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PCIM Asia 2024 opens on 28 August in Shenzhen

Tue, 08/27/2024 - 10:51

PCIM Asia 2024 will open its doors from 28 – 30 August at the Shenzhen World Exhibition and Convention Center. Expanding to 20,000 sqm of floor space, this year’s event will welcome 232 exhibitors, representing a rise in exhibitor count of over 28% compared to the 2023 edition. The fair’s fringe programme will feature forums and round table discussions on e-mobility, clean energy, energy storage, wide bandgap (WBG) semiconductors and more. Alongside, the PCIM Asia Conference 2024 will present new technical developments, applications and research in power electronics.

Throughout its three-day run, PCIM Asia 2024 will present the latest advancements in power electronics designed for a wide range of market segments. Maintaining their role as sponsors, Mitsubishi Electric, Semikron Danfoss, Fuji Electric, Infineon and ROHM will be among the leading exhibitors participating in the show.

Other notable exhibitors include AST Technology, Bronze Technologies, CRRC, EPC, FastSic, GaNext, Grecon Semiconductor, Hitachi Energy, JIEJIE MICROELECTRONICS, JSAB, LEM, MacMic, Msemitek, NARI Semiconductor, nexperia, NXP, onsemi, Power Integrations, SiChain Semiconductor, Silan, Sunking Tech, TanKeBlue, Toshiba Devices & Storage, UNITED NOVA, VAC, WeEn, Wolfspeed, Yangjie Electronic and YASC.

As the electric vehicle (EV) market in China continues to heat up, this year’s edition has drawn participation from several first-time exhibitors offering technologies relevant to EV development, including VCTC, Bosch, Amulaire and others.

A full schedule of concurrent events

Alongside the exhibition, a series of industry and exhibitor forums will take place, addressing topics including WBG semiconductors, power devices, materials and packaging, and e-mobility. These forums provide further opportunities for interaction and learning, allowing exhibitors, visitors, researchers, and industry experts to share expertise, discover new products and solutions, and discuss new developments, innovations and challenges in the industry.

In addition to the forums, PCIM Asia will host a new round-table meeting on 28 August. Titled “Power Source Technology of Low-altitude eVTOL”, this session will examine the role of power electronics, particularly power semiconductor device, in supporting innovation and development in the country’s quickly growing electric vertical take-off and

landing (eVTOL) aircraft industry. This topic aligns with the Greater Bay Area’s intensifying efforts to develop its low-altitude aviation sector, with an emphasis on eVTOL development and commercialisation.

The show will also introduce a new University-Enterprise Job Fair on 30 August, designed to enhance industry-academia collaboration and support talent acquisition and development in the industry. With more than 13 participating companies, including VCTC, Suzhou Boschman Semiconductor Equipment Co Ltd, MacMic Science & Technology Co Ltd and more, the fair will allow visitors to directly connect with potential employers and explore open positions. A job board, accessible throughout the duration of the show, will offer further access to career opportunities.

Discover industry trends and developments at the PCIM Asia Conference 2024

As one of the leading international conferences in the field of power electronics, this year’s PCIM Asia Conference will once again bring together experts from industry and academia to exchange technical knowledge and present their latest research findings. The 2024 programme will include keynote speeches, oral sessions, poster dialogues, and more, covering topics such as intelligent motion, renewable energy and energy management.

Register to visit the PCIM Asia 2024 Conference today at: https://jinshuju.net/f/UUiRgU

PCIM Asia is jointly organised by Guangzhou Guangya Messe Frankfurt Co Ltd and Mesago Messe Frankfurt GmbH. To find out more about PCIM Asia, please visit www.pcimasia-expo.com or email pcimasia@china.messefrankfurt.com.

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STM32WB0x: Meet all the new wireless STM32WBs that will slash bills of materials everywhere!

