ELE Times

Renesas Electronics Corporation on 24th September, 2026, announced the SLG46801, the industry’s smallest GreenPAK configurable mixed-signal device, available in both WLCSP and STQFN packages. The 9-ball WLCSP measures just 1.155 mm × 1.155 mm and combines an ultra-small footprint with multi-time programmability, helping designers reduce PCB space in compact products such as smart rings, smartwatches, fitness bands, VR glasses and portable electronics.

Consumers are demanding smaller, more feature-rich products, while designers need to add functionality while reducing component count, PCB area and bill-of-materials (BoM) costs. The SLG46801 addresses these requirements by combining commonly used analog, timing and logic functions in a compact, low-power device. It can complement an MCU or replace multiple discrete components, helping designers reduce board space and simplify designs.

“Designers are being asked to integrate more functionality into increasingly compact products without increasing system cost or development effort, while also reducing power consumption.” said Jason Kim, Vice President and General Manager of the Core Analog Division at Renesas. “The SLG46801 expands our GreenPAK portfolio with an ultra-compact WLCSP option and flexible in-system configurability, helping customers create smaller, more feature-rich products and implement updates even after deployment.”

The SLG46801 integrates two high-speed analog comparators, configurable lookup tables, counters and delays, 10 kHz and 25 MHz oscillators, voltage-tolerant GPIOs and an I²C-compatible serial interface. These resources support sensing, control, glue logic, timing and system housekeeping functions in applications across consumer electronics, handheld devices, smart-home systems, networking and communications, computing and storage, industrial control and IoT sensor nodes.

In addition to the 9-ball WLCSP, the SLG46801 is available in a 12-lead, 1.6 mm × 1.6 mm × 0.55 mm STQFN package. The two package options allow customers to balance minimum board area with additional GPIO availability and industrial package preferences. The device also offers one of the lowest cost per GPIO in the GreenPAK family.

Renesas is a leader in configurable mixed-signal technology, with more than four billion GreenPAK devices shipped worldwide. GreenPAK ICs enable designers to combine analog and digital system functions in small, low-power devices that can be configured using the Renesas Go Configure Software Hub. The free GUI-based development environment helps customers develop custom hardware functions without the need for additional discrete components or complex firmware development.

The SLG46801 includes multi-time programmable non-volatile memory that can be configured in system through its I²C interface. This allows customers to implement bug fixes, configuration changes and product upgrades after the device has been integrated into the end application, helping reduce redesign cycles and additional hardware revisions.

The device supports operation and programming across the full 1.71 V to 5.5 V supply range—the widest operating and configurable range among MTP GreenPAK devices. GPIO pins can also be repurposed dynamically for the I²C interface, maximizing flexibility in designs with limited pin availability. Optional CRC-8 and read-back protection support more robust and controlled configurable implementations.

The post Renesas Introduces Smallest GreenPAK Configurable Mixed-Signal IC with Multi-Time Programmability appeared first on ELE Times.

Cadence on September 24, 2026, announced a new agent for the Cadence ChipStack AI Super Agent that automates front-end digital design and verification, covering power, performance and area (PPA)-driven spec-to-RTL generation, RTL analysis and refinement through natural language prompts. Building on the industry’s first agentic workflow for front-end design and verification announced in February 2026, the RTL Generation Agent extends the ChipStack AI Super Agent from autonomous verification and debug to high-quality RTL creation and optimization. In early evaluations, the RTL Generation Agent delivered an average 24% reduction in area and 18% reduction in power compared with pure foundation model code generation, while ensuring 100% functionally accurate RTL, according to Cadence.

Building on the industry’s first agentic workflow for front end design and verification announced in February 2026, this RTL Generation Agent extends the ChipStack AI Super Agent from autonomous verification and debug into high quality RTL creation and optimization.

“These latest agentic AI advancements take us from AI assisted tools to coordinated agentic workflows that behave more like virtual design engineers with expert-level command of the underlying technologies,” said Chin-Chi Teng, senior vice president and general manager in the Digital & Signoff Group at Cadence. “By pairing agentic automation of spec-to-RTL and RTL refinement with our proven implementation and signoff engines, we enable customers to achieve better design outcomes with higher productivity and stronger correlation across the design flow, further extending Cadence’s leadership in AI driven, end to end chip design.”

Cadence’s transformational approach to applying agentic AI to engineering design is founded on a hierarchy of solutions—super agents orchestrate task-specific agents, which in turn use trusted electronic design automation (EDA) software, optimized for agentic workflows. The new RTL Generation Agent converts high level specification into production ready RTL optimized for PPA.

Customer Validation from Honda

Early collaborations with Honda R&D demonstrate how these agentic AI capabilities translate into real world PPA and productivity gains on next generation SoCs.

Honda is evaluating the RTL Generation Agent on advanced automotive SoCs, where safety critical requirements and tight power and cost envelopes demand highly optimized RTL.

“As a key enabler of Software-Defined Vehicles (SDVs), AI technology for autonomous driving is advancing rapidly. However, the long development cycle of SoCs remains a major challenge. With the Cadence ChipStack AI Super Agent’s RTL Generation Agent and AI-powered automation, Honda R&D is working to improve productivity from specification through RTL development,” said Tomoya Nishino, chief engineer and general manager, Digital Engine Development Division, SDV R&D Center, Honda R&D Co., Ltd.

Smarter RTL Updates and Early PPA Insight

In addition to new RTL creation within the RTL Generation Agent, Cadence is introducing technology for design updates to existing RTL based on new requirements. This RTL upgrade flow brings AI automation to accelerate RTL revision, enabling customers to rapidly adapt legacy RTL to new architecture requirements, new PPA targets and new functional requirements. Engineers describe changes at a high level, and the agents carry out the updates while analyzing and verifying PPA and functionality.

Advancing Cadence’s Agentic AI Vision

These enhancements build on Cadence’s “Design for AI and AI for Design” strategy highlighted at CadenceLIVE and Computex, further extending the company’s leadership in AI driven chip design. From the initial ChipStack AI Super Agent launch through June’s announcement of the industry’s first fully autonomous virtual engineer for chip design, and now today’s RTL Generation Agent, Cadence continues to expand the scope of agentic workflows across the design stack. Together with the broader ChipStack, InnoStack and ViraStack AI Super Agent portfolio, they advance a scalable platform that applies AI across digital, analog and verification domains.

The post Cadence Expands ChipStack AI Super Agent with AI-Powered RTL Generation and PPA Optimization appeared first on ELE Times.

From discovering new component vendors and evaluating production equipment to addressing gaps in domestic manufacturing, electronica India and productronica India 2026 in Bengaluru were marked by three days of intensive commercial and technical engagement across the electronics value chain.

Both trade fair was organised by Messe Muenchen India from 16–18 September 2026 at the Bangalore International Exhibition Centre (BIEC). The co-located trade fairs welcomed 793 exhibitors and 52,411 business visitors. The exhibition occupied 60,000 square metres and featured exhibiting companies from over 30 countries. Together, visitors, exhibitors, speakers and industry delegations represented more than 50 countries.

The event covered electronic components, embedded technologies, printed circuit boards, electronic manufacturing services, production machinery, automation, testing, inspection and related manufacturing solutions. Its breadth allowed decision makers to examine several stages of electronics production within a single business platform.

The Bengaluru edition was inaugurated by Shri M. B. Patil, Hon’ble Minister for Large and Medium Industries and Infrastructure Development, Government of Karnataka, and Mr. Hiroshi Nawata, Consul-General of Japan in Bengaluru.

Industry attention shifts from capacity to capability

The conversations across the exhibition indicated a clear industry priority: increasing manufacturing capacity must now be supported by stronger capabilities in components, equipment, quality, testing, design and production processes.

Manufacturers attending the event evaluated technologies against practical requirements such as application suitability, production output, process control, inspection accuracy, automation and supplier support. Component and equipment providers, in turn, gained direct exposure to the requirements emerging from Indian electronics manufacturers.

