Microelectronics world news

Remember 2020? Global pandemic lockdown forced many of us out of our cubicles and into haphazard home offices, frantically outfitted and upgraded for their new tasks. Retailer inventories of webcams (and associated green screens), ring lights, microphones, headsets, broadband networking equipment and the like quickly evaporated, boosting the prices of whatever remaining equipment stock scraps were left to stratospheric levels. And both existing and new suppliers, sensing a highly profitable business opportunity, rushed to market with products based on whatever (sometimes subpar) system building blocks they could source.

Four years later, COVID-19 is still with us, of course, but many of us have returned to the cubicles (at least part-time, and sometimes reluctantly). But regardless, we’re now fully gear-equipped at all possible work locations. The electronics supply-vs-demand curve has therefore regained sanity, leading to no-longer-crazy prices. And longstanding webcam (for example) suppliers are differentiating their products, hoping to escape profit-killing commoditization: BenQ with the easily relocatable, macro-capable ideaCam S1 Plus and Pro, for example:

Logitech’s Brio line with a focus (pun intended) on high res and other image enhancements:

And Razer’s Kiyo integrating illumination:

Back to commodities. As I’ve mentioned before, I regularly donate computers, both ones that I’ve personally used and outgrown and others hand-built specifically for this purpose, to a local charity for subsequent handoff to its income- and otherwise-challenged clients. I always make sure that the computers include full online communications capabilities—a microphone, speakers, and a webcam, to be precise—for virtual job interviews, online advanced education classes and the like. With laptops this is easy, since such gear is already built in. For desktop computers, on the other hand, I need to source this stuff separately.

Back in February (as well as several times before, apparently), the Avaya Huddle HC010 Webcam was on sale at bargains site Meh, in this case for $14.99 each. At the time, it was reportedly selling for $60.99 at Amazon (it’s now $39.99 there as I write these words two-plus months later), so I quickly “fished” the three-unit limit (two will eventually end up with charity-donation computers; the third is being dissected here just for you). And longer-term historical data is even more revealing. Back in mid-2021 when the pandemic was still raging and the product was just-introduced, Amazon had it marked at $129 per price-tracking site CamelCamelCamel.

The specs are average and passable:

• 1080p and 720p resolution options, along with a 30 fps frame rate
• A/V output: H.264 over USB 2.0
• Digital (i.e., software-interpolated, and Windows-only) pan, tilt and 4x zoom
• 85° horizontal field of view
• Two integrated microphones
• Built-in privacy cover
• Integrated activity light
• Dimensions of 4.65″ (L) x 1.46″ (W) x 1.22″ (H)
• Weight of 3.28 oz
• 1/2.8″ CMOS image sensor
• 8mm focal length

although low-light performance is generally dubious-at-best with such cost-centric products. Here’s a promo video with more details:

And here’s our victim, beginning with the obligatory outer box shots:

Note, to my earlier “suppliers sensing a highly profitable business opportunity” comment, the mid-February 2021 manufacturing date:

Now let’s take a peek inside:

A desiccant packet and two slivers of literature:

Along with (cue striptease music)…

Our patient, as-usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes:

Here’s what it looks like from the front. Note the microphone ports to either side of the currently protected cover/lens, and the currently extinguished activity light above the penny:

Remove the protective sliver of plastic in the center and you can see the privacy cover, marked red to alert you when it’s in place:

versus slid away to reveal the lens behind it:

with both positions controlled by a topside switch:

Here’s the rear (I made a rhyme! I’m easily amused!):

And here’s the bottom, first revealing the ¼” thread tripod base built into the lower segment of the two-piece hinged “foot”:

Unfold the two halves of the “foot” and more product info appears, courtesy of another label (augmenting the already shown one attached to the product packaging):

There’s actually another hinge, this one connecting the “foot” to the main body and convenient for when you need to tilt the webcam down post-mount to more effectively frame the user:

And speak of “mount”, it occurred to me post-disassembly of the Avaya HC010 that some of you might not already be familiar with standalone webcams (versus those built into laptop display bezels) and therefore how they’re mounted to displays. Here’s my woefully dusty Logitech Brio perched on top of my Dell UP2516D two-LCD suite; the HC010 operates similarly:

Onward. The front panel pops off easily:

The translucent rubber piece shown at left in the prior photo fell out as I was pulling the panel off. I put it back in place for the following photo (stay tuned for its function):

We now have our first unobstructed perspective of the insides, once again in both privacy cover-active and-inactive modes:

Note the (inexpensive) electret condenser mics on either side, along with the “hole” into which the other end of the recently mentioned translucent rubber piece fits. The piece’s function, as it turns out, is to act as a sort of “light pipe”, transferring the illumination coming from an embedded-in-hole LED, presumably attached to a PCB-to-be-seen-fully-later, to the front panel.