Mon, 08/26/2024 - 07:30

Author: STMicroelectronics

ST is launching the STM32WB05 and the STM32WB06/07, thus extending the STM32WB0 series inaugurated late last year with the introduction of the STM32WB09. The new family fully realizes the transition from BlueNRG-LP(S) devices to enable developers to take advantage of the STM32Cube ecosystem. Moreover, we are announcing the STM32WB05xN, our new network processor for Bluetooth LE applications, enabling a significantly lower bill of material and a more straightforward implementation for integrators wishing to use a simple radio link with a serial interface. Therefore, today’s announcement is highly symbolic as we promised to deliver the STM32WB0 series by about the first half of 2024 and are glad to meet this target.

STM32WB09, STM32WB06/07, STM32WB05, and STM32WB05xN: What is happening? The BlueNRG-LP(S) DNA The STM32WB0xThe STM32WB0x

All the STM32WB0s share a lot of their DNA with the BlueNRG-LP(S). They use the same Cortex-M0+ and a similar Bluetooth stack. Aligning with the STM32Cube Ecosystem meant modifying some APIs and processes. However, migrating from the BlueNRG stack to the STM32WB0 remains straightforward. Integrators creating cost-effective and energy-sensitive solutions will thus inherit the BlueNRG modular software stack geared toward memory footprint optimizations and performance. The stack also stands out thanks to its interoperability and maturity. Similarly, developers enjoy the same advertising extensions, 2 Mbps high-speed, and 1.3 km (0.8 miles) unobstructed long-range and new ones, like Periodic Advertising with Response (PAwR), while reusing some of the BlueNRG-LPS PCB reference designs.

The electronic shelf labels demo on an STM32WB09

In essence, PAwR, is a bidirectional version of periodic advertising, a technology that enables a Bluetooth device to send an advertisement at deterministic intervals. Consequently, a system can stay in deep sleep and know exactly when to wake up to receive an advertisement, thus significantly extending battery life. Periodic advertisement with response builds on this technology by enabling the device receiving the advertisement to respond to the broadcaster. This is crucial for one-to-many topologies like electronic shelf labels (ESL) that need to send information to many systems simultaneously and have the receiving devices acknowledge that they received the message, for instance.

In fact, we will soon share the ESL demo we showcased at the last Embedded World. It uses PAwR on an STM32WB09 to show what an electronic label can do. The application is available on our STM32 Hotspot Github page for download to ensure any developers can reproduce it in their lab or learn from our implementation.

STM32WB05

When digging into the new portfolio, we see that the STM32WB05 is a direct descendant of the BlueNRG-LPS and is certified Bluetooth LE 5.4. Hence, as long it has the necessary hardware elements, it can perform angle of arrival (AoA) or departure (AoD) calculations for position tracking. Both are a favorite in applications like asset tracking, which benefits from the ability to locate items in a very cost-effective and power-efficient manner. AoA and AoD are also popular in large infrastructures, like airports or stadiums, where companies must track assets and the people they host. Like the BlueNRG-LPS, the STM32WB05 comes with 192 KB of flash and 24 KB of RAM.

STM32WB06/07

The STM32WB06/07 takes its DNA from the BlueNRG-LP. As such, just like all the STM32WB0s, it features functionalities like advertising extensions, 1.3 km (0.8 miles) unobstructed long-range, and a high-speed connection while providing 256 KB of flash and 64 KB of RAM. As the BlueNRG-LP(S), it also stands out thanks to its low power consumption (4.3 mA peak current in transmission at 0 dBm) and its ability to support an RX sensitivity of -104 dBm at 125 kbps. It doesn’t offer AoA and AoD because it targets applications that require more memory than the STM32WB05 but don’t perform asset tracking or people monitoring. It thus represents a compromise for teams looking to optimize their bill of materials.

STM32WB09

Integrators looking for more flash and AoA/AoD capabilities will gravitate toward the STM32WB09. Architecturally, the device is a BlueNRG-LPS with 64 KB of RAM instead of 24 KB to allow for more complex applications. It also has an updated radio that supports all Bluetooth LE 5.4 hardware features, like PAwR, and Isochronous Channels, which the other STM32WB0s don’t support. Very simply, Isochronous Channels is a new PHY layer that enables more complex data streams by ensuring the transmission of time-sensitive and synchronized information. In practice, it can carry a segregated audio stream beside the traditional channel, to ensure less current spike in sensitive devices like hearing aids.