Bhupinder Singh, President – IMEA, Messe München, and CEO, Messe Muenchen India, said, “The value of a trade fair is ultimately determined by the quality of the business conversations it enables. In Bengaluru, we saw manufacturers arriving with specific sourcing, production and technology requirements. Suppliers were able to respond with relevant capabilities and technical expertise. This level of engagement shows that India’s electronics sector is progressing from broad expansion plans towards more defined manufacturing decisions.”

The Buyer–Seller Forum supported this process through 3,225 focused B2B meetings over three days with 645 unique buyer companies and 1,682 VIP buyers. The discussions gave both sides a structured setting to examine technical requirements, supplier capabilities and potential areas of cooperation.

The exhibition floor was complemented by the Podcast Studio, Executive Club Lounge and dedicated networking areas, creating additional settings for conversations among business leaders, technology specialists and industry representatives.

International participation reflects demand for closer market engagement

Companies from Germany, China, France, Italy, the United Kingdom, Japan, Israel, the United States, Korea and other markets participated in the Bengaluru edition.

Dedicated pavilions from Germany, Japan, Taiwan and China brought together technologies and suppliers from their respective electronics industries. The Japan Pavilion was organised in partnership with the Japan External Trade Organization (JETRO), while the Taiwan Pavilion was presented with the Taiwan Electrical and Electronic Manufacturers’ Association (TEEMA).

Rather than serving only as international showcases, the pavilions enabled participating companies to hold direct discussions with Indian buyers, understand local manufacturing requirements and explore potential commercial relationships.

Dr. Reinhard Pfeiffer, CEO, Messe München GmbH, said, “Global electronics companies are increasingly in need of a closer understanding of India’s manufacturing requirements and business environment. The Bengaluru edition gave international suppliers direct access to the companies investing in production, sourcing and technology adoption. For Indian participants, it provided an efficient way to compare the capabilities of several established technology markets.”

Conference discussions examine the foundations of competitive manufacturing

The accompanying programme moved the industry conversation beyond manufacturing volume to the capabilities required for long-term competitiveness.

The India Electronics Conclave comprised 14 conferences at the BIEC Conference Centre. Across the event, approximately 150 speakers participated in 18 supporting programmes covering electronics policy, capital goods, artificial intelligence, exports, free trade agreements, printed circuit boards, flexible electronics, standards, compliance and power electronics.

The programme included the eFuture Conference with Avanteum as Knowledge Partner, CEO Forum with ELCINA, Industrial Electronics & Capital Goods Summit 2026 with ICEA, Exports and FTAs: Electronics Sector with MEDEPC, Bharat PCB Tech Conference with ELCINA, VDMA Symposium and OE-A Symposium on Flexible Electronics.

Reinforcing its role as a platform for industry dialogue and future-focused thinking, electronica India and productronica India 2026 hosted the launch of MMI and Avanteum Advisors’ e-paper, eFuture 2035: Engineering India’s Next Electronics Revolution. The report outlines the strategic shifts and opportunities that could shape India’s electronics manufacturing and its position in the global value chain over the next decade.

Technical learning was addressed through the IEEE Standards Workshop on EMI/EMC Compliance and the Power Electronics & Power Supply Design Workshop.

“India’s electronics industry is entering a phase where competitiveness will be measured by consistency, reliability, process maturity and the ability to meet global customer expectations. Forums at electronica India and productronica India 2026 helped bring sharper attention to these priorities by connecting industry leaders, technology providers and policy stakeholders around the practical capabilities required to move from capacity creation to globally competitive manufacturing,” said Rajoo Goel, Secretary General, ELCINA.

The Industrial Electronics & Capital Goods Summit 2026, organised with the India Cellular & Electronics Association, examined the role of domestically available equipment and production technologies in supporting manufacturing growth.

Shri Pankaj Mahindroo, Chairman, India Cellular & Electronics Association (ICEA), said: “As India’s electronics manufacturing ecosystem continues to expand, reliable access to advanced equipment, automation, testing and quality-control technologies will be critical to sustaining growth. The summit provided an important platform for industry and policymakers to examine these requirements from the perspective of real-world production needs and identify the areas where India’s capital-goods and technology ecosystem must continue to evolve.”

The OE-A Symposium brought international and Indian experts together to consider the commercial potential of flexible and printed electronics across mobility, healthcare, energy, consumer products and industrial applications.

Sandip Roy, General Manager, VDMA India, said, “The opportunity in flexible electronics depends on connecting research and  technology development with viable industrial applications. The symposium created a useful exchange between international specialists and Indian stakeholders exploring how these technologies can move towards adoption and commercial deployment.”

Speakers participating in the supporting programme said that the value of the discussions lay in bringing policy, manufacturing experience and technical expertise into the same forum.

“The session provided an opportunity to examine the emerging power paradigm in the context of the decisions manufacturers are making today. The discussion highlighted the immediate challenges facing the industry, while also bringing into focus the technologies and capabilities that need to be developed to meet the evolving demands of power electronics over the coming years,” said Amit Kumar, Vice President & Business Unit Head – Metering and Protection Systems, Schneider Electric India.

“India has a significant opportunity to strengthen its position in next-generation PCB design to manufacturing, but realising this potential will require closer collaboration among industry, government, academia and technology providers. The event brought these stakeholders together for a practical and meaningful exchange of perspectives on bridging the journey from design to manufacturability,” said Savita Ganjigatti, Sr. Vice President – Engineering & Operations, Sienna ECAD Technologies (An Avalon Group Company), during the session Engineering for Tomorrow: Design to Manufacturing.

Emerging engineers work on industry-defined challenges

The 2026 edition also introduced formats designed to connect emerging technical talent with practical industry problems.

Organised with HackCulture and supported by presenting partner DigiKey, the electronica India Tech Challenge featured a prize pool of ₹5 lakh. Participating teams developed responses to defined technology challenges and presented their work during the Hackathon Demo Day, where the three winning teams were recognised for the originality, technical merit and practical relevance of their solutions.

The AI Buildathon, conducted by Sarvam AI, and AI Masterclass conducted by GrowthX, explored the application of artificial intelligence to practical use cases. A Hand Soldering Skill Test brought attention to production skills at the operator level, while an industrial visit to the Central Manufacturing Technology Institute provided exposure to an established manufacturing and engineering environment.

At electronica India 2026, the Taipei Computer Association and IIIT-Bangalore signed an LoI to advance Taiwan–India collaboration across AI, electronics, smart manufacturing, smart cities and cybersecurity.

Together, these initiatives connected the event’s wider manufacturing agenda with engineering skills, applied problem-solving and future workforce requirements.

‘India’s Powerplay in Electronics’ reaches the industry nationwide

The Bengaluru edition was presented under the theme “India’s Powerplay in Electronics.” Cricket icon KL Rahul served as Brand Ambassador for the visitor campaign, which ran across outdoor, digital and print media through September 2026. At the event, the campaign shifted from a public-facing message to a physical demonstration of the breadth of companies, technologies and expertise in India’s electronics industry.

Exhibitors and buyers report focused business engagement

Exhibitors highlighted the quality of conversations with manufacturers, sourcing teams and technology decision-makers attending the Bengaluru edition.

“productronica India 2026 gave us a strong platform to showcase advanced technologies with our global partners. Unveiling Fuji’s CLT-FG for the first time outside Japan was the main highlight. The strong industry response reinforced the growing demand for advanced manufacturing solutions in India and opened new opportunities for collaboration,” said Soni Saran Singh, Founder, MD & CEO, NMTronics India Pvt. Ltd.

“India’s electronics ecosystem is evolving rapidly, with growing focus on technology adoption, local manufacturing and stronger supply chains. The exhibition enabled meaningful conversations around these priorities and how we can support customers across the electronics value chain, from design to delivery,” said Haresh Abichandani, Managing Director, Millennium Semiconductors.

“Visitors came with defined requirements and a clear understanding of the capabilities they wanted to evaluate. This allowed our discussions to move quickly from general enquiries to applications, technical specifications and potential projects,” said Nandini Balasubramanian, Director, Tescom Pvt. Ltd.

Buyers valued the opportunity to compare suppliers and technologies against specific production and sourcing requirements.