See, too, those four screws, one in each corner? To proceed further, I first tried removing them:

which didn’t get me anywhere meaningful:

The five additional inner screws, on the other hand…

The aforementioned two-piece “foot” also detached as a result:

Now let’s see if we can get the inside assembly to move:

That’s encouraging:

All that’s left is to detach the USB cable’s power-and-data connector to the PCB:

And out it goes!

with the gasket around each mic coming off in the process:

Here’s a standalone front view of the inner assembly, with most of the PCB still obscured by the black plastic frame:

Top view:

Bottom:

And finally, the now-visible backside:

Four more screws to remove:

And the black plastic frame comes right off. Inside:

Already-seen outside:

And now free-and-clear PCB:

Next, let’s detach those mics:

Note, too, the previously embedded-in-hole LED in the upper left corner of the USB connector:

Bottom-side view:

Top:

Left:

Right:

And now let’s flip the PCB back over and peel off the heat sink you likely already noticed earlier:

The dominant-size square IC now revealed at right has markings too faint to discern in a photo, so you’ll have to take my word that it’s the SSC33x Camera SoC Processor from a company called SigmaStar. The smaller chip in its upper left corner (the one with the dab of blue paint on top of it) is a GigaDevice GD25Q64CSIG 64 Mbit SPI NOR flash memory, presumably containing the system firmware. And in the middle, you probably already noticed two more screw heads:

I’m betting that removing them will enable detach of the lens assembly on the other side of the PCB. Let’s see if I’m right:

Yep, we have liftoff:

Here’s the now-exposed other end of the lens:

And here’s the image sensor!

That wraps it up for today, folks. As always, I welcome your thoughts in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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• The Godox V1 camera flash: Well-“rounded” with multiple-identity panache
• Teardown: Blink XT security camera
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The post Disclosing the results of a webcam closeup appeared first on EDN.

The EDA trio—Cadence Design Systems, Siemens EDA, and Synopsys—is working hands in hand with TSMC to facilitate production-ready EDA tools for the mega-fab’s newest and most advanced processes. These EDA outfits showcased their IC design solutions at the TSMC 2024 North America Technology Symposium held in Santa Clara, California, on 24 April 2024.

The EDA tie-ups with TSMC show how toolmakers have established a symbiotic relationship with large fabs to support chip designers on advanced semiconductor manufacturing nodes. Moreover, it demonstrates why design flow migration is critical when chip designs move from one advanced node to the next.

1. Cadence

Cadence showcased its node-to-node design migration flow based on the Cadence Virtuoso Studio, which facilitates the migration of schematic cells, parameters, pins, and wiring from one TSMC process node to another. Next, Virtuoso ADE Suite’s simulation and circuit optimization environment tunes and optimizes the new schematic to ensure the design achieves all required specifications and measurements.

That allows IC designers using Cadence tools on TSMC process nodes to automatically recognize and extract groups of devices in an existing layout and apply them to similar groups in the new layout. Cadence has also been working closely with TSMC to ensure its EDA tools’ compatibility with fab’s advanced nodes, including N3E and N2 process technologies.

Figure 1 The enhanced PDKs and EDA methodologies simplify and accelerate the design migration from one process node to another. Source: Cadence

2. Siemens EDA

Siemens EDA displayed its IC design solutions for TSMC’s latest process and advanced packaging technologies, including IC verification tool Calibre nmPlatform now certified for TSMC’s N2 process. At TSMC’s event, Siemens EDA also demonstrated its FastSPICE platform for circuit verification of nanometer analog, RF, mixed-signal, memory; it’s now certified for TSMC’s N3P, N2 and N2P process nodes.