The choice to release the STM32WB09 before the others stemmed from a desire to reach partners that are content with the processing capabilities and energy efficiency of the BlueNRG-LP(S) but need the memory afforded by some of the dual-core STM32WBs. For instance, the typical current draw of the device in shutdown mode is only 800 nA or almost half that of an STM32WB55.

STM32WB05xN

The STM32WB05xN takes the value proposition of the STM32WB0 series one step further by offering a network co-processor instead of an application processor. It still features the same +8 dBm output power or a sleep current consumption of 800 nA, but it is much more cost-effective and straightforward to implement. Developers just need a serial interface with the host MCU and send commands over the serial interface to control its Bluetooth radio. Obviously, engineers who need to run an application on their Bluetooth device will choose the other wireless MCUs in our portfolio.

However, those wishing for a drop-in solution for their BLE stack, now have an option that supports the STM32Cube Ecosystem. A common example is a company which already uses a Zephyr stack, although it will work with other software as well. By offering a secondary library that interfaces with the host controller interface instead of the host stack itself, ST ensures that the STM32WB05xN will work in existing projects and be vastly simpler to implement.

To make the adoption of the STM32WB05xN even more accessible, we are releasing the X-NUCLEO-WB05KN1 development board and making the X-CUBE-WB05N package available for download. Put simply, any developer, regardless of expertise, can grab an STM32U5 evaluation kit and compile our example code to run a proof-of-concept showcasing the STM32WB05xN. Developers can then send commands to show the network co-processor in action.

The STM32Cube ecosystem promised land

The initiative behind the STM32WB0 series partly stems from customers requesting to use the STM32Cube ecosystem with their BlueNRG devices. Hence, all STM32WB0s will enjoy the support of tools like STM32CubeMX and STM32CubeIDE that help with the initialization process, project generation, and code development. We are also working on updating STM32CubeProgrammer to debug and flash the device and STM32CubeMonitor-RF to test and optimize RF performances. Consequently, in time, moving from an STM32WBx to an STM32WB0, or vice versa, will be as simple as changing settings in STM32CubeMX, configuring a different pin-out, and adapting to a few different APIs. We’ve also started working on migration guides. The STM32 community is thus gaining in portability and flexibility.

Over time, ST will also bring some features and application demos from the BlueNRG Ecosystem to the STM32Cube Ecosystem. Customers have shared that some of those tools have helped them optimize their workflow, and we want to ensure that the transition doesn’t rob them of the solutions they’ve been relying on. Put simply, we are creating a unified portfolio to ensure developers can move up and down the price-per-performance ladder more fluidly, making this announcement a pivotal moment for our community.

Why is this happening? The success of the STM32WB

The announcement of the first STM32WB in 2018 was so significant that it disrupted high-end Bluetooth applications. For the first time, the radio and the Cortex-M0+ core driving the wireless stack sat right next to a Cortex-M4, thus allowing developers to create vastly more powerful applications without blowing up their bill of materials. For instance, the Jammy E guitar-shaped MIDI controller wouldn’t have been possible without the STM32WB running the Bluetooth MIDI profile. In fact, the idea of an all-in-one solution became so appealing that we released the STM32WB5MMG soon after. The module houses an STM32WB55, the antenna, baluns, and crystals, further facilitating the creation of robust Bluetooth systems.

Making cost-effective Bluetooth applications accessible to all

In early 2023, we released the STM32WBA, the first wireless Cortex-M33, thus showing our desire to provide powerful and secure systems since the STM32WBA opened the door to a SESIP Level 3 certification. However, teams that didn’t need all this computational power significantly favored BlueNRG. Today, ST updates its portfolio to release devices that can significantly lower a bill of materials without compromising features such as the +8 dBm output power, making them one of the best price-per-feature ratios in the industry. The STM32WB0 series is a testament to the success of the BlueNRGs and the STM32WBs as it harmonizes our portfolio while keeping our extensive price umbrella.