“We attended the exhibition with clearly defined requirements for passive components used in electronic control boards. The event provided an excellent opportunity to meet multiple relevant suppliers under one roof, enabling us to compare their technical capabilities, product offerings, quality standards, and application expertise. The interactions were valuable in identifying potential suppliers for further technical evaluation and future collaboration,” said Jagadeesha M H, Team Lead, R&D, Delta Electronics India Pvt Ltd.

“Our priority was to understand which technologies could support improvements in production/quality/testing/automation. The live discussions gave us information that would have taken considerably longer to gather through individual supplier meetings,” said Venkata Ravindra, Head R&D, SFO Technologies.

“The event was the seventh in a row for me. This time, I felt that the combination of Indian and international suppliers gave our team a wider view of the available options. We have shortlisted potential partners and will continue the technical and commercial discussions initiated at the event. It was well organized this time and thanks to the team for making it better every year,” said Anil Krishna K S, Associate Director – Procurement & Supply Chain, Pioneer India Electronics Pvt Ltd.

The trade fairs were supported by the Government of Karnataka, with ELCINA as Partner Association and ICEA as Industry Partner. ELCIA, CLIK, GEZIA and AIEA participated as Supporting Associations; MEDEPC and CEAMA as Strategic Partners; and  VDMA, IEEE and OE-A as Conclave Partners.

Yeemak and Delvitech were Gold Partners, while Mouser Electronics participated as Registration Partner. JETRO and TEEMA supported the Japan and Taiwan pavilions, respectively.

Expanded national format proceeds to Delhi-NCR

The conclusion of the Bengaluru edition completes the first year of the trade fairs’ expanded national model.

Previously conducted in alternate years in Noida and Bengaluru, electronica India and productronica India moved to annual editions in both markets in 2026. The change represents 50 percent growth under the new format and provides more regular access to the electronics manufacturing regions of northern and southern India.

The next edition will be held from 28–30 April 2027 in Delhi-NCR.

The programme will mark the launch of Defence Electronics NEXT, creating a dedicated platform for technologies, capabilities and partnerships supporting India’s defence electronics ecosystem. It will also maintain a strong focus on printed circuit boards through BPCA and on the semiconductor value chain through the India Semiconductor Conclave.

Supported by the Uttar Pradesh Host State Partnership, these initiatives align with the Government of Uttar Pradesh’s investment priorities in defence electronics, PCBs, semiconductors and advanced manufacturing. Together, they will connect industry, government and technology stakeholders around sectors critical to India’s electronics manufacturing ambitions.

The post Electronica India and Productronica India 2026 Conclude in Bengaluru with 793 Exhibitors and 52,411 Business Visitors appeared first on ELE Times.

​To strengthen India’s semiconductor manufacturing ecosystem across different stages of the value chain, Tata Electronics signed seven Memorandums of Understanding (MoUs) with global companies and Indian institutions during SEMICON India 2026, held in New Delhi from September 17 to 19. The collaborations cover wafer manufacturing, assembly and testing, advanced semiconductor packaging, materials, technology development, supply-chain localisation and talent development.

One of Tata Electronics’ major collaborations is with Nexperia, a Dutch semiconductor company. This partnership covers front end wafer fabrication, back-end assembly, and testing along with technology and ecosystem development. As per the partnership, Nexperia’s semiconductor products are expected to be manufactured and packaged through Tata Electronics’ facilities located in Dholera, Gujarat and Jagiroad, Assam.

Tata Electronics’ second collaboration is with Fujifilm, a Japanese multinational company, with the primary goal of developing a semiconductor materials ecosystem in the Dholera fabrication facility to enhance supply chain resilience. These materials include high-purity process chemicals and raw materials such as photoresists, CMP slurries, and thin-film solutions. Fujifilm plans to invest ₹800 crore to establish a semiconductor materials plant in Dholera to support the localisation of semiconductor materials.

Another important partnership is with Enomoto, a Japanese steel manufacturing company signed with Tata ​Electrics to strengthen its semiconductor packaging materials supply chain facility in Jagiroad, Assam. Enomoto will support Tata Electronics by providing manufacturing expertise for developing next-generation semiconductor packaging capabilities.

This collaboration of Tata Electronics with global partners reflects the effort to develop an integrated semiconductor ecosystem in India, supporting Tata Electronics’ planned fabrication facility in Dholera and semiconductor packaging facility in Assam while building domestic capabilities across the semiconductor value chain.

The post Tata Electronics Signs Seven MoUs to Strengthen India’s Semiconductor Value Chain appeared first on ELE Times.

“India presents a significant opportunity to develop globally competitive solutions that shape the future of intelligent transportation.”

The automotive industry is making a seamless transition to Software Defined Vehicle (SDV) architectures and technology providers are gearing up for exciting times ahead! In an exclusive interaction with Anwesh Koley of ELE Times, Hitesh Garg, Vice President & India Managing Director, NXP Semiconductors, shared his views on SDVs and their evolution in the automotive landscape. Excerpts from the interview:

ELE Times: With car buyers becoming more concerned with comfort, connectivity, and safety than horsepower and acceleration, how does this impact the design of technological architectures in SDVs?

Hitesh Garg: Traditional automotive engineering focused on mechanical performance, but today’s buyers increasingly evaluate vehicles based on their digital experience. About 95% of Indian consumers are willing to pay for Software-Defined Vehicle capabilities, with safety, security, and continuous vehicle-health reporting emerging as key purchase considerations.  As a result, vehicles are evolving into intelligent, software-driven platforms where features can be continuously enhanced throughout their lifecycle.

NXP is powering this transition through its portfolio of automotive processors, secure connectivity, edge AI, radar, and vehicle networking solutions that help OEMs build scalable, software-defined vehicle architectures.

ELE Times: With vehicles becoming increasingly software-defined, share your thoughts on NXP’s advancements in zonal networking solutions.

Hitesh Garg: At NXP, we view zonal networking as one of the foundational building blocks for scalable SDVs. Our S32 portfolio, including the S32G vehicle network processors and S32J family of Ethernet switches, is designed to deliver the secure, deterministic, and high-bandwidth communication required for next-generation architectures.

More recently, we introduced the SAF8444 multi-gigabit Automotive Ethernet switch, enabling higher network bandwidth and lower latency to support data-intensive applications such as advanced driver assistance systems (ADAS), autonomous driving, and immersive in-vehicle experiences. Combined with Automotive Ethernet, Time-Sensitive Networking (TSN), and intelligent gateway capabilities, these solutions enable seamless communication between sensors, actuators, and centralised compute systems.

ELE Times: India is increasingly positioning itself as a design-led electronics ecosystem. In this scenario, please elaborate on NXP’s current initiatives in the development and adoption of Software Defined Vehicles.

Hitesh Garg: India plays a critical role in NXP’s global automotive R&D ecosystem. With more than 2500 employees across our centres, the recent acquisition of Kinara further strengthens NXP’s edge AI capabilities, enabling high-performance neural processing directly within the vehicle for applications such as advanced driver assistance, driver monitoring, and intelligent in-cabin experiences.

Coupled with India’s growing semiconductor ecosystem and supportive government initiatives, we see significant opportunities to collaborate with OEMs and ecosystem partners to accelerate the development of globally competitive SDV solutions.

ELE Times: Software Defined Vehicles require a fundamentally different approach to vehicle architecture. How is the industry poised to address this challenge?

Hitesh Garg: The industry is adopting standardised software platforms, service-oriented architectures, Automotive Ethernet, zonal and centralised processing to simplify integration and improve scalability. Equally important is the growing collaboration between semiconductor companies, OEMs, Tier-1 suppliers, cloud providers, and software developers to reduce development complexity and accelerate time-to-market.

ELE Times: What’s different in the current approach to designing an SDV than 3-to-5 years ago?

Hitesh Garg: Over the last few years, the industry has moved from viewing software as an enhancement to recognising it as the primary driver of vehicle innovation. Three to five years ago, software largely supported individual vehicle functions through isolated ECUs. Today, manufacturers are designing vehicles around centralised computing platforms where software defines functionality, user experience, and feature evolution throughout the vehicle’s lifecycle.

