Новини світу мікро- та наноелектроніки

Precision-matched capacitor pairs are commercially available items, but only in a limited range of values, working voltage, and dielectrics.

Plus, sometimes an extra critical application with extra tight tolerances (or an extra tight budget) can dictate a little (or a lot) DIY. For example, see “Inherently DC accurate 16-bit PWM TBH DAC.”

Wow the engineering world with your unique design: Design Ideas Submission Guide

Figure 1’s matchmaker circuit can help make the otherwise odious chore of searching through a batch of parts for accurately matching pairs quicker and a bit less taxing. Best of all, it does precision matchmaking (potentially to the ppm level) with no need for pricey precision reference components.

Here’s how it works.

Figure 1 Flip-flop U2b generates complementary excitation of the A and B capacitors under test.

Complementary (equal but opposite) excitation of the A and B capacitors under test implies that if Ca = Cb, then the charges passed will exactly cancel out, yielding a null at OUTPUT. If they differ, however, then an integrated output signal of 50 mV per % of mismatch will result if C3, C5, C4, and Cab (capacitors randomly selected from the trial batch) are equal in value, e.g., 0.68 µF. This signal is synchronously rectified by U1b, then integrated and buffered by the U1c and A1 feedback loop.

If Ca > Cb, the “A > B” output polarity will be positive relative to “B > A”. The reverse is also true: If Cb > Ca, the “A > B” output polarity will be negative relative to “B > A”.

Resolution of the match measurement will depend on the voltage resolution of the digital voltmeter (DVM). If that’s 1 mV, then matching to ±1/50th of 1%, or ±0.02%, will be possible. If it’s 100 µV (typical of a standard 3¾ digit multimeter with a 300 mV scale), then matching to ±0.002%, i.e., ±20ppm, is doable. And so on…

Measurement gain is inversely proportional to C4. So, if you need more resolution, simply decrease C4 to gain gain.

Figure 2 The U1aU2a multivibrator waveforms; the green waveform is the R3R4 junction, and the red waveform is U2 pin 6. The frequency is 0.1mHz/C3.

Note that the U1aU2a clock’s frequency precision and stability is somewhat dubious (even if we’re charitable). Happily, the accuracy of the ultimate Ca/Cb match doesn’t depend on a stable clock. Neither does match accuracy depend on the output impedances of D2b’s complementary outputs, not even on their symmetry!

Both insensitivities derive from the fact that it’s the transferred charge that forms the basis of matchmaking precision, and therefore neither current nor voltage matters very much.

However, due to the temperature sensitivity of some dielectrics, it’s probably a good idea to handle tested devices with thermally insulating gloves. This will save time and frustration waiting for them to equilibrate, not to mention possible outright erroneous results. Those are also known to cause frustration!

My thanks go to frequent contributor Christopher Paul for suggesting the utility of capacitor precision matching, and as always, to DI editor Aalyia Shaukat for this marvelously productive DI EE ecosystem we inhabit.

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

 Related Content

• Matchmaker
• Circuits help get or verify matched resistors
• Inherently DC accurate 16-bit PWM TBH DAC

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During the first five months of FY 2025–26, notwithstanding non-uniform global demand, India’s external trade sector continued to show resilience. Provisional data published by the Ministry of Commerce & Industry state that the cumulative exports both for merchandise and services aggregated to US$ 349.35 billion during April to August 2025, registering a 6.18% year-on-year growth when compared to US$ 329.03 billion during the same period in 2024.

The Ministry, however, went on to say that growth was led by electronics, engineering goods, gems & jewellery, petroleum products, and pharmaceuticals, where services continued to be another key anchor. More importantly, India’s overall trade deficit has narrowed, pointing to a better external balance.

Merchandise exports reached US$ 184.13 billion, a modest 2.52% rise from US$ 179.60 billion last year. Within this, non-petroleum exports showed stronger momentum, climbing to US$ 158.07 billion from US$ 147.25 billion, a 7.35% increase that reflects resilience in India’s core manufacturing and agricultural sectors.

During the same time period, imports were US$ 390.78 billion, up just 2.49% from US$ 381.30 billion the previous year. The country’s trading condition improved as seen by the trade deficit for April–August 2025, which decreased from US$52.27 billion in 2024 to US$41.42 billion.

August 2025:

August proved to be a very successful month for exports, with total shipments totaling US$69.16 billion, up 9.34% from the previous year. In contrast, imports dropped 7% to US$79.04 billion, which significantly decreased the monthly deficit.

• Merchandise exports: US$ 35.10 billion (vs. US$ 32.89 billion in Aug 2024)
• Merchandise imports: US$ 61.59 billion (vs. US$ 68.53 billion)
• Services exports: US$ 34.06 billion (vs. US$ 30.36 billion)
• Services imports: US$ 17.45 billion (vs. US$ 16.46 billion)
• Trade deficit: US$ 9.88 billion, significantly lower than US$ 21.73 billion in August 2024

Sector-Wise Export Drivers (August 2025):

• Electronics: +25.93%, reaching US$ 2.93 billion (vs. US$ 2.32 billion in 2024)
• Engineering goods: +4.91%, totaling US$ 9.90 billion (vs. US$ 9.44 billion)
• Gems & jewellery: +15.57%, valued at US$ 2.31 billion (vs. US$ 2.00 billion)
• Petroleum products: +6.54%, at US$ 4.48 billion (vs. US$ 4.20 billion)
• Pharmaceuticals: +6.94%, climbing to US$ 2.51 billion (vs. US$ 2.35 billion)

India’s export base is diverse, as evidenced by the double-digit rise in cereals, coal & minerals, tea, dairy, poultry, ceramic items, and rice, in addition to these main categories.

The services sector remained a bright spot in India’s external trade. Between April and August 2025:

• Services exports were estimated at US$ 165.22 billion, rising from US$ 149.43 billion last year.
• Services imports stood at US$ 84.25 billion.
• This led to an increase in the surplus from US$ 68.25 billion to US$ 80.97 billion.

This surplus illustrates the worldwide competitiveness of Indian IT services, digital solutions, consulting, and financial services and continues to serve as a crucial buffer against India’s merchandise trade deficit.

Exports in August expanded strongly across both traditional and new destinations:

• UAE: +23.42%
• USA: +7.15%
• Netherlands: +17.87%
• Hong Kong: +62.46%
• China: +22.38%

The sharp rise in shipments to Hong Kong from gems & jewellery and electronics and greater growth to China above all signify an emerging trade linkage of India with Asia, while UAE and USA have stood as reliable supporting engines for export demand.

Key Sources of Imports

On the import front, India saw larger inflows from Russia, Saudi Arabia, Ireland, Iraq, and Qatar. While energy imports seemed to remain the largest from Russian and Middle Eastern suppliers, Ireland became an important source for specialized and high-value imports.

Conclusion:

The Ministry of Commerce & Industry emphasized that the narrowing of the trade deficit alongside the strong growth in the merchandise and services sector testifies to India’s ability to evolve with the shifting global trade dynamics. Electronics, pharmaceuticals, and engineering products are expected to continue to be the main pillars, while agricultural exports add further support.

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An expansion of TI’s comprehensive C2000 portfolio, the new MCUs transform the performance of household appliances and power tools

What’s new

Texas Instruments (TI) introduced its most affordable C2000 real-time microcontrollers (MCU), enabling engineers to design products with industry-leading performance at a lower cost. The F28E120SC and F28E120SB MCUs deliver 30% faster computing power compared to previous C2000 MCUs for single motor and power factor correction systems, helping transform the performance of home appliances, from washing machines and dishwashers to vacuum cleaners and power tools.