The fact that the STM32WB0s also showcases a Bluetooth LE 5.4-certified radio means that engineers enjoy features like Isochronous Channels. This new PHY layer enables more complex data streams by ensuring the transmission of time-sensitive and synchronized information. However, more than adding to a list of specifications, the Bluetooth LE 5.4 radio is symbolic because it shows that besides being cost-effective, like the BlueNRG-LP(S), the STM32WB0s are also cost-competitive, like the STM32WBs. Hence, more than a rebranding, the STM32WB05xN, STM32WB05, STM32WB06/07, and STM32WB09 represent a new beginning for engineers working on Bluetooth LE applications that want to make their products vastly more accessible.

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Nuvoton Technology’s Arm Cortex-M23 Core M2003 Series Helps Upgrade from 8-bit to 32-bit, Balancing Performance and System Cost

Fri, 08/23/2024 - 13:55

The 5V operating voltage and high interference immunity, along with the 20-pin small package design, optimize system cost

With continuous advancements in semiconductor technology, the performance of 32-bit microcontrollers has been steadily improving while costs have been decreasing, making them the mainstream choice in the market. The rapid growth in applications such as AIoT, industrial automation, smart homes, energy storage, and automotive electronics has placed higher demands on microcontroller performance. Traditional 8-bit microcontrollers often fall short in various applications, driving the widespread adoption of 32-bit microcontrollers. To address these market challenges, Nuvoton Technology has launched the new M2003 series of 32-bit microcontrollers based on the Arm Cortex-M23 core. This series not only features fast computing capabilities and an integrated hardware divider but also supports 5V operating voltage and high interference immunity. The 20-pin small package design meets the market’s performance and optimized system cost needs.

The M2003 series adopts the Arm Cortex-M23 core and is a 32-bit microcontroller with an operating frequency of up to 24 MHz. It includes a 32-bit hardware multiplier/divider, offers 32 KB of Flash memory and 4 KB of SRAM, and operates within a voltage range of 2.4V to 5.5V, with an operating temperature range of -40°C to 105°C.

To meet diverse performance design requirements while reducing size and cost, the M2003 series supports 4 sets of 32-bit timers, 1 watchdog timer, a 3-channel enhanced input capture timer, 2 UARTs, 1 I²C, and 1 universal serial control interface (USCI), which can be flexibly configured as UART/SPI/I²C. Additionally, all communication interfaces have independent FIFO to ensure data integrity during high-speed communication. This series also provides rich analog peripherals, including an 8-channel 12-bit 500 ksps ADC and a 6-channel 16-bit PWM. The series offers small package sizes in TSSOP20 and QFN20 (3 x 3 mm).

The M2003 series comes equipped with the NuTool – CodeGenerator tool. Developed in-house by Nuvoton, this tool can quickly generate initialization projects and integrates peripheral, pin, and clock configuration functions. Users can easily set system parameters through an intuitive interface, and the generated code is fully compatible with Keil, IAR, and NuEclipse, helping to reduce setup time and improve development efficiency. The M2003 series supports ISP and IAP upgrade methods, simplifying system and software update processes and allowing developers to utilize the numerous features of the M2003 series fully. Combined with the NuMaker-M2003FC development board and Nu-Link debugger, it supports Keil MDK, IAR EWARM, and NuEclipse IDE and uses the GNU GCC compiler, providing a complete development ecosystem.

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Dreame Technology Expands India Portfolio with Diverse Range of Robotic & Smart Vacuum Cleaners

Thu, 08/22/2024 - 13:16
  • Robot Vacuums and Mops – D10 Plus Gen 2, D9 Max Gen 2 and L10 Prime feature high suction power, customizable cleaning options for multi-surface cleaning and advanced navigation and mapping technology
  • Wet and Dry Vacuum – H12 Dual comes with 4 operation modes, an edge-to-edge cleaning brush, a high speed brushless motor and 6×4,000mA battery
  • Cordless Stick Vacuums – The Mova J10, J20 and J30 are equipped with a brushless motor, illuminating multi-surface brush head with LED light and a multi-layer and filtration system with up to 97% efficiency rate

Dreame Technology, a global leader in smart home technology appliances, announces the launch of its latest range of versatile home cleaning innovations. The new offerings include the intelligent robot vacuum and mop trio – D10 Plus Gen 2, D9 Max Gen 2, and L10 Prime; the H12 Dual Wet and Dry Vacuum; and the powerful cordless stick vacuums – Mova J10, J20, and J30. The new range caters to diverse cleaning needs, offering a perfect blend of power, intelligence, and convenience.