NXP is enabling this shift with our automotive processors, radar solutions, secure connectivity technologies, and vehicle networking platforms designed to support this evolution by enabling scalable compute, real-time intelligence, and continuous software innovation while meeting the stringent safety and cybersecurity requirements of modern vehicles.

ELE Times: Software seems to be enabling more variations. Are there any engineering challenges in managing and implementing this?

Hitesh Garg: The increasing software content in vehicles brings tremendous flexibility, but it also introduces new engineering challenges around functional safety, cybersecurity, software integration, and lifecycle management. As vehicle architecture becomes more centralised and software-driven, ensuring that hardware and software operate reliably, securely, and in compliance with automotive safety standards becomes critical.

ELE Times: What can automotive engineers do to balance the need for more circuitry with the requirement to limit weight, particularly in EVs?

Hitesh Garg: One of the most effective ways to achieve this is by transitioning from distributed ECU architectures to centralised and zonal architectures. Instead of connecting every sensor and actuator through long wiring harnesses, zonal architectures group components based on their physical location within the vehicle and connect them through high-speed Automotive Ethernet. This significantly reduces cable length, lowers vehicle weight, simplifies manufacturing, and improves serviceability while supporting future software-defined capabilities.

Equally important is semiconductor integration. By consolidating multiple functions into high-performance processors and highly integrated system-on-chip (SoC) solutions, OEMs can reduce component count, optimise power consumption, and improve thermal efficiency.

ELE Times: What are the barriers to SDV adoption, and what can OEMs and technology providers do to address these concerns?

Hitesh Garg: Infrastructure is an important enabler for SDVs. The deployment of reliable infrastructure, high-speed connectivity, and intelligent transport systems will also be essential to unlock the full potential of SDVs. Addressing these challenges requires close collaboration across the automotive ecosystem. Semiconductor companies, OEMs, Tier-1 suppliers, software developers, and standards bodies must work together to build interoperable platforms based on open architectures and common software frameworks.

ELE Times: How do you perceive the future of connected car technology and what innovations can we expect in the foreseeable future?

Hitesh Garg: We at NXP are enabling this future through our broad automotive portfolio spanning secure connectivity, V2X, UWB, radar, edge AI, and high-performance automotive processing. As vehicles become more software-defined and connected, our focus remains on delivering secure, scalable technologies that enable automakers to accelerate innovation while ensuring functional safety, cybersecurity, and reliability. For India, where connected mobility is gaining momentum alongside the growth of electric and software-defined vehicles, this presents a significant opportunity to develop globally competitive solutions that shape the future of intelligent transportation.

ELE Times: What are your views on the India Semiconductor Mission 2.0?

Hitesh Garg: Government initiatives such as ‘ISM 2.0’ are a defining milestone in India’s journey toward global semiconductor leadership. By expanding support across the entire value chain from manufacturing and advanced packaging to critical materials and design, this initiative builds a foundation for long-term competitiveness.

India’s world-class engineering talent is a proven asset, and sustained R&D investments will further elevate its position in the global supply chain. At NXP, we are fully committed to this vision. We continue to advance cutting-edge R&D locally and nurture future-ready talent. We believe that collaborative ecosystem innovation is the key, and we look forward to partnering with industry, academia, and policymakers to drive India’s emergence as a global semiconductor hub.

The post Interview | Hitesh Garg, Vice President & India Managing Director, NXP Semiconductors appeared first on ELE Times.

India Cellular & Electronics Association (ICEA) along with the High Commission of Malaysia and Malaysia External Trade Development Corporation (MATRADE) organized the India-Malaysia Semiconductor & Electronics Industry Collaboration: Strategic Business, Investment & Partnership Opportunities in India at SEMICON India 2026, held at Yashobhoomi, New Delhi to facilitate discussions among Indian and Malaysian industry members to build on synergies and scale in business, investment, and technology collaboration.

The engagement covered key areas including semiconductors, OSAT/ATMP, semiconductor equipment, inspection and metrology, automation, electronics manufacturing and advanced technologies. Participating companies discussed their capabilities, requirements and potential areas for partnerships and investment.

Ms Shamilah Perumal, Minister (Economic Affairs), High Commission of Malaysia, highlighted Malaysia’s established semiconductor and electronics ecosystem and the potential to build stronger linkages with India’s rapidly expanding semiconductor design, manufacturing and electronics ecosystem.

The programme also brought an important state-level investment perspective through the participation of Ms. Pallavi Verma, IAS, Executive Director, Guidance Tamil Nadu, and Shri Alok Kumar, Principal Secretary, Department of IT & Electronics, Government of Uttar Pradesh. They highlighted investment opportunities, policy initiatives, incentives and facilitation mechanisms available to companies.

The engagement was further strengthened by the participation of Ms. Siti Nur Nafhatun, MATRADE, in the second industry interaction session, with Dr. Neeraj Agarwal, ICEA, coordinating the industry interactions and facilitating focused discussions between the participating Indian and Malaysian companies.

Pankaj Mohindroo, Chairman, ICEA, said: “India and Malaysia have complementary strengths across the semiconductor and electronics value chain. Malaysia has built significant capabilities in semiconductor manufacturing, packaging and related technologies, while India is rapidly expanding its capabilities across design, manufacturing, components and electronics production. The opportunity is to connect these strengths through investments, technology partnerships, manufacturing linkages, joint R&D and potential joint ventures. Such industry-led engagement can create stronger and more resilient regional value chains.”

The discussions also explored collaboration beyond the immediate semiconductor and electronics ecosystem, including Quantum Technologies, Rare Earth Elements & Magnets, AgriTech and other emerging technologies, creating potential avenues for joint research, technology development and investment.

ICEA will continue to engage with global industry, governments, investment agencies and technology ecosystems to facilitate meaningful business connections and support investments, technology partnerships and deeper integration of India into global electronics and semiconductor value chains.

The post ICEA Drives India–Malaysia Semiconductor and Electronics Industry Collaboration at SEMICON India 2026 appeared first on ELE Times.

​Semicon 2.0 is the next phase of India Semiconductor Mission (ISM) approved by the Union Cabinet with the primary goal of expanding domestic chip design, manufacturing, advanced packaging, research and talent development. Prime Minister Narendra Modi highlighted the transition to Semicon 2.0 by stating the ambition of the semiconductor ecosystem that “India’s chip will go out to the world” as India is emerging as a major source of developing semiconductor value chain.

Under Semicon 2.0, the government is targeting at least 200 startups and companies involved in chip design in India to scale up domestic semiconductor capabilities. This will build momentum with already 105 startups who have started developing chips and received access to industry-grade EDA tools. Electronics and IT Minister Ashwini Vaishnaw at SEMOCON India, 2026 said that 20 of those 105 startups have secured venture-capital funding, and the government wants to expand this ecosystem to at least 200 startups and companies.

The programme is structured into six broad focus areas covering chip design, semiconductor machinery and materials, additional fabrication facilities, advanced packaging and testing, research and development, and talent development. This approach aims to take India’s semiconductor ecosystem beyond the initial foundation created under Semicon 1.0 to a more complete production facility.

Talent development is another major focus of this initiative. The IT Minister also stated that around 70,000 semiconductor design engineers have been trained as part of India’s accelerated talent development to strengthen its home-grown chip-design ecosystem under the India Semiconductor Mission​.

The post India’s Chips to Go Global as ISM 2.0 Targets 200 Chip-Design Companies appeared first on ELE Times.

Uttar Pradesh Government has attracted more than Rs 43,000 crore in investment across the electronics and semiconductor sector, aiming to transform the state into India’s leading semiconductor manufacturing hub. This industrial scheme aligns with the vision of  ‘Make in India,’ scaling local production and thereby reducing import dependence on foreign countries.

More than 200 companies operating in the state’s electronics ecosystem can increase their supply chains, access new customers, lower operating costs, and manufacture new equipment to expand electronics-component manufacturing.

According to the state government, more than 55% of mobile phones produced in India are manufactured in Uttar Pradesh. The expansion of electronics manufacturing ecosystem will go beyond mobile phones into tablets, laptops, consumer electronics, home appliances, solar cells, defence and logistics drones, promoting the state as a rapidly emerging manufacturing hub for electronics and semiconductors.