Powered by TI’s proprietary InstaSPIN field-oriented control (FOC) software and advanced algorithms, these new MCUs enable smoother, quieter and more efficient motor performance. Their advanced capabilities – including high-speed sensorless FOC, high-torque zero-speed startup and sophisticated vibration compensation – deliver highly precise, responsive motor control for everyday applications.

Why it matters

Today’s consumers demand appliances and power tools that operate as efficiently, smoothly and quietly as possible. Yet, historically, system designers have had to compromise by using MCUs with less computing performance and analog integration to meet cost targets.

The F28E12x series of MCUs helps solve this challenge by delivering the performance needed to enable premium motor-control features at a lower price than competing devices. These MCUs eliminate additional components by integrating TI’s C28x digital signal processor core and industry-leading analog peripherals, including a high-speed analog-to-digital converter and programmable gain amplifier, helping simplify designs and lowering costs.

“Since their introduction in the 1990s, TI C2000 MCUs have allowed designers to control both simple and complex motors with low latency and high reliability,” said Vivek Singhal, vice president and general manager, Application-Specific Microcontrollers at TI. “Adding fully featured, ultra-low-cost MCUs to the C2000 portfolio enables new markets to access the industry-leading real-time performance that TI is known for. Using this technology, appliance and power-tool manufacturers can deliver seamless, quiet motor operation, previously considered a luxury, at an affordable price point.”

Moreover, TI’s F28E12x series facilitates fast execution of the sensorless FOC algorithm, enabling motor speeds over 120,000rpm, or 2kHz electrical frequency. The ability to run a motor at high speeds reduces gear transition noise and improves reliability, enabling engineers to design products with smooth, quiet operation. The MCUs can also run a vibration compensation algorithm to achieve up to 60% speed ripple reduction, counteracting the acoustic noise and vibrations caused by an imbalanced load in applications such as washing machines.

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Given the rapid advances in quantum computing, it is urgent now to urge the application of post-quantum cryptography (PQC). Every industry must armor its computing infrastructure against the increasing risk of quantum-enabled attacks. The lack of a singular all-encompassing standard for PQC creates the demand from the developer community for the proactive design of adaptable, future-proof security solutions.

Emerging Requirements for PQC and the Hardware-Software Co-Design

At a recent Security Seminar, the companies governing the evolving PQC requirements and co-design approach of hardware and software were accentuated to attain strong and flexible post-quantum security.

PQC Evolution

The emerging quantum landscape has necessitated guidelines for multiple aspects of PQC. One of the most cited guidelines is the U.S.-based Commercial National Security Algorithm Suite 2.0 (CNSA 2.0), recommending advanced PQC algorithms such as Kyber, Dilithium, LMS, and XMSS.

CNSA 2.0, while good enough as a baseline, is not exhaustive. Here lie its limitations:

Algorithmic diversity gaps: Popular algorithms such as Falcon or Hamming Quasi-Cyclic (HQC) encryption are not completely integrated. The use of multiple algorithms can reduce single points of failure when used strategically.

Regional divergence: PQC regulations are under development in different regions. The Cyber Resilience Act (CRA) of the European Union, China’s proprietary research, and NIST-led standards all produce different compliance requirements. In their PQC strategies, multinational organizations need to consider these differences. Designing Agile PQC Infrastructure With PQC standards still changing, developers face the challenge of designing actual security without locking into obsolete algorithms. A PQC system that is future-ready must, therefore, provide for:

Crypto-Agility

Crypto-agility is a mechanism for developers to switch between cryptographic algorithms seamlessly with capable protocols in updating in the field. Supporting all algorithm types and hybrid models ensure that security systems flex as quantum threats and standards evolve.

Upgradability at Scale

This implies upgrading the infrastructure at scale. Dynamic hardware that can handle new software ensures systems remain secure and performant as algorithms and regulatory requirements change.

High-Quality Entropy

Reliable and unpredictable entropy is essential for the generation of encryption keys and random numbers. International standards are joining the chorus in requiring checks for high-quality entropy to guard against predictable key generation that a quantum computer might favor.

Hardware-Software Co-Design for PQC

Effective PQC cannot talk alone classically. A co-design approach agilely pairs hardware with flexible software towards future-proof systems. QRNGs use the behavior of subatomic particles to generate sequences that are truly unpredictable, so secure, and verifiable entropy at scale.

FPGA enhances the PQC infrastructure as Coprocessors performing complex algorithms efficiently. In their field-upgradable nature, they enable organizations to implement crypto-agility with regional or hybrid algorithmic models without compromising performance and trust.

Staying Prepared for Quantum Threats

PQC is no longer a future concern-it is here. Developers must now create crypto-agile, entropy-assured, and regionally adaptable systems. Leveraging QRNGs and FPGAs enables secure, upgradable cryptographic engines, ensuring resilience against the evolving quantum threat landscape.

(This article has been adapted and modified from content on Lattice Semiconductor.)

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Industries worldwide are urged to decarbonize but unable to do so at the cost of reliability, efficiency, or scale. While renewables may solve the problem in part, a number of sectors require more than just intermittent electricity-they require constant, high-temperature energy for critical processes. That’s where SMRs enter as the really disruptive solution.

Small Modular Reactors are small in size, built in a factory, and vectoral. They bring nuclear power closer to the point of use. Other than producing, carbon-free electricity their thermal energy may be used in hydrogen production, desalination, district heating, and high-temperature industrial processes. To realize all of this, however, they must be integrated with industrial systems in a very smooth manner, and that can be done only through advanced Automation.

Why Automation is the Missing Link in SMR Adoption

Whereas traditional reactors were designed to serve the national grids, SMRs are customized for local industrial deployment. This paradigm shift presents a fresh challenge to synchronize nuclear performance with the idiosyncratic, cake-and-eat-it demand profiles of industrial facilities.

Automation systems serve as the critical bridge delivering real-time monitoring, dynamic control, cybersecurity safeguards, and compliance with nuclear regulations. They ensure SMRs adapt to specific operational environments, whether it’s a refinery that needs constant thermal output or a manufacturing facility that requires flexible load-following capabilities.

Without robust automation, even the most advanced SMR designs risk deployment delays, higher costs, and integration hurdles.

What SMR Developers Should Demand from Automation Partners

To ensure swift adoption of the system for the maximization of ROI considerations, SMR developers need to consider those automation partners that are conversant with nuclear compliance and industrial operations. To name a few:

1. Scalable Control Architecture–From systems introduced into the modular skid systems all through to plant-wide DCS and SCADA integration, Rockwell’s scalable platforms grow with the industrial needs rather than become the cumbersome older platform.
2. Cybersecurity & Compliance–Rockwell systems were developed with cybersecurity requirements for nuclear control systems, such as those from NEI 08-09 and NRC, to reduce risk and audit time by minimizing the number of disjointed platforms requiring evaluation.
3. Workforce Familiarity–Many industries are already running on Rockwell automation systems. This potential transfer of knowledge can greatly reduce commissioning time and, in the contrast, training cost plus maintenance in the long term.
4. Quick Deployment and Costs–An SMR project is capital intensive, and each delay will cost. Streamlining this process through one platform of Rockwell eliminates extra work and cuts down costs of engineering and troubleshooting.
5. Ecosystem of Trusted Partners-With an integrated ecosystem covering instrumentation, analytics, digital twins, and prediction, Rockwell Inc. ensures long-term operational success for SMR facilities.

The Road Ahead: SMRs and Automation Shaping Industrial Energy

This next generation nuclear energy will be distributed, flexible, and designed by industry. SMRs can provide manufacturers, refineries, data centers, and water plants with dependable carbon-free power but require being coupled with advanced automation.

Their integration of automation at the earliest stage of SMR deployment will result in industrial companies becoming resilient, adaptable, and ready for compliance. Those who set out on the road won’t just meet the current demand for energy; they will set the benchmark for industrial decarbonization over the coming years.

(This article has been adapted and modified from content on Rockwell Automation.)