Figure 2 The EDA toolset certifications are crucial in migration to new IC manufacturing process and advanced packaging technologies. Source: Siemens EDA

Siemens EDA also provided details about collaboration with TSMC to certify its Calibre 3DSTACK solution’s support for the foundry’s latest 3Dblox standard. TSMC’s 3Dblox technology addresses specific IC test and diagnosis challenges that arise at 2-nm geometries and below.

3. Synopsys

Synopsys also unveiled details about its latest collaborations with the Taiwanese fab, including a co-optimized photonic IC flow, which is integrated with the EDA firm’s 3DIC Compiler and supports TSMC’s 3Dblox technology.

Figure 3 The production-ready design flows were showcased for TSMC’s advanced nodes at the symposium. Source: Synopsys

Additionally, Synopsys showcased its digital and analog design flows compatible with TSMC’s N3/N3P and N2 process nodes. The EDA toolmaker is also working closely with TSMC to ensure the design productivity and optimization of its AI-driven flows such as Synopsys DSO.ai.

Related Content

• TSMC rolls analog design kit, EDA formats
• TSMC taps Cadence to provide DFM services
• TSMC debuts EDA reference flow for SoC designs
• EDA toolmakers prep for TSMC’s N3E and N2 nodes
• Synopsys collaborates with TSMC on 2nm IP portfolio and photonics ICs

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Raptee is a full-stack two-wheeler EV startup with their flagship product highly tech-enabled and IoT-centred. The team began operations out of Chennai in 2019 with a mission to democratise electric mobility in India. They are crafting a two-wheeler EV that is more of an augmented machine which is intelligent, intuitive and safe with features like throttle mapping, blind-spot detection, and Bluetooth connectivity. So far, Raptee has over 31 technological patents in its name.

Rashi Bajpai, Sub-Editor at ELE Times spoke with Mr Dinesh Arjun, CEO and Co-founder at Raptee on various aspects of EV with a prime focus on the Indian market.

This is an excerpt from the conversation.

1. Can you throw some light on the go-to features/ major USP of Raptee’s electric motorcycle?

Our bikes come with an onboard charger that plays an essential role in bidirectional charging modes thus making the riding experience hassle-free. Additionally, we stand out as the only electric two-wheeler company in India to leverage the ubiquitous CCS2 charging standard. This compatibility grants you access to the extensive public charging network, allowing you to top up your bike from 0 to 80% in a mere 45 minutes.

2. What core technologies and concepts does the team Raptee work on? Please highlight your key expertise and core competencies.

As the sole electric two-wheeler (e2W) utilizing a high-voltage drivetrain, we deliver superior performance surpassing any internal combustion engine (ICE) counterparts. The seamless integration of VCU and cloud computing not only enhances rider experience with smoother acceleration and improved handling but also offers practical benefits like efficient trip planning through real-time battery status updates, showcasing Raptee’s commitment to innovation and practical functionality on the road.

3. As India moves towards self-reliance in the area of information and technology, a wave of innovations and ideas has taken over the nation. How well is Raptee prepared to pursue development in the EV sector under the “Make in India” policy?

Raptee substantiates its alignment with the “Make in India” policy through its complete in-house design and development of all components. This comprehensive approach not only ensures technological sovereignty but also fosters a culture of innovation and expertise within the domestic industry. Additionally, Raptee’s establishment of a complete supply chain ecosystem from scratch addresses a critical gap in the market, particularly concerning high-voltage technology. This initiative not only reduces dependency on imports but also enhances the resilience and competitiveness of India’s EV sector.

4. What is your view on EV battery swapping booths and can its implementation help India come closer to sustainable electric mobility?

As battery technology evolves, the range of EVs is steadily increasing, reducing the need for frequent charging. This improvement diminishes the perceived advantage of battery swapping, which is often promoted as a quick solution for limited-range EVs. As batteries become more energy-dense and charging times decrease, charging stations become more efficient and comparable in terms of convenience.

5. India’s electric two-wheeler (E2W) sector is expected to cross the one million mark in 2024-what are the factors that will influence the market to reach the mark?