Leading the Semiconductor Growth Trajectory

Gautam Buddh Nagar has emerged as central place for manufacturing electronic components, consisting of two manufacturing clusters and housing major companies like Samsung, LG, Haier, Dixon, Addverb, Raphe, and Bhagwati. These clusters are laying the foundation for the electronics manufacturing ecosystem.

Uttar Pradesh is also emerging as a key hub for semiconductor packaging and testing. Sector 28 of the Yamuna Expressway under the Yamuna Expressway Industrial Development Authority (YEIDA) hosts India’s newly approved, high-tech semiconductor ecosystem featuring a Centre-approved assembly, Testing, Marking, and Packaging (ATMP) facility.

A state government is seeking to build a broader technology ecosystem connecting electronics manufacturing with semiconductors, AI, robotics, and deep-tech. The member of the state government confirmed that the focus is on developing a complete value chain covering components, chip design, packaging, testing, devices, data centres and AI and robotics applications.

The post Uttar Pradesh Attracts Rs 43,000 Crore Investment in Electronics and Semiconductor Sector appeared first on ELE Times.

By Meryem Berrada, Product Marketing Engineer, Keysight Technologies

Modern 5G network testing depends on real-time spectrum analysis to detect transient RF interference that traditional swept spectrum analysers often miss. As RF environments become denser with 5G, IoT, radar systems, and autonomous infrastructure, engineers increasingly rely on handheld spectrum analysers and spectrum management software to identify, localise, and mitigate interference in real time.

The wireless world is not just getting faster. It is getting denser. As global infrastructure shifts toward 5G, massive IoT, and autonomous systems, the RF spectrum is becoming an increasingly crowded and contested space. What once appeared as occasional interference is now evolving into something far more consequential: an invisible gridlock forming across the airwaves. This shift fundamentally changes the nature of the problem.

Interference is no longer a minor inconvenience behind a dropped call. It is a systemic risk capable of disrupting critical operations. Maintaining network integrity now requires more than simply detecting signals. It demands real-time, intelligent awareness of spectrum behaviour as it unfolds. Several key shifts show just how much the RF landscape has changed.

Why Is RF Interference Detection Critical for Safe 5G Network Testing?

The transition to 5G does not just improve performance. It raises the stakes. Networks are moving from human-driven communication toward machine-to-machine ecosystems, where reliability is directly tied to physical outcomes. In this environment, RF interference detection affects far more than connectivity. It can directly impact systems such as autonomous vehicle navigation, public safety communications, and radar and defence infrastructure.

In these contexts, failure is not measured in inconvenience. It is measured in consequence. A momentary disruption can cascade into a critical system failure, leaving little to no margin for error. Interference is no longer something networks can simply tolerate. It is something they must actively anticipate and mitigate during 5G network testing and deployment.

Why Do Traditional Spectrum Analysers Miss Modern RF Interference?

Conventional swept-tuned spectrum analysers were designed for a very different RF environment, one where signals were relatively stable, predictable, and easier to isolate. Today’s signals behave differently. They are often transient, lasting only milliseconds. They can be intermittent in nature and increasingly dense, overlapping within the same spectral space. Traditional swept spectrum analysers measure frequencies sequentially.

That sweep-based approach can provide useful snapshots of RF activity, but it can also miss short-duration events that occur between sweeps. Real-time spectrum analysis changes that perspective. Instead of sampling the spectrum in slices, it continuously captures and processes RF activity across a defined bandwidth without gaps in observation. This makes it better suited to detecting transient, burst, and intermittent signals that are common in modern 5G and dense RF environments.

With modern tools, engineers can visualise RF behaviour using spectrograms and waterfall displays. These views reveal short-duration transients, overlapping emitters, and time-varying interference patterns that would otherwise remain invisible. Capturing this kind of wideband, time-sensitive activity is no longer a specialised capability. It is becoming a baseline requirement for modern RF interference detection.

Traditional vs. Real-Time Spectrum Analysis: Key Differences for 5G and RF Interference Detection

Understanding the difference between traditional and real-time spectrum analysis is critical for engineers performing RF interference detection and 5G network testing in modern environments.

Table 1. Comparison of traditional swept spectrum analysis and real-time spectrum analysis for modern RF interference detection and 5G network testing. How Are Real-Time Spectrum Analysis Workflows Changing Field Testing?

The traditional model of RF troubleshooting, dispatching teams to investigate issues on-site, is rapidly becoming unsustainable. Historically, diagnosing problems in the “last mile” required manual drive testing, consuming significant time, labour, and operational resources. That model is now shifting toward centralised, software-driven workflows.

By combining ruggedised handheld spectrum analysers with centralised analysis platforms, engineers can remotely control distributed test assets, monitor multiple sites simultaneously, and stream live measurement data back to centralised teams. This creates a fundamentally different workflow: capture, stream, analyse, and act. Engineers no longer need to be physically present at every field location. Instead, units can remain deployed at the edge while analysis happens centrally, powered by high-fidelity, wideband IQ data delivered in real time.

How Does Real-Time RF Interference Detection Use TDoA Localisation?

The classic “fox hunt,” tracking interference sources with directional antennas, was built for a slower and simpler RF environment. In today’s dense 5G deployments, where interference sources can appear and disappear in milliseconds, manual methods struggle to keep pace. The modern approach shifts the problem from physical pursuit to mathematical computation. Time Difference of Arrival, or TDoA, techniques use multiple GPS-synchronised receivers to measure the precise arrival time of a signal across different locations.

Because RF propagation speed is constant, software can calculate the emitter’s position based on the difference in arrival times. This approach reduces reliance on slow, manual triangulation and enables rapid, wide-area localisation that scales with the complexity of modern networks. RF interference detection is no longer only a field exercise. It is increasingly a data-driven problem solved through coordinated measurement and computation.

Figure 2. Distributed field measurements combined with TDoA processing enable rapid, wide-area localisation of interference sources How Are Handheld Spectrum Analysers Closing the Gap Between Field and Lab Testing?

For years, RF engineers had to choose between portability and performance. Handheld spectrum analysers offered convenience in the field but often lacked the depth required for advanced analysis. Benchtop instruments delivered precision, but at the cost of mobility. That trade-off is now changing.

Modern handheld analysers can enable wideband real-time IQ streaming, representing a significant leap from previous limitations and changing what can be achieved outside the lab. This capability is especially important for 5G New Radio, where channel bandwidths can reach up to 100 MHz in sub-6 GHz bands. Without wideband capture, engineers may be forced to stitch together narrower measurements, losing critical time-domain behaviour in the process. With wideband streaming, entire 5G channels can be captured in a single acquisition, preserving signal behaviour and enabling integration into centralised analysis workflows. In practical terms, the boundary between field and lab is becoming less rigid. More advanced analysis can now be brought closer to where the RF problem actually occurs.

Why Real-Time Spectrum Analysis Is Becoming Essential for 5G Network Testing

Spectrum management is undergoing a fundamental transformation. Detecting signals is no longer sufficient. Engineers must now be able to capture transient, wideband RF activity in real time, stream and classify that data within centralised systems, precisely locate interference sources, and act before disruptions escalate into failures.

The wideband reality is already here. With 5G NR channel bandwidths reaching up to 100 MHz in sub-6 GHz bands, real-time wideband capture is not just a forward-looking requirement. It is an immediate need for modern 5G network testing. The question is no longer whether interference will occur. The question is whether your tools can see it in time.

The post The 5G Radio Fog: Why Traditional Spectrum Analysers Miss Modern RF Interference appeared first on ELE Times.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today introduced ST SafeSense VD56GA, a 1.1 MP automotive image sensor for infrared in-cabin sensing. The sensor enables OEMs and Tier 1 suppliers to scale driver and occupant monitoring across vehicle lines while balancing performance, integration, and cost.

As driver and occupant monitoring expands across a broader range of vehicle platforms, automakers and suppliers are looking for imaging solutions that can deliver strong in-cabin performance without adding unnecessary system cost or design complexity. The VD56GA image sensor addresses this need with a compact sensor architecture, high infrared sensitivity, and embedded image-processing capabilities. This combination is designed to provide the image quality required for driver and occupant monitoring while maintaining the size and cost advantages of a compact sensor format. In many in-cabin applications, the VD56GA can help customers meet performance targets without requiring a larger and more expensive sensor.