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• Unveils a Made-in-India, industry-first innovation, turning the smartwatch into a true mobility companion and empowering riders with smarter, safer, and more connected rides.
• Delivers real-time ride statistics: battery, tyre pressure, range, and safety alerts, in a simple, glanceable format.
• Built on secure APIs and user permissions, ensuring privacy while unlocking the future of intelligent, connected mobility in India.
• The smartwatch will be exclusively available on the TVS iQube official website.

Noise, India’s leading connected lifestyle brand, and TVS Motor Company (TVSM), a global leader in the two and three-wheeler segments, introduced a Made-in-India, industry-first innovation, India’s first EV-Smartwatch integration, redefining the way riders connect with their vehicles. This integration connects the TVS iQube electric scooter with a special edition TVS iQube Noise Smartwatch, customized to provide real-time access to critical updates including vehicle status, battery insights, tyre pressure, and safety alerts along with a plethora of native watch features.

Noise has been leading the smartwatch market in India for four consecutive years, while TVS iQube has surpassed the 6,50,000 unit sales milestone in the domestic market, reaffirming its position as India’s No.1 EV scooter brand. This partnership with TVS  further enhances customer choice, turning the smartwatch into a true mobility companion that provides seamless access to vehicle features. As smartwatches evolve beyond lifestyle accessories, they are becoming command centers of productivity and mobility, making everyday rides smarter, safer, and more convenient. Together, TVS iQube and Noise are setting a new benchmark in connected technology and customer experience.

Commenting on the launch, Amit Khatri, Co-Founder, Noise, said, “At Noise, our vision has always been to build technology that empowers people to live, move, and stay connected with ease. This partnership with TVS Motor Company is a powerful step in that direction, bringing meaningful innovation to the wrist by turning the smartwatch into a mobility companion. As consumers look for smarter, more integrated ways to move through their day, this first-of-its-kind experience reflects our commitment to pushing boundaries, delivering purposeful technology, and shaping the future of connected living in India.”

Speaking on the industry-first innovation, Aniruddha Haldar, Senior Vice President — Head Commuter & EV Business and Head Corporate Brand & Media, TVS Motor Company said, “We are committed to reimagining the future of mobility by seamlessly blending technology, sustainability and customer-centric innovation. Our partnership with Noise is a testament to this vision, transforming the smartwatch from a lifestyle device into a smart riding assistant. By integrating the TVS iQube with a connected smartwatch, we are empowering our riders with smarter, safer and more intuitive journeys while shaping the future of mobility in India.”

THE EV-SMARTWATCH INTEGRATION DELIVERS:

Features	Description
Vehicle Status Monitoring	Locked, Unlocked, On Ride, Charging, or Charging Complete displayed clearly on the smartwatch.
State of Charge (SoC)	Battery percentage with visual cues for charging progress and low battery alerts (below 20%).
Distance to Empty (DTE)	Shows estimated range across ride modes to help plan commutes and charging stops more efficiently
Tyre Pressure Monitoring (TPMS)	Live pressure values for both tyres with recommended pressure benchmarks and alerts on select models.
Charging Progress	Real-time charging updates, including time-to-full and “Charging Complete” notification.
Tow/Theft Alert	Haptics and visual prompts triggered when motion is detected, followed by a mobile app notification.
Crash/Fall Detection	On-wrist alert followed by a notification in the app in case of a crash or fall.
Geofence Notifications	Alerts when the vehicle crosses a predefined geofence boundary, synced from the mobile app.
Low/Full Charge Alerts	Notifications to connect or unplug the charger based on battery level.
Safety Visual Cues	Color-coded tiles (Green = optimal, Red = attention needed) to minimize decision time and distractions.

 

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Infineon Technologies AG has expanded its XENSIV MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F, two innovative digital PDM microphones designed for exceptional audio performance, energy efficiency, and robustness. Leveraging Infineon’s proprietary Sealed Dual Membrane (SDM) technology, both microphones achieve a high level of robustness against water and dust (IP57), making them suitable for use in demanding environments.

The IM72D128V is distinguished by its top-tier Signal-to-Noise Ratio (SNR) of 71.5 dB(A), making it particularly suited for applications requiring precise low-noise audio pick-up. It operates at ultra-low power consumption, with 430 µA in high-performance mode and
160 µA in low-power mode, which makes it ideal for energy-efficient, battery-powered devices such as high-end headphones. With a footprint of 4 x 3 x 1.2 mm³, it is still small enough to fit most space constraint consumer devices.

The IM69D129F is tailored for compact design, with a footprint of 3.5 x 2.65 x 0.98 mm³, which makes it ideal for space-constrained devices. It achieves reliable audio performance with an SNR of 69 dB(A) and features low power consumption, operating at 450 µA in high-performance mode and 170 µA in low-power mode, contributing to extended battery life in portable devices ensuring extended battery life. Its small size makes it particularly suited for multi-microphone designs in compact systems. The devices can be used in Active Noise Cancellation (ANC) headphones and earbuds, as well as high-quality audio capturing in laptops, tablets, conference systems, and cameras.

The IM72D128V and IM69D129F are part of Infineon’s XENSIV MEMS microphone family, offering exceptional audio quality, low power consumption, and high durability. They also support Voice User Interface (VUI) applications in smart speakers, automotive infotainment, IoT devices, and home and industrial automation. Furthermore, both microphones can be used in industrial or home monitoring applications that require audio pattern detection, such as industrial monitoring and home security systems.

In addition, the IM72D128V and IM69D129F are equipped with a low-noise preamplifier and a sigma-delta ADC, providing digital PDM output for seamless integration into modern audio systems. Their shared features include an 11 Hz flat frequency response for precise sound reproduction and a ±1 dB sensitivity tolerance, making them ideal for multi-microphone arrays. Whether used for far-field audio pick-up or portable devices, these microphones enable high-quality audio capturing in challenging environments while enhancing energy efficiency and reliability. Both microphones comply with IEC (60747, 60749) and JEDEC (47/20/22) standards, ensuring reliability and robustness for consumer and industrial applications.

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Microchip launches six variants targeting high-growth motor drive, data center and sustainability applications

The growing need for compact, efficient and reliable power solutions is driving demand for power management devices that provide higher power density and simplify system design. Microchip Technology announced a new family of DualPack 3 (DP3) power modules featuring advanced IGBT7 technology available in six variants at 1200V and 1700V with high-current ranging from 300–900A. The new DP3 power modules are designed to address the growing demand for compact, cost-effective and simplified power converter solutions.

These modules use the latest IGBT7 technology, engineered to reduce power losses by up to 15–20% compared to IGBT4 devices and operate reliably at higher temperatures up to 175°C during overload. DP3 modules enhance protection and control during high-voltage switching, making them suitable for maximizing power density, reliability and ease of use in industrial drives, renewables, traction, energy storage and agricultural vehicles.

Available in a phase-leg configuration, the DP3 power modules in a compact footprint of approximately 152 mm × 62 mm × 20 mm, enable a frame size jump for increased power output. This type of advanced power packaging eliminates the need for paralleling multiple modules and helps reduce system complexity and Bill of Materials (BOM) costs. Additionally, DP3 modules provide a second-source option to industry-standard EconoDUAL packages for greater flexibility and supply chain security for customers.

“Our new DualPack 3 modules with IGBT7 technology can reduce design complexity and lower system costs while maintaining high performance,” said Leon Gross, corporate vice president of Microchip’s high-reliability and RF business unit. “To further streamline the design process, our power modules can be integrated as part of a comprehensive system solution alongside Microchip’s microcontrollers, microprocessors, security, connectivity and other components to accelerate development and time to market.”

The DualPack 3 power modules are well-suited for general-purpose motor drive applications and address common challenges such as dv/dt, complexity in driving, higher conduction losses and no overload capability.