For hands-free cleaning, the D10 Plus Gen 2, D9 Max Gen 2, and L10 Prime robot vacuums and mops offer advanced navigation, powerful suction, and efficient mopping capabilities. The H12 Dual is a multi-functional marvel that effortlessly tackles both wet and dry messes, making it ideal for spills, pet accidents, and general cleaning. To tackle everyday messes with ease, the Mova J10, J20, and J30 cordless stick vacuums provide powerful cleaning performance and flexibility.

All these products will be available on Amazon starting at INR 7,999 from August 22nd onwards.

Manu Sharma, Managing Director, Dreame India stated“The market for Robot Vacuum cleaners and Dual Wet & Dry Cleaners in India is growing rapidly and we see a significant opportunity to cater to the Indian households. At Dreame, we are committed to establish ourselves as a trusted brand in this space by delivering reliable, innovative products that seamlessly fits in our customers’ lives. Our new range of vacuum cleaners are designed to make home cleaning effortless, reaffirming our dedication to enhancing everyday living through technology.”

Product Specifications: Robot Vacuum and Mop: L10 Prime, D10 Plus Gen 2 and Dreame D9 Max Gen 2

L10 Prime:  L10 prime is a Self-Cleaning Robot Vacuum and Mop built for the ultimate convenience and cleaning performance. It features advanced dual rotary mop pads that rotate at 180RPM with downward pressure to mop closer to the floor without making noise. After mopping, the mop is raised up to 7mm when returning to the base station to keep cleaned floors and rugs dry, where it’s cleaned and dried. A powerful 4,000Pa of powerful suction and a bristleless rubber brush combine to remove hair, dirt, dust, and debris from carpet, hard flooring, nooks, and crannies. Ultrasonic carpet detection allows L10 Prime to accurately identify carpets and rugs, and the LiDAR navigation and an advanced SLAM algorithm generate three separate 3D floor maps to expertly clean and navigate multi-storey spaces expertly.  The Dreamehome app allows the user to create virtual boundaries, set no-mop zones, customize cleaning time, and more.

D10 Plus Gen 2: The D10 Plus is an Auto-Empty Robot Vacuum and Mop with a high-performance motor supplying 6,000Pa* of suction power, swiftly tackling dirt and pet hair on both floors and carpets. The innovative floating rubber brush cleans out pet hair from carpets, making this an ideal choice for pet owners. The 2-in-1 dual-action vacuum and mop for customizable moisture levels while cleaning. The Smart Pathfinder technology avoids obstacles, and generates editable maps for thorough coverage. Moreover, its 4L dust bag capacity offers up to 90 days of uninterrupted cleaning, ensuring a spotless home without the need to continuously check up on the machine. The DreameApp and voice control sync with Alexa, Google and Siri make your cleaning routine more convenient and effortless.

Dreame D9 Max Gen 2:  The D9 Max Gen 2 is an entry-level robot vacuum that can sweep and mop at the same time. It uses high-precision motion sensors and the Smart Pathfinder technology to navigate across different spaces and return to the dock after cleaning. With a powerful 6,000Pa Vormax Suction and four adjustable levels, users can customize cleaning pressure to suit hard floors and carpets. The Carpet Boost feature and an all rubber floating brush prevents hair from clogging the vacuum and makes carpet cleaning more effective and robust.