“In-cabin sensing is moving beyond premium platforms, and carmakers need cost-effective solutions they can deploy broadly,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “With VD56GA, we focused on the system-level tradeoffs that matter most: image quality in infrared conditions, compact integration, and a cost structure that supports high-volume programs. Equally important, the sensor benefits from ST’s Integrated Device Manufacturer model, with front-end manufacturing in Crolles, France, giving customers greater supply-chain resilience, quality control, and long-term support for automotive programs.”

“As driver and occupant monitoring systems move into a broader range of vehicle platforms, OEMs are increasingly focused on solutions that can be deployed at scale, with volumes set to exceed 70 million units by 2031. Success in this market depends not only on imaging performance, but also on reducing system cost, simplifying integration, and enabling adoption across high-volume vehicle programs,” (*) underlined Anas Chalak, Market & Technology Analyst, Imaging at Yole Group.

Helping carmakers scale driver and occupant monitoring

VD56GA is designed to help reduce the cost of the complete camera module. Its imaging performance enables the use of lower-cost optics, simplified infrared illumination, less demanding optical filtering, and no external image-processing. For OEMs and Tier 1s, that can translate into a more cost-effective path to deploying driver and occupant monitoring across a broader range of vehicle programs.

The sensor leverages a new backside-illuminated pixel architecture, called ST DeepNIR, optimized for infrared imaging. With 35% higher modulation transfer function (MTF) sharpness and nearly 60% higher quantum efficiency than the previous generation, VD56GA is currently the only sensor in its class to achieve this level of combined optical resolution and infrared sensitivity, helping in challenging conditions like under display camera.

By extracting more performance from a compact 1.1 MP architecture, VD56GA helps automotive designers achieve the image quality required for advanced sensing functions, while benefiting from the integration and cost advantages of a compact sensor architecture.

Compact integration with embedded image processing

Designed for modern automotive camera modules, VD56GA is housed in a compact 3.7 mm x 3.2 mm CSP package, making it suitable for space-constrained installations and next-generation in-cabin camera designs.

The device also integrates a range of embedded image-processing functions, including mirror, crop, dark calibration, auto exposure, and piecewise-linear processing. These features remove the need for external image-processing resources, simplify camera design and speed development.

Support for both RAW and YUV output formats give OEMs and Tier 1 suppliers flexibility across different electronic architectures and software environments, making it easier to adapt the device to a broad range of implementation strategies.

Building on ST’s automotive imaging leadership

VD56GA builds on ST’s established presence in automotive imaging and in-cabin sensing. Earlier this year, ST announced shipment of its 10 millionth automotive of SafeSense by ST image sensors, reflecting broad adoption across key automotive regions, including Europe, Asia, and the United States.

Customers benefit from ST’s vertically integrated manufacturing model and secure supply chain, with front-end manufacturing of VD56GA takes place at ST’s facility in Crolles, France and packaging in Asia; reinforcing the company’s focus on industrial resilience, product quality, and supply continuity for automotive customers worldwide.

The post STMicroelectronics Introduces 1.1 MP Automotive Image Sensor for Affordable In-Cabin Sensing appeared first on ELE Times.

Emerson on 22nd of September, 2026, announced a 50% expansion of its test and measurement research and development (R&D) centre in Bengaluru. The expansion strengthens the facility’s capacity to develop AI-enabled engineering, test software and validation technologies, helping customers address increasing product and validation complexity through more intelligent and software-defined testing approaches.

The site also serves as Emerson’s NI Software Center of Excellence and is the company’s second-largest test and measurement R&D centre globally. Engineering teams in Bengaluru develop and support key test software platforms, AI-enabled capabilities, systems engineering technologies and RF test software for global customers across sectors including semiconductors, aerospace and defence, transportation, life sciences, industrial manufacturing, and research and academia. The expansion further advances the site’s transformation from a global capability centre into a global test and measurement innovation centre with global product responsibility.

“Bangalore plays an increasingly strategic role in Emerson’s global test innovation network,” said Ritu Favre, president of Emerson’s Test & Measurement business. “The site combines deep expertise in test software and AI-enabled engineering and validation technologies with close connections to rapidly evolving industries. This investment helps customers manage growing product complexity, streamline validation and bring new innovations to market faster.”

As test systems become increasingly software-driven and AI-enabled, engineers must validate more complex products within shorter development cycles. The expanded Bangalore hub will provide additional capacity to advance automated validation workflows, AI-enabled test engineering and integrated test and measurement platforms for customers worldwide.

India’s continued growth in semiconductors, electric mobility, aerospace and defense is also increasing demand for sophisticated testing and validation. Market development associated with initiatives such as the India Semiconductor Mission and the National Electric Mobility Mission Plan creates opportunities for companies developing, manufacturing and validating new technologies. Emerson is responding to these evolving market needs by expanding its test and measurement R&D capabilities and strengthening its connection to customers and engineering talent in India.

Emerson operates two test and measurement locations in Bangalore: the R&D center and a second site providing application engineering, calibration, sales and customer support. Together, the locations connect global technology development with local market expertise.

The post Emerson Expands Bengaluru Test and Measurement R&D Hub by 50% for AI-Driven Engineering appeared first on ELE Times.

Crestron, a global provider of workplace collaboration and control solutions, showcased its latest technologies for smarter spaces at InfoComm India 2026, held from September 16 to 18 at the Jio World Convention Centre in Mumbai. At Booth H01, Crestron demonstrated its latest collaboration, audio, video, control and workplace technology solutions, highlighting how an integrated technology ecosystem can simplify deployment and support more connected workplace experiences.

One of the key features at the booth is the India launch of Crestron Collab Compute, a hardware foundation for hybrid meetings. Designed for professional AV and collaboration applications, Collab Compute combines computing capabilities with professional AV connectivity to provide a scalable platform for meeting spaces. It is built on Intel Core Ultra processors with integrated neural processing units (NPUs), providing an AI-ready hardware platform for Microsoft Teams Rooms and Zoom Rooms deployments.

“The workplace is evolving from individual meeting rooms into connected environments where collaboration, communication and intelligent technology need to work seamlessly together. With Collab Compute and our broader portfolio, we are bringing organisations a foundation that is designed not only for the way people collaborate today, but also for how these spaces will evolve,” said Gagan Verma, Vice President – India & SAARC, Crestron. “InfoComm India provides an important platform for us to engage with customers, partners and the wider Pro AV ecosystem and demonstrate how an integrated approach can simplify technology while delivering better experiences.”

Beyond Collab Compute, Crestron is showcasing a selection of its latest solutions spanning collaboration, intelligent video, professional audio, room control and workplace technology. The portfolio includes solutions such as Videobar 70, AirMedia, 1 Beyond i12D, DM-NAX and Automate VX, demonstrating Crestron’s approach to creating connected and flexible environments for modern workplaces.

“India is playing an increasingly important role in Asia’s evolving workplace technology landscape. Organisations are looking for solutions that are flexible, intelligent and scalable, and our presence at InfoComm India reflects Crestron’s commitment to supporting this transformation. The event provides us an opportunity to engage with customers and partners and showcase how integrated technology can create more seamless workplace experiences,” said Jacques Bertrand, Executive Vice President, Asia, Crestron.

The post Crestron Showcases Intelligent AV and Collaboration Solutions at InfoComm India 2026 appeared first on ELE Times.

Nuvoton Technology Corporation, a leading global semiconductor supplier, has introduced the NuMicro M3351 series of 32-bit microcontrollers, featuring an Arm Cortex-M33 core operating at up to 144 MHz and a wide operating voltage range of 2.7 V to 5.5 V. The M3351 series provides a highly integrated 5 V MCU platform for smart appliances, industrial automation, and next generation robotic control.