India’s E2W market is on an electric revolution, with sales expected to breach the one-million mark in 2024. This surge is driven by a customer-centric approach. Gone are the days of limited choices. Manufacturers are offering diverse options, from high-performance motorcycles to practical everyday rides, catering to every rider’s needs. Range anxiety is fading too, with advancements in battery technology and a rapidly expanding charging network. Additionally, robust customer support with readily available service and informative resources empowers riders, building trust and confidence in E2Ws. This focus on customer satisfaction, coupled with innovation and infrastructure development, is paving the way for a million E2Ws and a sustainable transportation future for India

6. How can better implementation of the charging infrastructure accelerate the sales of EVs?

A well-developed charging infrastructure plays a pivotal role in accelerating electric vehicle (EV) sales by addressing critical consumer concerns. Firstly, it alleviates the fear of “range anxiety” among potential buyers by ensuring a widespread network of charging stations along highways and in urban areas, thereby assuring drivers they can recharge conveniently during their journeys. Secondly, the availability of fast-charging stations, such as those utilizing the CCS2 standard, significantly reduces charging times, making EVs more competitive with traditional gasoline vehicles. This not only enables quicker trips but also enhances overall convenience by minimizing wait times at charging stations. Moreover, a robust charging infrastructure sends a powerful message to the public, signaling that EVs are a practical and supported transportation choice. This reassurance can sway hesitant consumers, ultimately driving increased EV adoption.

7. Tell us about Raptee’s goals and vision for the next decade.

Raptee’s vision is nothing less than a revolution in personal mobility. We are committed to accelerating the shift towards safe, smart, and sustainable transportation solutions, making them accessible to everyone. Fueled by a deep-tech core, we’re pioneering innovative technologies like HV drivetrains to achieve this ambitious goal.

Our focus isn’t limited to electric vehicles. We see ourselves as architects of the future of mobility, constantly exploring new product landscapes based on customer preferences and inventing disruptive technologies across different segments.

By the next decade, Raptee aspires to be a global leader in personal mobility, with a significant market share. This leadership will be built on the foundation of our unwavering commitment to safety, sustainability, and cutting-edge technological innovation.

The post Raptee Sets the Stage for Two-Wheeler EVs in India appeared first on ELE Times.

Engaging Multiple EU Partners, the Projects Will Apply Intelligent Sensing and AI-enabled Learning Technologies

As part of the European Union’s drive to support a multifaceted approach to addressing 6G challenges and promises, CEA-Leti has been chosen to coordinate two projects to help build first-class 6G technology capabilities and boost standardization efforts across Europe.

The two projects were among 27 chosen in a competitive proposal process by an EU partnership that divided €130 million between the projects. “These projects present a significant stride towards advancing smart networks and services, offering breakthrough innovations, experimental platforms and large-scale trials, driving world-class research and shaping the world’s digital connected future,” said the group, called the Smart Networks and Services Joint Undertaking (SNS JU).

6G-DISAC (Distributed Intelligent Sensing and Communication) and 6G-GOALS (Goal-Oriented AI-enabled Learning and Semantic Communication Networks) launched their three-year projects in January with multiple EU collaborators.

The two projects mark the first time a single RTO or company has been chosen to coordinate two competitive EU proposals in the same initiative. CEA-Leti has coordinated several EU projects, including the recently completed RISE-6G project. That SNS JU effort developed a disruptive new concept as a service for wireless environments by dynamically controlling wireless communication for brief, energy-efficient and high-capacity communications on a variety of surfaces, such as such as walls, ceilings, mirrors and appliances.

6G-DISAC

This project will develop and innovate on a widely distributed intelligent infrastructure compatible with both real-world integration constraints, new semantic and goal-oriented communication and sensing approaches, and the flexibility requirements of future 6G networks. It will apply theoretical approaches and operational and standards-compatible, distributed joint communication and sensing, by leveraging the expertise of world-leading network vendors, verticals, SMEs, research laboratories and academic institutions spanning the value chain.

Current approaches to integrated communication and sensing use centralized architectures and pass sensed information through a centralized controller.

“This project will bring the integrated sensing and communication (ISAC) vision into reality, going well beyond the usual restrictive standalone or localised scenarios, by adopting a holistic perspective, with large numbers of connected users and/or passive objects to be tracked,” said Emilio Calvanese Strinati, coordinator of the project and CEA-Leti’s smart devices & telecommunications strategy program director.