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Explore TI’s comprehensive portfolio of analog and embedded processing semiconductors for energy infrastructure, automotive and connected appliances

Texas Instruments (TI) is demonstrating its leading semiconductor innovations for energy infrastructure, automotive and connected appliances at electronica India, September 17-19, in Bengaluru, India. TI’s exhibit in Hall 3, booth D11 at the Bangalore International Exhibition Centre showcases the latest advancements in applications such as HVAC fans, vacuum cleaners and electric 2-wheelers.

“At electronica India 2025, TI is showcasing how our latest semiconductor innovations are enabling energy-efficient, smart and secure solutions that are essential for building a more sustainable future,” said Santhosh Kumar, president and managing director, TI India. “TI’s comprehensive portfolio of analog and embedded semiconductors, combined with our industry-leading technologies and system-level expertise, enables customers to design intelligent systems that are accelerating energy savings at scale across industries.”

New ultra-low-cost, real-time MCUs

At the tradeshow, TI is debuting the most affordable devices in its C2000 real-time microcontroller portfolio (MCU), which enable engineers to design products with industry-leading performance at a lower cost. The F28E120SC and F28E120SB MCUs deliver smoother, quieter and more efficient motor performance in a wide range of home appliances and power tools.

The new F28E120SC MCU is featured in two on-site demonstrations, including:

• Noise reduction in appliance fans: See how the F28E120SC MCU can control a high-voltage three-phase motor and run a total harmonic distortion reduction algorithm, enabling engineers to reduce noise and improve efficiency in a fan for heating, ventilation and air-conditioning system.
• High-speed sensorless motor control in vacuum cleaners: Explore how the F28E120SC MCU can use sensorless FOC software to control a low-voltage vacuum motor, enabling high efficiency, smooth and stable startup, and reduced peak currents. Booth visitors will be able to quickly and easily spin the motor up to 150,000rpm.

Reimagine safe and efficient electric two- and three-wheelers

TI is also showcasing how its comprehensive product portfolio and reference designs enable innovation across the electric vehicle ecosystem. This includes LED drivers for lighting systems, processors for displays and entertainment, battery management technologies, motor control solutions and more.

Notable demonstrations include:

• 750W light electric vehicle charger: See a 750W light electric vehicle charger powered by the UCC25661-Q1 LLC controller optimal for e-bikes, scooters, and other light electric vehicles. This charger features TI’s patented input power proportional control (IPPC) technology, which provides consistent, stable charging even when batteries are nearly empty.
• Efficient electric vehicle charging with F29x C2000 MCUs: Explore how a single F29xC2000 MCU can power a highly compact 11kW electric vehicle charging system. This design combines both high and low voltage power conversion in one stage, achieving remarkable efficiency (97.6%) while taking up minimal space. The system delivers 5.5 kilowatts of power per liter of volume, helping make electric vehicles more practical with faster charging in smaller, more affordable charging units.
• High-voltage battery management system: Learn about smarter battery management with TI’s high-voltage battery management system (BMS) technology that enhances safety and reliability for large battery packs. This complete solution includes both hardware components and software tools that help manufacturers build better battery systems more quickly.
• CC35xxE wake word detection: Explore Edge AI audio capabilities with 3rd Party Sensory’s TrueHandsfree library on TI’s CC3551 Wi-Fi 6 and Bluetooth LE 5.4 wireless MCU. This can be activated using voice command wake word, which helps to control the Edge IoT device.
• High power density adapters with integrated GaN: See a tiny yet powerful 65W charger with two USB ports using TI’s integrated GaN technology. These chargers pack more power into less space (2.3W per cubic inch), making them significantly smaller than traditional chargers while delivering the same performance. This means more convenient, portable charging solutions for laptops, phones, and other devices.

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Changing geophysical systems are observed from frost in forests to shifting ice packs by satellites equipped with advanced semiconductors. For centuries, human beings have been trying to figure out how to connect environmental occurrences. Suppose a frost attack happens far away in the forest, only to be followed by a heavy storm that causes silt deposits in a harbor far away; then, such cause-effect patterns are nearly impossible to observe on the ground. Modern earth-observation satellites make these connections clearer than ever due to state-of-the-art imaging techniques and ruggedized semiconductor components built to reside in space.

There goes the big picture with imaging methods.

Optical, radar, and infrared imaging combine to provide a multidimensional view of Earth.

• Optical imagery may see changes in the visible spectrum weather, ash clouds, and landscape.
• Radar imaging penetrates clouds to get details of the ground, with synthetic aperture radar being a higher resolution system thanks to the usage of orbital motion to synthesize enormous antennas.
• Infrared and hyperspectral imaging convey the composition of the soil, atmosphere, and temperature variation.

Put together, these imaging methods track environmental change over time: predicting ice sheets shrinking, sea levels rising, or shifts in the ecosystem.

Making satellites that last

While the imaging isn’t new, the instrumentation has to be created so that components can withstand radiation, extreme temperatures, and years without maintenance. Here semiconductor classifications and packaging play a big role.

• QML Class V devices coated with hermetic ceramic are suitable for high-radiation environments with long-term operational reliability.
• QML Class P devices, on the other hand, use specialized plastic packaging, thus creating a balancing act between durability and small size, leading to more compact and capable satellites.
• Radiation-tolerant components satisfy low Earth orbit purposes with cost sensitivity, implementing proven resilience for their relatively reduced lifespans.

These classifications enable designers of satellites to take into consideration whether the mission requires long-term monitoring from geosynchronous orbit or urgently supplying large constellations in low Earth solutions.

Preparing for challenges to come

Satellites can constantly monitor Earth for years because to dependable, radiation-hardened semiconductors, giving scientists and decision-makers vital data. Researchers are better equipped to foresee potential hazards and make wise judgments when they can see how environmental interactions, such as temperature changes and soil chemistry, change over time.
The Earth is billions of years old, and we have only been measuring it for the smallest fraction of time, according to Jason Clark, systems manager for Space and Avionics at Texas Instruments. We are assisting scientists in preparing for the future by collaborating with them today.

(This article has been adapted and modified from content on Texas Instruments.)

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TE, Harwin, and Hirose have released their new next-generation connector families for data centers, industrial systems, and consumer electronics, offering better speed, reliability, and space savings.

Last month, an interesting Class AB audio amplifier was in the spotlight, a monoblock-configured pair of which I’m actually listening to (Widespread Panic’s Light Fuse Get Away, to be precise) as I type these follow-on words:

This time, it’s Class D’s turn in the spotlight. Here’s a summary link to EDN’s voluminous coverage of the technology over the past few decades, and a Wikipedia’s summary:

A class-D amplifier, or switching amplifier, is an electronic amplifier in which the amplifying devices (transistors, usually MOSFETs) operate as electronic switches, and not as linear gain devices as in other amplifiers. They operate by rapidly switching back and forth between the supply rails, using pulse-width modulation, pulse-density modulation, or related techniques to produce a pulse train output. A simple low-pass filter may be used to attenuate their high-frequency content to provide analog output current and voltage. Little energy is dissipated in the amplifying transistors because they are always either fully on or fully off, so efficiency can exceed 90%.

 Tripath, which branded the technology as “Class T”, was the first mainstream-volume supplier of Class D technology. My first exposure to Class D stretches back nearly 30 years, to 2007 when I first met with (and auditioned prototype gear from) D2Audio and its always entertaining (meant as a compliment), not to mention well-informed, Chief Technology Officer Skip Taylor at CES. I subsequently sic’d Skip on my then-colleague, EDN then-Analog Editor Joshua Israelsohn, who had a number of enjoyable mind-melding (maybe also melting?) meetings with Skip and his colleagues. Intersil bought D2Audio a year later, preceded by Texas Instruments’ 2000 acquisition of Burr-Brown and followed by Infineon’s 2018 purchase Merus Audio and Analog Devices’ 2021 Maxim buy (all as trend examples, not intended to be a comprehensive list)…and Class D technology was off to the races.