High-Performance Cortex-M33 Core and Flexible Memory Configuration

The NuMicro M3351 series integrates a comprehensive DSP instruction set and a single-precision floating-point unit (FPU), improving execution efficiency for motor control, real-time signal processing, and complex control algorithms. The series offers 256 KB to 1 MB of Flash memory and up to 128 KB of on-chip SRAM. Devices with up to 1 MB of Flash support Dual-Bank operation, ECC, background operation, and Bank Swap, enabling a more flexible and reliable architecture for firmware-over the-air (FOTA) updates.

Select devices also provide up to 64 KB of independent Data Flash with endurance of up to 100,000 program/erase cycles. During Data Flash programming, the MCU can continue executing code from APROM, reducing the impact of parameter storage on real-time control and communication services. By separating firmware from frequently updated data, the system can more efficiently manage calibration parameters, user settings, fault logs, and operating records while reducing the need to reserve APROM space for EEPROM emulation.

High-Resolution Analog Peripherals and Real-Time Control

The M3351 series integrates a 12-bit SAR ADC with a sampling rate of up to 1.7 MSPS and a 14-bit SAR ADC operating at up to 1.0 MSPS with as many as 16 input channels. It also provides a 12-bit DAC, two analog comparators, up to 24 channels of 16 bit PWM/BPWM, and up to two enhanced quadrature encoder interfaces (EQEI).

Hardware trigger paths among the PWM, ADC, and analog comparator modules reduce CPU workload and improve real-time response, making the M3351 series well suited for closed-loop control applications such as motors, robotic joints, fans, pumps, valves, actuators, and power control systems.

Extensive Connectivity and Hardware-Based Security

The M3351 series provides up to two CAN FD interfaces, 10 UARTs, three I²C interfaces, as well as I3C, QSPI, SPI/I²S, USCI, and USB 2.0 Full-Speed Device/Host connectivity.

To address the growing security requirements of connected equipment, the series incorporates Arm TrustZone technology and Secure Boot with SHA-256 and ECDSA-P256 firmware authentication. Select models further integrate TRNG, PRNG, AES-256, SHA-512, and HMAC-SHA hardware functions to strengthen secure boot, firmware authentication, and data protection.

Industrial-Grade Reliability and Comprehensive Development Support

The M3351 series supports an operating temperature range from -40°C to +105°C and provides robust immunity with ESD HBM protection up to 4 kV and EFT immunity up to 4.4 kV. Its wide 2.7V to 5.5V operating range allows direct operation in common 5V control environments, reducing voltage-conversion requirements and overall system design complexity.

The series is available in package options ranging from the compact QFN33 measuring 5 × 5 mm to the high-pin-count LQFP128 measuring 14 × 14 mm. Nuvoton also provides the NuMaker-M3351KJ development board and Nu-Link debugger, with support for Keil MDK Nuvoton Edition, IAR EWARM, and Visual Studio Code development environments, accelerating product development and deployment across robotics, smart appliances, motor and actuator control, and industrial automation applications.

The post Nuvoton Launches NuMicro M3351 5V MCU Series for Robotics and Industrial Automation appeared first on ELE Times.

Vicor will demonstrate how high-density power modules enable SWaP compatible power designs for defense applications at the Land Forces International Land Defence Exposition on October 6-8 in Perth, Australia.

Demands of rapid response are driving modern land defense innovation, where electrification is redefining the field mobility strategies and rules of engagement. To meet increasing system capabilities, defense power architecture is moving away from bulky custom subsystems toward a more interoperable, compact, modular building bloc approach.

Vicor enables this shift with high-density power solutions that drastically cut size and weight. Rugged power modules and VITA/SOSA-aligned supplies support the entire delivery network—from high-voltage inputs down to standard MIL-STD 270V and 28V buses. Vicor’s entire high performance portfolio of M-grade products are reliable, rugged and support SWaP specifications.

The post Vicor to Showcase Power-Dense DC-DC Converters for Defence Applications at Land Forces 2026 appeared first on ELE Times.

Worldwide spending on AI is forecast to total $2.7 trillion in 2026, a 49.5% increase year-over-year, according to Gartner, Inc., a business and technology insights company.

“Demand for AI infrastructure (including AI-optimized IaaS, AI-optimized servers, AI network fabric, AI processing semiconductors and devices) to support anticipated future workloads remains strong and inelastic to pressures from memory related pricing increases,” said John-David Lovelock, Distinguished VP Analyst at Gartner. “The buildout of AI data center capacity is the largest infrastructure project humanity has even undertaken. The capacity growth from hyperscalers and service providers purchasing AI-optimized servers will continue to be the largest single area of spending.”

In the software market, vendors across different software types are rapidly embedding agentic AI within their existing products to maintain relevance in the market and defend against new cross-functional agents (see Table 1). With GenAI firmly in the Trough of Disillusionment in 2026, enterprises are using these simpler embedded AI features from their incumbent software providers to grow operational efficiency and automate workflows, improve customer engagement and enhance decision making.

Table 1: Worldwide AI Spending by Market, 2025-2027 (Millions of U.S. Dollars)

Market	2025	2026	2027
AI Services	434,046	576,481	745,655
AI Cybersecurity	25,920	51,347	85,997
AI Software	288,168	461,637	656,353
AI Agents and Assistants	16,481	29,219	65,472
Generative AI Models	13,021	28,266	51,620
AI Platforms for Data Science and Machine Learning	19,405	26,445	35,552
AI Application Development Platforms	6,885	9,541	12,478
AI Data	826	3,126	6,480
AI Infrastructure	981,920	1,484,397	1,977,685
Total AI Spending	1,786,671	2,670,460	3,637,292

 

“Meanwhile enterprises are turning to service providers less often to help them manage the business transformation, and more often for the smaller indirect projects to exploit AI features of their incumbent software system,” said Lovelock. “The risks associated with vendor lock-in, data sovereignty, and run-away costs are not deterring buyers from adopting these proprietary capabilities. The combination of transformation and indirect projects are forecast to drive a $1.2 trillion opportunity in AI services by 2030.”

Near-Term Outlook Changes

The short-term outlook for AI application development platforms has increased from 28% growth in 2026 in the previous forecast to 39% in this quarter’s forecast, as enterprises, software providers and services firms seek to develop custom AI applications tailored to their individual needs. Enterprises are looking to their providers to help them manage their costs and embed usage tracking into their workflows to evaluate success. For model providers, the pressure to offer more cost-efficient models that are aligned to enterprise use cases is opening a small but growing opportunity for domain-specific language models (DSLMs). As a result, the 2026 growth rate for generative AI models has increased from 110% growth in the previous forecast to 117% growth in the current forecast.

Long-Term Outlook Changes

In the current forecast, Gartner has separated cross-functional agents and assistants from AI software and added consumer agents and assistants into the AI spending forecast to better show the emerging opportunity in this area.

The post Gartner Forecasts Global AI Spending to Reach $2.7 Trillion in 2026, Up 49.5% appeared first on ELE Times.

Nuvoton Technology Corporation has introduced the NAU85L42YG, a high-performance quad-channel audio ADC designed to accelerate the development of wireless streaming and real-time voice-capture products. The device features Nuvoton’s on-chip silicon signal-processing technology, including low-latency decimator (DECM) digital linear and non-linear filters. These low-pass filters are designed to support wireless real-time streaming applications. The NAU85L42YG also supports a wide supply-voltage range and incorporates robust system protection features.

The NAU85L42YG is a high-performance quad-channel audio ADC designed for audio systems that use both analogue and digital microphone inputs, helping simplify system integration and reduce the need for separate circuitry. The device integrates four ADC channels and supports I²S, PCM and TDM digital audio output interfaces. It also features an advanced on-chip signal-processing engine with a fractional FLL that supports various input clocks and automatic clock detection for BCLK and MCLK. In addition, the NAU85L42YG offers a wide supply-voltage range and robust system protection features.

Addressing Industry Pain Points in Multi-Mic Design

We are pleased to announce significant advancements in the NAU85L42YG, setting a new benchmark for reliable voice capture in 4-array microphone algorithm applications. Designed with precision and adaptability, the NAU85L42YG ensures robust performance by allowing the host SoC to seamlessly detect any microphone malfunction through Mic Diagnostic monitoring. This proactive detection, combined with customer adaptive algorithms, delivers real-time, dependable signal quality. As a result, the NAU85L42YG empowers host-side algorithms to perform at their best, providing exceptional accuracy and reliability in voice capture. These features underscore the NAU85L42YG’s market advantage and reinforce our commitment to innovation and excellence in audio technology.

