at the heart of the Rural Rising flagship program. By partnering with Applied Materials India, local authorities, and the community, we have made sure that local perspectives are taken into the development process, from planning to implementation. This way, we are helping them take charge of their own progress and build lasting, self-sustaining change in Kolar, said Rajesh Krishnan, CEO of United Way Bengaluru.”

Scaling the Vision Beyond Kolar

Inspired by the success in Kolar, Applied Materials India and UWBe have expanded The Rural Rising to Coimbatore (Tamil Nadu), and Khed Taluk (Pune, Maharashtra). These new chapters will build on the proven model, focusing on education, sports infrastructure, and ecological sustainability. With continued investment and collaboration with local governments, the initiative is poised to scale its impact and enable long-term, community-driven transformation across rural India.

The post Applied Materials India and United Way Bengaluru Mark 10 Years of Rural Transformation in Kolar appeared first on ELE Times.

The rapid advancement of electrification has revolutionized the energy and mobility sectors and provides decisive impulses for industry and society. Power electronics is the indispensable driver of this transformation. With the acquisition of ZES ZIMMER Electronic Systems GmbH, Rohde & Schwarz complements its broad T&M portfolio.

In the constantly changing market environment of the past few decades, ZES ZIMMER Electronic Systems GmbH has managed to achieve continuous growth through innovative solutions and products. The ZES ZIMMER Electronic Systems GmbH portfolio will contribute to expanding the market position of Rohde & Schwarz in the field of power electronics. The family owned company in Hesse with around sixty employees will be fully integrated into the Rohde & Schwarz group. The location will be retained and will continue to be used for power measurement equipment.

For Christina Geßner, Executive Vice President Test & Measurement Division, the acquisition is an important next step that contributes to the sustainable growth strategy of the global technology group: “Both Rohde & Schwarz and ZES ZIMMER Electronic Systems GmbH are privately owned companies with a long tradition. A passion for technology and innovation has always been in the DNA of both our companies. The acquisition will further strengthen our position as a relevant and reliable technology partner for our customers in the field of power measurements, create synergies and generate further growth.”

ZES ZIMMER Electronic Systems GmbH has been an established name in the power measurement market for more than 40 years and not only has a broad customer base but also a strong sales network. The privately-owned company’s exceptionally strong product portfolio supports a wide range of industry-leading use cases and applications, particularly in the electromobility, industrial electronics and renewable energy sectors. The future consolidation and bundling of expertise and portfolios represent a significant expansion of the Test & Measurement Division’s existing offering in the field of power electronics.

Dr. Conrad Zimmer, Managing Partner of ZES ZIMMER Electronics Systems GmbH, says: “Decarbonisation and electrification of various industries will have a major impact on the demand for power electronics and power measurements in the coming decades. A merger with Rohde & Schwarz will allow ZES ZIMMER to make the best use of these growth opportunities. Georg Zimmer founded the company in 1980, and over the last four decades, the employees have built a company with a passion for technology and engineering, whose products are known and appreciated worldwide. I thank our customers for their trust in the company and its products, and all our employees for their dedication and loyalty, and I believe that as a privately-owned company that thinks long term, Rohde & Schwarz will continue the success story of ZES ZIMMER.”

The complete takeover of ZES ZIMMER Electronic Systems GmbH into the Rohde & Schwarz group is an important building block in the long-term growth strategy. At the same time, Rohde & Schwarz is expanding its development capacity with the acquisition and strengthening Germany as an industrial and technological powerhouse.

The post Rohde & Schwarz acquires ZES ZIMMER Electronic Systems GmbH and expands its T&M portfolio for power electronics appeared first on ELE Times.

Designed for Permanent Contact With Variety of Liquids, AEC-Q200 Qualified Device Eliminates the Need for Costly Wire to Wire Connectors

Vishay Intertechnology, Inc. introduced a new AEC-Q200 qualified NTC immersion thermistor. Featuring a miniature design with a compact sensor tip and thin insulated wire, the Vishay BCcomponents NTCAIMM66H is ideal for the small spaces of liquid-cooled automotive systems, where it provides a fast 1.5 s response time to temperature changes.

The rugged device released consists of a miniature NTC thermistor mounted in a stainless steel 316L housing with lead (Pb)-free brass, and 0.35 mm² AWG#22 insulated lead wires with a FLR2X construction that enables a traction force higher than 30 N. These wires allow for direct crimping with automotive connectors eliminating the need for costly wire to wire connectors while the stainless-steel housing enables permanent contact with water or other liquids.

The NTCAIMM66H will be used for temperature measurement, sensing, and control in liquid-cooled automotive systems such as HEV/EV on-board chargers (OBC) and charging plugs and sockets, in addition to solar heating systems, energy storage systems, industrial drives and tools, and servers. The device can be customized with different cable and stripping lengths, gauges, and conductor plating to meet the need of specific applications, enabling Vishay customers to integrate the thermistor into their complete sensor solutions for HEV / EV thermal management systems (TMS).

The immersion sensor offers resistance at +25 °C (R25) of 10 kΩ, with tolerance of ± 2 %, and beta (B25/85) of 3984 K, with tolerance of ± 0.5 %. The device features maximum power dissipation of 100 mW and an operating temperature range of -40 °C to +125 °C.

The post Vishay Intertechnology NTC Immersion Thermistor Delivers Fast 1.5 s Response Time for Liquid-Cooled Automotive Systems appeared first on ELE Times.