Class D vs Class AB

Here’s another take on Class D versus the Class AB (and A, for that matter) precursors, from Paul McGowan, the co-founder and CEO of high-end audio equipment supplier PS Audio, whose “Ask Paul” ongoing video series is both entertaining and educational, therefore highly recommended:

That this video comes from Paul (and PS Audio, located just “up the road” from me in Boulder, CO, for that matter) is highly revealing, I think. Audiophiles, the nexus of PS Audio’s customer base, are generally speaking both change-adverse and perversely picky when it comes to perceived quality. That they, who D2Audio was specifically targeting with its demos way back in 2007, were among the first to adopt Class D amplifier technology tells me a few things:

• With all due respect to Schiit co-founder Jason Stoddard, his diatribe about Class D’s tendency to “hiss like a demon cat, drilling slowly into your synapses and draining your soul” is dated and overstated, IMHO at least. As I noted last month, “he might have been right about Class D a few years ago, especially in the near-field configurations he’s specifically advocating for Rekkr, but no longer.”
• More generally, the technology has for a while now been good enough for audiophiles, so I’d wager it’s also good enough for the masses.
• And why was it appealing to audiophiles? Cost for them is a secondary-at-most concern, right? Well, their listening rooms tend to contain massive speakers, requiring formidable amounts of power to drive them. And, as Wikipedia notes, “The major advantage of a class-D amplifier is that it can be much more efficient than a linear amplifier, dissipating less power as heat in the active devices…also, given that large heat sinks are not required, class-D amplifiers are much lighter weight than class-A, -B, or -AB amplifiers.”

Schiit’s Class-AB-based Rekkr

Lighter…and much smaller, too. In the spirit of “a picture paints a thousand words,” here are some examples. First off, here again is the Class AB-based Rekkr (Internet Archive cache link), which is sound-spec’d as follows:

• Stereo, 8 Ohms: 2W RMS per channel
• Stereo, 4 Ohms: 3W RMS per channel
• Mono, 8 Ohms: 4W RMS

with the following form factor-related specs:

• Size: 5” x 3.5” x 1.25”
• Weight: 1 lbs

Schiit’s Class-AB-based Gjallarhorn

Next up is its Gjallarhorn “big brother”, also Class AB-based, also mentioned (but not shown) in last month’s piece, and sound-spec’d as follows:

• Stereo, 8 Ohms: 10W RMS per channel
• Stereo, 4 Ohms: 15W RMS per channel
• Mono, 8 ohms: 30W RMS

with the following form factor-related specs:

• Size: 9” x 6” x 2.5”
• Weight: 8 lbs

Rekkr vs Gjallarhorn size

Here’s a visual comparison of their respective form factors:

Foreground, then background, focus:

Ditto:

Keen-eyed readers may have already noticed that the comparison’s not entirely fair, since the Gjallarhorn integrates the AC/DC conversion circuitry that’s alternatively placed (at least partly) in the Rekkr’s external AC/AC “wall wart”. But as you can see, the Rekkr PSU is pretty tiny, so…:

Enter Class D competitors

Now for the Class D competitors (and, I’d generally argue, successors). Earlier this year, ahead of the looming tariffs, I acquired three different “Chi-Fi” manufacturer/model combinations…not counting the Class D circuitry inside the powered speakers I already owned…or my latest network audio streamer…or my latest sound bar (from Yamaha, replacing the Hisense unit I complained about in May)…all of which you’ll hear more about in other blog posts to come…

The first was a monoblock-only unit, the Fosi Audio V3 Mono:

Its (again, mono in this case) output specs, along with those of the other two devices I’ll be showcasing today, vary depending on the capabilities of the power supply connected to it:

• Rated Power Output : 48V/5A–240W@4Ω ; 32V/5A –100W@4Ω

And here are its form factor details:

• 6 x 4.2 x 1.6 inches (142mm x 105mm x 35mm)
• 06 pounds (0.48)

The second is Douk Audio’s A5, a dual-channel (stereo) Class D amp:

Again, its output specs are power supply voltage-and-current, as well as speaker impedance, dependent. Douk Audio provides more granular detail on its website than Fosi Audio does even in the V3 Mono user manual, unfortunately. But the general trend is similar in practice, given that they’re both based on Texas Instruments’ TPA3255 chipset:

Power Supply	Speaker Impedance	Rated Output Power
32V/5A	4Ω	78W+78W
32V/5A	6Ω	71W+71W
32V/5A	8Ω	65W+65W
36V/6A	4Ω	107W+107W
36V/6A	6Ω	100W+100W
36V/6A	8Ω	94W+94W
48V/5A	4Ω	120W+120W
48V/5A	6Ω	110W+110W
48V/5A	8Ω	102W+102W
48V/10A	4Ω	250W+250W
48V/10A	6Ω	210W+210W
48V/10A	8Ω	185W+185W

And its form factor details? Here you go:

• Dimensions (W*D*H): 95*92*50 mm/3.74*3.62*1.97 in
• Net weight: 506 g/1.12 lb

Last, but definitely not least, is a more recent Douk Audio device upgrade, the A5 Pro, adding both a Bluetooth receiver and a separate headphone output amplifier:

Same TI TPA3255-based audio power amplifier subsystem as with the base A5, so same output specs as shown earlier. The form factor is tweaked a bit (but only a bit, and likely mostly-to-completely to just make room for more knobs-and-such on the front panel), however:

• Dimensions (W*D*H): 130*112*33 mm/5.12*4.41*1.30 in
• Net weight: 525 g/1.16 lb

Schiit Rekkr (AB) vs Fosi Audio V3 (D)

That’s the last of the stock shots, at least for a while; now for some more “real life” ones. First off, here’s how the Schiit Rekkr stacks up (literally) against the Fosi Audio V3 Mono, which is capable of up to (speaker impedance- and power supply-dependent) more than 50x the mono output power at comparable distortion:

Schiit Gjallarhorn (AB) vs Fosi Audio V3 (D)

How about the Schiit Gjallarhorn versus the Fosi Audio V3 Mono? Glad you asked. Again, as a reminder, the latter has ~8X the mono output power in this case, with its beefiest power supply option and when driving the same impedance and at similar (inaudible) distortion levels. Not to mention being half the price (or even less, depending on where it’s sourced and how it’s kitted):

Again, a two-photo foreground-then-background focus shift:

Once again, the detail-oriented among you will point out that the Gjallarhorn chassis also encompasses AC/DC conversion circuitry, external to (and not shown in) the Fosi Audio case. You’re right, although there was a method to my madness. I didn’t want to show three sets of vs-V3 Mono photos, one set with each of the three PSUs I have in my possession: 32V/5A, 48V/5A and 48V/10A. Instead, here are the standalone undersides of the power supplies, capable of being used with any of the three Class D amplifiers I’m covering today. 32V/5A first:

Now 48V/5A:

And finally, the “Big Kahuna” 48V/10A version:

And here they are stacked on top of each other, with the 32V/5A one on top and (obviously) the 48V/10A one on the bottom:

The DC Power Filter

Independent reviews suggest that the incremental power output of the Fosi Audio V3 Mono tails off beyond the 48V/5A point…the Douk Audio units’ additive output performance increases more linearly at 48V/10A, but that’s to be expected as there are two audio power amplifiers—one for each channel—inside. But there’s another reason to run the Fosi Audio V3 Mono—two of them, actually—with a 48V/10A source. In such a configuration, the company also sells what it calls a “DC Power Filter”, which (in conjunction with an appropriate cable option) splits the 10A input current evenly among both of its outputs, enabling a single PSU to concurrently fuel two amplifiers:

I own two DC Power Filters. One came bundled with a two-amplifier set I bought off eBay. The other was a standalone purchase from Fosi’s online store, used with two other V3 Mono amps I got individually (for reasons I’ll explain further in a teardown to come!):

Schiit Gjallarhorn (AB) vs Douk Audio A5 (D)

What about those two Douk Audio units? Here’s the A5, alongside the 48V/5A power supply it came bundled with, on top of the Schiit Gjallarhorn:

Schiit Gjallarhorn (AB) vs Douk Audio A5 Pro (D)

Now for its A5 Pro “big brother”:

Schiit Gjallarhorn (AB) vs Douk Audio A5 + A5 Pro (D)

Because I couldn’t resist, the following shots prove that (after dispensing with the PSUs), I could fit both Douk Audio devices on top of a Gjallarhorn:

All the Class Ds stacked

And in closing, here are all three of today’s Class D devices stacked on top of each other, showcasing their form factor similarities:

Notable observations

Wrapping up, there are a couple of other points I wanted to note. First off, all three of the Class D amps support (believe it or not) user-accessible op-amp swapping:

analogous to the “tube rolling” of times past (and present, for some folks, and potentially others, too…there is, after all, a Vali 2++ now sitting at the top of the Schiit stack on my desk):

Finally, what’s with the “PFFB” promotion prominent on both manufacturers’ websites?

It stands for Post-Filter Feedback, and understanding what it is and does first requires a step (or few) back. Although, as the Wikipedia Class D definition I shared at the beginning of this piece noted, “A simple low-pass filter may be used to attenuate their high-frequency content to provide analog output current and voltage,” in practice the output filtering circuitry tends to be notably more complex than this; to render inaudible the otherwise distorting aforementioned “hiss like a demon cat”, for example, to suppress phase shift artifacts, etc. To reiterate on this circuit’s robustness importance, I’ll turn you over to Paul McGowan again for more on the topic:

PFFB, implemented in TI’s TPA3255 (and others), is the latest evolution in this output filtering scheme. Quoting from Google’s AI Overview summary of the search topic:

PFFB, or Post-Filter Feedback, is a secondary feedback loop in Class-D amplifiers that takes a portion of the signal after the LC output filter and feeds it back to the input to improve audio quality. This technique reduces distortion and improves the linearity of the power stage and output filter components, particularly the inductor, which is a primary source of distortion. PFFB also increases load independence, meaning the amplifier’s performance is less affected by the specific loudspeaker connected.

Here’s a visible example of PFFB’s benefits. First off, an output level-vs-frequency plot from Audio Science Review’s evaluation of the Fosi Audio V3 Mono:

Requoting highly recommended content expert (and long-time personal collaborator) Amir Majidimehr, “There is essentially no impact up to 20 kHz between the 4 and 8 ohm, indicating very low output impedance, albeit with a bit of peaking. Compare that to non-PFFB amps such as Fosi Audio V3 stereo amp:”

The TL;DR (at the end of another long writeup…sorry!) summary of Amir’s findings (and PFFB’s benefits): it suppresses an amplifier’s perceived loudness from otherwise varying with output frequency, not that this arguably was perceptible much if at all previously, candidly (specifically because the variability tended to occur at high frequencies, hard for all but the “golden ears” among us to discern, anyway). But since it now “comes along for the ride” with modern Class D amplifier designs anyway, at little if any incremental cost and with no sonic downside…

With that, encroaching on the 2,300-word threshold, I’m going to sign off for today. More on this topic, including the earlier-promised Class D amplifier teardown, to come soon. Until then, “sound off” with your thoughts in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

 Related Content

• Audio amplifiers: How much power (and at what tradeoffs) is really required?
• EDN Class D amplifier coverage
• Class D audio power amplifiers: Adding punch to your sound design
• The truth about Class D amplifiers

The post Class D: Audio amplifier ascendancy appeared first on EDN.

Today, Tektronix, i.e., Tek, releases its high-performance oscilloscope: The 7 Series digital phosphor oscilloscope (DPO) (Figure 1). This scope is a replacement of its discontinued (but still sought-after) 70000 series, using the same probe set. 

Figure 1 7 Series DPO is a replacement to the legacy 7000 series with the same probe performance, but much lower SNR, ENOB, throughput, and user-friendly touchscreen interface. Source: Tektronix

In a conversation with Tektronix’s Tim Bieber, Principal Product Planner, described the motivation for the new series, “Every 10 to 15 years, we have to replatform instruments because parts get old and the technology moves forward.” This scope is a direct response to the demand after conjoint analysis, or market research that Tek has done over the years with their established customer base. 

A user-friendly, high-performance Tek scope 

The 7 series DPO oscilloscope is the high-performance version of the 2 through 6 series of MSOs, where each series is optimized for different performance capabilities and price points (Figure 2). The unifying factor across this entire portfolio is the user interface (UI) and TekScope PC analysis software developed over a decade ago that allows for remote access to the benchtop instrument as well as offline analysis.

Figure 2 The 2 through 7 Series of Tektronix scopes, all using the same UI and analysis software. Source: Tektronix

“There are customers that want the raw data and don’t do anything with it, but there are other customers that need fairly complex measurements,” said Bieber when highlighting the importance of the analysis software piece of the modern oscilloscope puzzle, “For example, PCIe’s latest generation electrical spec is about 1000 pages long and there’s a couple chapters that go through all the measurements. Very few customers will want to go and develop all these measurements, so they look to the scope vendor to develop that, and we’ve had a package that we’ve had for 20 years.”

Specifications 

Table 1 offers a comparison of the new 7 Series DPO and the older DPO70000 oscilloscopes. The 7 Series DPO is a replacement for the DPO70000 series with all “TekConnect” channels that offer a comparable analog bandwidth from DC to 33 GHz. The TekConnect adapters (TCA) provide less signal distortion than other traditional adapters, such as BNC-to-N or N-to-SMA adapters. 

Tek also offers an Asynchronous Time Interleaving (ATI) architecture in the DPO70000 series, which provides a considerably larger bandwidth via 1.85 mm connectors. Bieber clarified why ATI was not included in the 7 Series DPO, stating that for the current models, which range from DC to 25 GHz, only TekConnect channels are necessary. He added that future 7 Series models with higher bandwidths will incorporate higher bandwidth connectors, such as 1.85 mm connectors.

	7 Series DPO	DPO70000
Channel type	TekConnect channels	TekConnect channels	ATI channels
Number of channels	4 analog	2 to 8 analog	1 to 2 analog
ADC	10-bit	8-bit	8-bit
ENOB (500 mV full scale, signal 90% of full scale)	7.5 bits at 8 GHz to 6.5 bits at 25 GHz	5.1 bits at 8 MHz and 4.8 bits at 25 GHz (for 33 GHz, 100 GS/s)	4.9 bits at ~8 GHz and 4.6 bits at ~25 GHz (for 70 GHz, 200 GS/s ATI channel)
Analog bandwidth	8 GHz to 25 GHz (customer upgradeable)	13 to 33 GHz	50 to 70 GHz
Sample rate per channel	125 GS/s on all 4 channels	100 GS/s	200 GS/s
Record length	500 Mpoints (up to 2 Gpoints option)	62.5 Mpoints (up to 1 Gpoints option)	62.5 Mpoints (up to 1 Gpoints option)
Random noise	0.10% of full scale to 0.23% of full scale, 500 mV full scale	0.69% to 0.83% of full scale, 300 mV full scale	0.43% to 0.71% of full scale, 500 mV full scale
Intrinsic jitter	60 fs (1 µs time duration) and 70 fs (1 ms time duration)	100 fs (10 µs time duration)	65 fs (10 µs time duration)
Probe compatibility	P7700 and P7600 Series TriMode probe	P7500, 7600, and P7700 Series TriMode probes and DPO7OE optical probe
Connectivity	LAN (10G Ethernet on SFP+ and 1000 Base-T on RJ45), USB 3.0 (7 total), DisplayPort, HDMI	PCIe, USB, Thunderbolt, HDMI, DisplayPort, and more
Screen size	15.6-inch HD touchscreen	Not specified, but much smaller

Table 1: A comparison of the newly released 7 series DPO and the older 70000 series.