Conventional quad ADCs without low pass filters will cause delay / high latency during audio data transmission on critical events, especially in real-time stream processing applications. It will cause a mismatch between audio and video streaming, bringing a worse user experience. Nuvoton’s new quad ADC design significantly addresses this challenge by reducing latency time to just one-sixth of what conventional quad ADCs offer. This improvement makes the NAU85L42YG an ideal solution for WiFi or Bluetooth wireless devices that demand low group latency to deliver an outstanding audio user experience.

Key Technical Highlights & Feature Summary YG

1. 106 dB SNR / DR @ 1 Vrms& 2 Vrms
2. Support up to 192 kHz at 24-bit high resolution
3. Develop low latency decimator digital linear and non-linear filters for low latency real time processing
4. Built-in intelligence of microphone diagnostic & auto clock detection for algorithm quality assurance
5. Flexible output interface supporting PCM / I 2 S / TDM formats for seamless connection and easy integration with audio processors
6. Two separate low-noise microphone bias suppliers
7. Wide temperature range: -40°C ~ +105°C (Industrial grade)
8. Compact package of QFN-32 (4 X 4 mm) with low power <12.4 mW/Channel

The post Nuvoton Unveils NAU85L42YG Quad ADC for Multi-Microphone Voice Capture Applications appeared first on ELE Times.

Silicon carbide (SiC) power semiconductors are increasingly being adopted in high-voltage electric vehicle (EV) powertrains as manufacturers are achieving higher efficiency, faster charging, and improved power density in next-generation EV powertrain designs. And the most recent practical demonstration related to this comes from Japanese semiconductor company ROHM Semiconductor announced that its SiC MOSFETs are being used in BMW’s sixth-generation electric powertrain, named the Neue Klasse.

The electric powertrain of BMW’s Gen6 is based on an 800V architecture to enable faster charging and more efficient high power energy transfer while supporting higher-power charging and powertrain performance of the next-generation powertrain. BMW has designed an electric motor, a new inverter and other powertrain components optimised for the higher-voltage system. The inverter uses SiC semiconductors to improve power-conversion efficiency and is integrated into electric motor housing.

Greater switching efficiency can also allow engineers to increase power density and reduce the size of supporting components in power-conversion systems. Reducing losses during power conversion lowers heat generation, which can ease thermal- management requirements and contribute to improved overall powertrain efficiency.

The use of ROHM’s SiC MOSFETs in BMW’s Gen6 powertrain highlights the growing use of wide-bandgap semiconductors in future EV power electronics because of its switching performance, voltage capability and power-conversion efficiency. As manufacturers adopt higher-voltage platforms, SiC devices are likely to be critical technology for enhancing power-conversion efficiency, thermal management and charging capacity.

The post Why SiC Is Critical to BMW’s Next-Generation 800V EV Powertrain appeared first on ELE Times.

L&T Semiconductor Technologies (LTSCT), has announced its first Silicon Carbide (SiC) product platform at SEMICON India 2026. The company has showcased 40 products designed for EV fast charging, traction inverters, microgrids and solid-state transformers. Among the showcased products, a key highlight was the 1200V SiC MOSFET platform for power-conversion applications.

SiC is increasingly adopted in EV power electronics, because it can switch power electronics at higher temperatures and switching frequencies than comparable silicon power devices, particularly silicon IGBTs. In an EV traction inverter, the power semiconductor switches battery DC power into AC power sent to the motor. Increasing the switching and conduction efficiencies of the power devices can increase the overall conversion efficiency.

Higher switching frequencies can also enable engineers to select smaller passive components which can lower the inverter’s size and weight. Additionally, SiC’s high-temperature operation capability contributes to greater thermal management flexibility due to its material and device characteristics. These advantages are relevant to the high-voltage EV architectures such as 800V systems.

By decreasing energy lost as heat during power conversion, higher inverter efficiencies can increase the driving range per charge depending on the overall vehicle design and operating conditions. The difference in range is ultimately limited by the efficiency of the entire powertrain—including batteries, motors, and thermal-management systems—as well as by overall driving conditions.

LTSCT’s SiC platform represents a significant step in the evolution of India’s expanding power-semiconductor ecosystem, especially as EV manufacturers move towards higher-voltage architectures and faster charging. Alongside the SiC platform, the company has showcased a highly integrated BLDC motor controller that is fully designed in India, further expanding its range from individual semiconductor devices to complete power-electronics solutions.

The post L&T Semiconductor Technologies Unveils 1200V SiC Platform for EV Power Electronics appeared first on ELE Times.

​Hyundai Motor India has inaugurated 120 kW DC fast-charging stations at strategic locations in New Delhi. These high-power charging stations are intended to provide faster charging for EV users and can be accessed through the myHyundai app and other charging-management applications. The company’s DC fast-charging solutions in India currently range from 60 kW to 240 kW, offering different charging power levels based on the vehicle’s configuration.

A 120-kW DC fast charger provides significantly higher charging power compared to conventional AC charging systems and can therefore reduce charging time. The actual charging time for an EV battery depends on several factors, including the vehicle’s maximum DC charging capability, battery capacity, state of charge, temperature, and charging curve. The maximum capacity of these inaugurated charging stations is 120 kW, but the EV will only draw power suitable for its charging.

Impact on Grid Demand

Charging a vehicle at higher power also increases instantaneous electricity demand. A 120-kW charger operating at its rated output can deliver up to approximately 120 kW of DC power to an EV, excluding conversion and other system losses. Multiple chargers operating simultaneously at charging stations can creates significant local electricity demand of power supply, requiring suitable transformers, switchgear, cables and grid connections.

Thermal Management Challenges

A high amount of heat generates while charging an Electric Vehicle using high-power DC charging. This heat generates inside the battery, cables and connectors. Effective thermal management is therefore required to maintain charging performance and protect components from the extensive heat generated. This can involve liquid-cooled cables, cooling systems, temperature monitoring, and a​ power-control strategy.

The inauguration of 120 kW charging station represents growing shifts towards faster charging consumer infrastructure in India. The speed of charging an EV will ultimately depend on battery technology, interaction between charger power, vehicle architecture, thermal management and available grid capacity.

The post Hyundai 120 kW DC Fast Charging in Delhi: Enhances EV Charging Time and Thermal Management appeared first on ELE Times.

RAAF has declared initial operational capabilities for the AGM-158C LRASM and AGM-158B JASSM-ER. The AGM-158C LRASM will vastly increase the strike range of Australia against both land and maritime targets in defended environments. LRASM is an air-launched, self-propelled, autonomous anti-ship missile with autonomous target identification capabilities. It is designed to detect and destroy large surface targets at ranges greater than 370 km. It uses sensor and internal processing to find, identify, and attack targets in GPS- and communications-denied environments, and its low-observable features and flying attitude provide a higher probability of survivability against today’s ship-based radars.

JASSM-ER is a long-range stealth cruise missile for land attack missions. The range is listed as “about 900 km (560 mi)” by the RAAF. (The missile allows the launching aircraft to remain outside the range of enemy air defences). Both weapons are being added to the RAAF F/A-18F Super Hornet force, which is firing the weapons in areas such as weapons storage, mission planning, aircraft loading, and targeting. Australia has already employed two LRASM and two JASSM-ER missiles from the Woomera Test Range in Australia and two LRASM from P-8A Poseidon aircraft in RIMPAC 2026, attacking the target.

The two systems also show how modern missile systems leverage advanced precision navigation, sensor-fusion, autonomous processing, and electronic-warfare resistance. Their strategic use also underscores how Australia is turning to long-range deterrence and maritime security in the Indo-Pacific, with aircraft carrying out strikes well outside the range of increasingly capable air-defence systems.

The post Australia Operationalises LRASM and JASSM- ER Strike Missiles appeared first on ELE Times.