“With demonstrations that validate the vital 6G-DISAC concepts, the project will revolutionise various applications, from extended reality and robot-human interaction to vehicular-safety functions and improving communication key performance indicators (KPI) with sensing-aided communications,” he explained.

In addition to defining use cases and designing innovative network architecture, the 11 6G-DISAC partners will develop novel physical-layer waveforms, distributed sensing and communications methods, and optimised resource allocation methods and protocols.

Specific targets include:

• tracking connected user equipment (UE) and passive objects,
• performing ISAC with many distributed base stations, efficient distributed signal processing and machine learning for semantic ISAC, and
• incorporating extremely large multiple-input, multiple-output (MIMO) technologies and reconfigurable intelligent surfaces, and intelligent sensing activation.

“While addressing these fundamental and practical challenges, the team will focus on the distributed implementation of ISAC, unlocking real sensing applications and providing a multi-perspective view of networks in space and time for tangible communication gains,” Calvanese Strinati said.

6G-GOALS

This project is designed to reduce data traffic by conveying only the most relevant information and produce data-efficient, robust and resilient protocols that can adapt to network conditions and communication objectives using modern AI/ML techniques.

“As wireless mobile communication requires ever-higher data rates and 5G’s scope expands to include massive and ultra-reliable low-latency links, wireless evolution has been pressed to solve the technical problem of reliable data exchange between two end-points,” said project coordinator Calvanese Strinati.

“The 6G-GOALS project will take the wireless system design to its next stage by considering the significance, relevance and value of the transmitted data and transforming the potential of the emerging AI/ML-based architectures into a semantic and goal-oriented communication paradigm, offering a solid step toward cooperative generative AI technologies,” he said.

Semantic communication is instrumental in inducing reasoning and shared understanding among intelligent agents by exchanging pragmatically selected information in which its meaning to the receiver is designed to efficiently accomplish a goal or a task. With current approaches, data is sensed and transferred from sensors to the destinations without prior semantic extraction functions.

A recent paper written by 6G-GOALS participants noted that advances in AI technologies have expanded device intelligence, fostering federation and cooperation among distributed AI agents. These advancements impose new requirements on future 6G mobile network architectures.

“To meet these demands, it is essential to transcend classical boundaries and integrate communication, computation, control, and intelligence,” the paper, “Goal-Oriented and Semantic Communication in 6G AI-Native Networks: The 6G-GOALS Approach”, reports.

“These projects are fundamental to explore the capabilities of AI/ML solutions on the networks of the future, especially dealing with joint communication and sensing and semantic communications,” said Mauro Boldi Renato, EU project program coordinator at TIM (Telcom Italia). “Working with CEA-Leti represents a solid basis for their success and for bringing European industry towards implementation of 6G around 2030.”

“The exploitation of 6G-DISAC and 6G-GOALS project results will represent a transformative step for manufacturers and 6G industrial players, like NEC Corporation, by fostering the development of distributed intelligent networks and semantic/AI-driven communication strategies,” said Vincenzo Sciancalepore, principal researcher at NEC Laboratories Europe GMBH/ Germany and a member of the 6G-DISAC team. “Such an unprecedented approach will enable more efficient, flexible, and responsive network infrastructures that can support advanced applications, such as extended reality and automated mobility, meeting the increasing demand for high-capacity, low-latency and sustainable communication.”

6G-DISAC Partners

• Coordinator: CEA-Leti/France
• Technical Manager: Chalmers Tekniska Hogskola AB/Sweden
• Innovation Manager: Nokia Networks/ France
• Telecom Italia Spa/Italy
• Orange S.A./France
• Ethniko Kai Kapodistriako Panepistimio Athinon/Greece
• Institut Polytechnique

De Bordeaux/France

• NEC Laboratories Europe GmbH/Germany
• NEC Italia S.P.A/Italy
• Robert Bosch GmbH/Germany
• RadChat AB/Sweden

6G-GOALS Partners

• Coordinator: CEA-Leti/France
• Technical Manager: Consorzio Nazionale Interuniversitario per le Telecomunicazioni/Italy
• Innovation Manager: NEC Laboratories Europe GMBH/ Germany
• NEC Italia S.p.A/Italy
• Telecom Italia S.p.A/Italy
• Eurecom GIE/France
• Aalborg Universitet/Denmark
• Hewlett-Packard/France
• Hewlett-Packard Italiana S.R.L/Italy
• Toshiba Europe Limited UK
• Imperial College of Science Technology and Medicine UK
• Singapore University of Technology and Design

The post CEA-Leti Selected to Coordinate Two EU Projects for Developing ‘First-Class’ 6G Capabilities and Contributing to Standardization appeared first on ELE Times.