The 7 Series DPO offers significant performance upgrades over the 70000 series. These enhancements are primarily due to three key improvements in its TekConnect channels:

• Lower learning curve with the TekScope user interface (UI) that would be familiar to Tek customers
• A fast throughput with a 10 Gb Ethernet LAN SFP+ port (on the back of the oscilloscope)
• A clean signal path due to the iterative advancements, yielding two new ASICs, the Tek079 and Tek085, both designed and built in-house

The 10 Gb Ethernet LAN SFP+ port (Figure 3) is ideal for short data runs with a swift offload from the scope for parallel analysis and off-scope processing. Additionally, the faster CPU and on-board GPU will accelerate data processing directly on the scope.

Figure 3 An image of the back of the 7 Series showing the 10 Gb Ethernet LAN SFP+ port, which can accept either a regular RJ45, fiber optic, or direct-attach connection. Source: Tektronix

The new ASICs

At the core of the oscilloscope are the upgrades to the custom preamplifier and ADC, as shown on the acquisition board in Figure 4. Each of these boards has two channels; the signal enters through the inputs to the preamp and ADC, and out to a large FPGA used for triggering and data storage. 

Figure 4 The 7 Series DPO acquisition board showing Tek085 preamplifiers connected directly to the Tek079 ADC (black chips shown on the left-hand side). Source: Tektronix

“This chip (Tek85) has half the noise of the previous preamp called Tek61, which is in our 6 Series product,” said Bieber. The Tek85 chip is fabricated using GlobalFoundries’ 9HP SiGe process. It uses “Quiet Channel” noise reduction technology, which essentially performs the continuous time linear equalization (CTLE) function in hardware instead of software to push channel noise down without increasing the noise floor (a consequence of implementing equalization techniques in software). This, along with the 10-bit ADC, allows the oscilloscope to have a low vertical (random) noise with a high effective number of bits (ENOB). 

The addition of the 7 Series offers a clear upgrade to the older 70000 variant while also benefiting from the enhanced UI/UX of the established 2 through 6 Series Tek scopes.

Aalyia Shaukat, associate editor at EDN, holds a Bachelor’s degree in electrical engineering and has worked in the design publishing industry for nearly ten years. 

Related Content

• Oscilloscope articles by Art Pini
• Tektronix MDO4000 oscilloscopes go multifunction
• A new cost-optimized high-performance oscilloscope
• Building a low-cost, precision digital oscilloscope—Part 1

The post Tektronix releases its new high-performance 7 Series oscilloscope appeared first on EDN.

All About Circuits visited Tektronix HQ in Beaverton, Oregon, to see their new 25 GHz digital phosphor oscilloscope—announced today—featuring lower noise floor and higher ENOB.

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA sneak peak at 3D IC design toolkits and workflowss of traditional monolithic chip manufacturing. By breaking functional systems into sub-functional chiplets and using advanced packaging integration technologies, we can create more complex, more powerful systems than ever before.

The challenge—and opportunity—for the industry is to lower the barriers to adoption of 3D IC design so that its benefits can become available industry-wide and not just the bleeding edge markets. Thus, the Chiplet Design Exchange (CDX) was formed within the Open Compute Project with the mission of developing easy-to-use, machine-readable design kits (3DKs).

With participation from EDA vendors, foundries, OSATs, and materials providers, the goal was to define standards and workflows for 3D IC design. In other words, a neutral, open foundation that enables efficient chiplet integration and reuse, accelerates innovation, and guarantees manufacturability across organizational boundaries.

 

3D IC design toolkits and workflows

Silicon IC design is supported by a mature ecosystem of IP libraries and standardized process design kits, but advanced packaging has historically lacked a similar infrastructure. 3D IC design requires new, specialized design kits tailored for chiplet-based workflows and advanced package integration complexity.

The CDX group, together with industry partners, defined four primary 3DK categories, each supporting a discrete aspect of 3D IC design, integration, and verification:

• Chiplet design kits (CDKs) provide standardized, reusable chiplet models with the necessary information for seamless system integration.
• Package assembly design kits (PADKs) define essential package rules such as I/O/TSV pitch, substrate and interposer spacing, and component placement guidelines to facilitate manufacturability.
• Material design kits (MDKs) contain composite material properties needed for accurate electrical and reliability simulations.
• Package test design kits (PTDKs) specify test I/O, pin dimensions, and functions, supporting robust automated testing at both the chiplet and system-in-package level.

Figure 1 A chiplet design kit (CDK) is shown as per the JEDEC JEP30 part model. Source: Siemens EDA

Standardizing these kits in machine-readable, EDA-neutral formats closes persistent gaps between silicon, packaging, and test communities. Every stakeholder—whether chiplet vendor, package architect, or manufacturing partner—can contribute, access, and leverage accurate models for design, verification, and production handoff to manufacturing.

The wider availability of 3DKs is driving the emergence of new, fluid 3D IC workflows. Chiplet suppliers can now publish detailed, standards-compliant digital models, creating a catalog of validated IP. Designers can search, evaluate, and select chiplets based on electrical, physical, and performance characteristics—similar to how SoC developers choose IP blocks for traditional integration. This enhances discoverability, accelerates design cycles, and fosters a new business model for silicon IP reuse.

Crucial to this flow is automation in model authoring. Manually crafting CDX-compliant 3DKs at scale is not practical, so the industry is investing in open-source, EDA-neutral authoring tools. Siemens EDA Innovator3D IC exemplifies this trend, providing a unified environment where teams can design, verify, and plan manufacturing in one cockpit. These platforms enable rapid iteration, simulation, and validation of heterogeneous integration, helping organizations reduce costly design spins and reach the market faster.

Figure 2 The Innovator3D IC Integrator facilitates a heterogeneous integration cockpit. Source: Siemens EDA

The AI and 3D IC alliance

Artificial intelligence (AI) and high-performance computing (HPC) are both driving, and benefiting from, progress in 3D IC technology. As scaling of traditional process nodes approaches its physical limits, chiplet integration and advanced packaging become the primary pathways to higher performance and capacity. By stacking high-bandwidth memory near logic, designers achieve higher data transfer rates with reduced latency and power—vital for AI, hyperscalers, and data-intensive applications.

The industry is also crossing new thresholds: single-die reticle limits are being surpassed, and panel-scale organic and glass interposers now support the assembly of thousands of chiplets—resulting in systems with trillions of transistors on a single substrate. The complexity of designing, laying out, and verifying these massive architectures is well beyond the reach of traditional manual processes, especially as electrical, power, thermal, and mechanical dependencies multiply.

AI is therefore becoming an indispensable partner, not just another tool. Machine learning accelerates fundamental EDA tasks, such as SPICE simulation, by orders of magnitude and powers multi-dimensional optimization engines that explore a vast design space automatically. Recent advances allow even legacy tools to achieve significant productivity gains by learning from the design intent and usage patterns, automating and refining iterative processes to deliver greater productivity and better results.

Figure 3 AI is both creating new challenges for semiconductor design and providing solutions to those same challenges. Source: Siemens EDA

One emerging area is the use of AI-driven optimization for physical design, layout, and verification of large-scale 3D assemblies. By encoding design rules, material properties, and system constraints as machine-readable data—rather than static PDF documents—organizations can automate decision-making, error-checking, and design-space exploration.

In the future, a hierarchy of AI agents will actively collaborate, each addressing a specialized workflow (for example, thermal analysis, high-level partitioning, or chiplet floorplanning) and communicate and negotiate based on user guidance and systemic feedback, vastly reducing cycle times and mitigating design risk.

As the industry begins to explore the use of co-packaged optics (CPO) and photonic integration—addressing I/O bottlenecks in massive 3D IC systems—AI’s role will become even more critical, both in design and in real-time adaptation and optimization for manufacturing and field operation.

The next major semiconductor evolution is here

The semiconductor industry’s progression from painstaking, manual layout at the 5-micron node to today’s nanometer-scale devices with trillions of transistors is extraordinary. 3D ICs mark the next great leap, promising new levels of performance, system complexity, and integration—even as Moore’s Law slows.

This evolution demands not just technical advances but organizational transformation. The shift from product-centric thinking to system-level solutions, the rise of cross-disciplinary workflows, and the expanding role of AI and automation are now prerequisites as 3D IC moves from early adoption to mainstream practice.

Open 3DK standards, robust tooling, and EDA-neutral platforms, together with the enablement of AI-augmented flows are laying the foundation for a future where advanced packaging unleashes the full potential of modern electronics.

As we move into the trillion plus-transistor era, innovations in 3D IC design and the power of AI will define what is possible in electronic system design—and ensure that future engineers and systems remain at the leading edge of technology and capability.

Todd Burkholder is a senior editor at Siemens DISW. For over 25 years, he has worked as editor, author, and ghost writer with internal and external customers to create print and digital content across a broad range of EDA technologies. Todd began his career in marketing for high-technology and other industries in 1992 after earning a Bachelor of Science at Portland State University and a Master of Science degree from the University of Arizona.

Tony Mastroianni is the Advanced Packaging Solutions Director at Siemens Digital Industries Software. He has more than 30 years’ experience as an engineer and engineering manager in the global semiconductor industry and currently leads development of advanced packaging solutions for Siemens EDA. Prior to joining Siemens, he served in engineering leadership positions at Inphi and eSilicon. Tony earned a B.S.E.E from Lehigh University and a M.E.E at Rutgers University.

Editor’s Note

This is the second part of the three-part article series about 3D IC architecture. The first part, published last week, provided essential context and practical depth for design engineers working on 3D IC systems. The third and final part, to be published next week, will provide a comprehensive framework for 3D IC integration.

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• Tighter Integration Between Process Technologies and Packaging
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The post Putting 3D IC to work for you appeared first on EDN.

Factories are becoming increasingly connected, with sensors, actuators, machines, and operator devices all demanding seamless, reliable, and low-latency communication. Traditional Wi-Fi struggled to keep up with such dense and demanding environments. Enter Wi-Fi 6 and Wi-Fi 6E the latest generations of Wi-Fi technology, designed not just for speed, but for efficiency, scalability, and resilience in tough industrial settings. With extended spectrum, better interference management, and enhanced capacity, Wi-Fi 6/6E is now well-positioned to meet the evolving needs of smart factory automation.

Wi-Fi 6: Designed for Industrial Demands

Built on the IEEE 802.11ax standard, Wi-Fi 6 supports both 2.4 GHz and 5 GHz bands, offering longer range and higher capacity compared to Wi-Fi 5. The addition of the 6 GHz spectrum under Wi-Fi 6E further boosts scalability by introducing dozens of new channels and reducing congestion.

Factory environments pose unique challenges: thick concrete walls, heavy machinery, and a growing number of connected devices that must communicate continuously with minimal latency. Wi-Fi 6 addresses these demands through features that improve efficiency, reliability, and power management, ensuring smooth operation in 24/7 industrial settings.

Key Features of Wi-Fi 6/6E for Smart Factories

• MU-OFDMA (multi-user orthogonal frequency division multiple access): Enables simultaneous communication with multiple devices, optimizing bandwidth use.
• MU-MIMO (multi-user multiple input multiple output): Supports multiple upload and download streams at the same time.
• 1024-QAM modulation: Packs more data into each symbol, boosting capacity.
• Longer OFDM symbols and guard intervals: Enhance range and resilience in harsh environments.
• BSS coloring: Reduces interference between devices sharing the same channel.
• Target Wake Time: Improves battery life for wireless sensors by allowing them to “wake” only when needed.

The 6 GHz expansion in Wi-Fi 6E, now available across the US, Canada, South Korea, and partially in Europe, further reduces congestion and doubles available capacity—critical for dense factory floors.

Real-World Benefits in Industrial Automation

• Battery-powered sensors gain extended life and reliability thanks to Target Wake Time and reduced interference.
• Control systems and actuators benefit from low latency and consistent quality of service, even when handling small but critical data packets.
• Mobile operator tools like tablets and handheld terminals experience seamless roaming and stable connectivity.
• Augmented reality (AR) devices such as smart glasses achieve higher data rates and responsiveness, supporting new digital workflows.
• Extended range ensures robust coverage across large and challenging factory layouts.

Wi-Fi Meets Bluetooth and Cellular

Looking ahead, smart factories will not rely on a single wireless technology. Wi-Fi 6/6E will coexist with Bluetooth for low-power connections and with 4G/5G cellular networks for wide-area communication. Together, these technologies create a flexible, scalable, and future-proof foundation for Industry 4.0.

(This article has been adapted and modified from content on Ublox.)

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Hi everyone, I’ve been lurking here for a while now and loved seeing your projects. Now it’s my turn to contribute — an electroencephalogram (EEG) I built from scratch. It’s open source, and I’d be thrilled if some of you guys try it out, give feedback, or even improve on it! Repo (with gerber files) + demo video are in the comments. submitted by /u/Hopeful_Let_4349 [link] [comments]

Hey everyone! I’ve been tinkering away on a little evening project for a while now and wanted to share it here. The Quansheng UV-K5 handheld radio is fun to hack on, but its original MCU only had 64 kB of flash memory. Not enough to run all the cool community-made features at once. So, I designed a tiny flex PCB “implant” that lets me replace the stock chip with an STM32G0C1CET (512 kB flash, 144 kB RAM). It involved a lot of signal remapping, flex board experiments, and of course plenty of solder fumes....but in the end it worked! submitted by /u/Accomplished-Pen8638 [link] [comments]

As multi-die and chiplet-based systems gain traction in AI, mobile, automotive, and high-performance computing, traditional simulation methods are hitting performance limits. To address this challenge, Cadence has introduced the Xcelium Distributed Simulation App, designed to accelerate verification workflows and cut down bottlenecks. With speedups of up to 3×, the new solution helps design teams handle complex multi-die systems more efficiently and cost-effectively.

The Xcelium Distributed Simulation App, available within the Xcelium Logic Simulator, partitions large simulations into smaller, independent tasks that can run in parallel across server resources. This distributed approach eliminates the long runtimes associated with monolithic simulations, enabling teams to achieve faster turnaround times without compromising accuracy.

Key advantages include:

• Up to 3× faster performance in multi-die system simulations.
• Improved hardware efficiency, reducing compute costs by as much as 5×.
• Seamless testbench reuse, so teams can extend single-die verification environments to multi-die projects with minimal overhead.

Early adopters are already seeing results. At Samsung Semiconductor, Garima Srivastava’s verification team reports smoother workflows and faster execution by leveraging existing testbenches for multi-die designs.

Alok Jain, Corporate VP of R&D at Cadence, emphasized the impact:

“With the Xcelium Distributed Simulation App, we are redefining verification performance for multi-die systems. It’s about giving our customers the speed and scalability they need to meet next-generation design demands.”

This new capability reinforces Cadence’s leadership in advanced verification, helping customers stay ahead as the industry shifts to larger, more complex architectures.

(This article has been adapted and modified from content on Cadence Design Systems.)

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