Microchip’s ATMXT2952TD 2.0 family of touch controllers offer cryptographic authentication and data encryption

As we see an increased number of electric vehicles (EVs) on the road, the necessary charging infrastructure must expand to meet the increased demand. Adding credit card payment options to EV chargers is becoming a standard practice in many countries—and is a mandate in the European Union—and chargers need to meet Payment Card Industry (PCI) security standards. To help EV charger designers protect their payment architectures, Microchip Technology has launched the MXT2952TD 2.0 family of secure touchscreen controllers.

Typical touch-enabled human-machine interface (HMI) and radio frequency identification (RFID) combination-based payment systems are vulnerable to hacking attacks via malicious software updates or man-in-the-middle attacks when a user enters their personal identification number (PIN) on the touchscreen. Physical mesh barriers and sensors are often used around these integrated circuits (ICs) for protection from hacking. Constant reflashing of software and device resets are used to help safeguard software integrity. The MXT2952TD 2.0 family is designed to encrypt touch data and cryptographically authenticate software updates to minimize risk and meet PCI certification compliance standards. When the RFID reader IC and the touchscreen controller are on different printed circuit boards (PCBs), it is especially difficult and expensive to build physical barriers for hack protection. Embedded firmware on the MXT2952TD 2.0 provides a more easily implemented solution for EV charger manufacturers to remain compliant with security regulations and avoid the cost of adding a second, expensive touchscreen payment module to the charger.

The outdoor nature of EV charger HMI demands they withstand harsh weather conditions, function accurately in the presence of moisture and are resistant to vandalism. MXT2952TD 2.0 touch controller-based touchscreens remain effective when designed with IK10 standard 6 mm-thick glass, anti-reflective, anti-glare and anti-fingerprint coatings and IR filter/UV filter layers. Microchip’s proprietary differential touch sensing delivers exceptional noise immunity for superior touch performance even when used with thick gloves.

“The maXTouch 2952TD 2.0 family provides EV charger designers with a cost-effective, secure design architecture for implementing credit card payments with PIN entry on their touchscreens,” said Patrick Johnson, senior corporate vice president overseeing Microchip’s human machine interface division. “Combined with the rugged, outdoor HMI touchscreen technology that Microchip’s maXTouch portfolio is known for, the new addition to the 2952TD family of touchscreen controllers offers our customers secure designs and the exceptional touch performance necessary for outdoor applications.”

In addition to EV chargers, the MXT2952TD 2.0 family is well-suited for most unattended outdoor payment terminals such as parking meters, bus ticketing meters and other types of point-of-sale (POS) systems. The 2952TD 2.0 is specifically optimized for 20” screen sizes and its sister part, the MXT1664TD, is available for 15.6” screen sizes.

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Murata’s PKGM-200D-R vibration sensor detects high-frequency vibrations up to 11 kHz to assist predictive maintenance in production equipment. The device measures vibration acceleration along the Z-axis to detect abnormal vibrations, which can indicate early bearing wear and prevent unexpected equipment stoppage.

For rotary bearings, engineers can employ FFT analysis on vibration data to pinpoint irregularities caused by depleted grease or minor surface imperfections. By detecting these anomalies early on, FFT analysis enables proactive intervention, potentially averting impeding issues before they escalate.

Housed in a compact 5.0×5.0×3.5-mm surface-mount package, the PKGM-200D-R integrates a PZT piezoelectric ceramic element, driver circuit, and temperature sensor. Differential analog output reduces line noise. Specifications for the sensor include a detection range of ±10.2 g minimum, a frequency band of 6 kHz to 11 kHz, and sensitivity of 118 mV/g typical.

The PKGM-200D-R vibration sensor requires a supply voltage of 3.0 V to 5.2 V, with current consumption of 3.5 mA. It operates over a temperature range of -20°C to +85°C. The device is now in mass production.

PKGM-200D-R product page 

Murata Manufacturing 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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