H12 Dual: Wet and Dry Vacuum

The H12 Dual is a powerful 4-in-1 cleaning wizard that tackles sticky, wet or dry spills and messes on all kinds of surfaces including hard floors, sofas, cars, curtains, and more. With its high-speed brushless motor, the H12 Dual wipes the floor an impressive 520 times per minute*, quickly and easily. The smart sensor with advanced dirt and mess detection systems intelligently adjusts settings for deep cleaning, while the 900mL clean water tank and the enhanced edge-to-edge cleaning brush help clean hard-to-reach areas. The user can also switch between different operation modes – the Auto Mode detects and adjusts to the type of dirt, for a more thorough clean, the Suction Mode sucks up liquids from spills and the Standard and Turbo Modes enable handheld vacuuming, allowing you to let loose on all the dirt in tight spaces. After self-cleaning with a roller brush, brush scraper and serrated bristles, the brush undergoes hot air drying at 55°C for 30 minutes, reducing the growth of mildew, mold, and unpleasant odors. The H12 Dual comes with a long-lasting 6×4,000mAh battery pack, providing over 30 minutes* of cleaning time for wet and dry cleans and 60 minutes for handheld vacuuming before recharging is required. For added convenience, a large LED display and intelligent voice prompts provide real-time information on cleaning optimization, including remaining battery life, floor cleanliness, and operation status.

Cordless Stick Vacuum: Move J10, J20 and J30

Mova J30: The Mova J30 features a powerful 450W brushless motor, delivering up to 60 minutes of cleaning time, making it highly effective at picking up dust, dirt, and debris. It can vacuum and mop simultaneously, thanks to its integrated water tank and mop pad, which remove both dry particles and stubborn stains from hard floors. The folding tube allows you to easily reach tight corners and low spaces without the need to bend down, making it more comfortable to clean hard-to-reach areas. The multi-surface brush illuminates dark spots for better visibility, and the switchable nozzles offer specialized tools for various tasks, like removing pet fur from furniture or cleaning crevices and windows. Additionally, the multi-layered filtration system achieves an impressive 97% efficiency rate.

Mova J20: The Mova J20 features a robust 250W brushless motor that offers up to 50 minutes of cleaning time and a filtration system that cleans dust particles with 97% efficiency. The multi surface brush is illuminated with LED lights to clean dimly lit spaces and the folding tube design helps with easy cleaning of hard to reach spaces on both carpeted and wooden floors.

Mova J10: The Mova J10 features a 150W brushless motor, offering up to 35 minutes of cleaning time. The crevice nozzle, wide combination tool and foldable tube excels in reaching low angle spaces and corners, while the illuminating multi-surface brush head uses LED light to illuminate dim floors and carpets, making cleaning more visible, efficient, and effective. The advanced multi-layer filtration system captures fine dust and particles with up to 97%* efficiency. In tandem, an advanced filter prevents dust from escaping into the air, keeping it inside the dust cup.

Price and availability

The vacuum robots and mops will be available from August 22 on Amazon India.  Robot Vacuums and Mops – L10 Prime is priced at Rs. 45.999, D10 Plus Gen 2 at Rs. 39,999, D9 Max Gen 2 at Rs. 29,999. The H12 Dual Wet and Dry Vacuum is priced at Rs 36,999. Cordless stick vacuums, the Mova J10, J20 and J30 are priced at Rs 7,999; Rs. 10,999 and Rs. 13,999 respectively.

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Renesas Launches Ultra Compact Sensor Module for Smart Air Quality Monitoring at Homes, Schools and Public Buildings

Thu, 08/22/2024 - 12:15
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced an advanced all-in-one sensor module designed for indoor air quality monitoring. The RRH62000, the first multi-sensor air quality module from Renesas, integrates multiple sensor parameters in a compact design and accurately detects different particle sizes, volatile organic compounds and gasses harmful to human health. With a Renesas microcontroller (MCU) on board, the module offers an intelligent sensor management solution for a growing market of air monitoring applications, including air purifiers, smoke detectors, HVAC systems, weather stations and smart home systems. Its robust firmware also enables customer products to comply with various air quality standards around the world.
The RRH62000 features one of the smallest footprints in its class of sensor modules, measuring only 46.6 x 34.8 x 12 mm. It packs Renesas’ RA Family MCU and seven sensor signals: the laser-based PM1/ 2.5/ 10 sensor, ZMOD4410 gas sensor, and the HS4003 humidity and temperature sensor. Together, these sensors can detect particulate matter, total volatile organic compounds (TVOC), estimated CO2, temperature and humidity all in one system. All key components have been pre-integrated and fully calibrated at the factory, allowing developers to start their sensor system designs right out of the box.
“Our RRH62000 module represents the next step in sensor fusion technology, which combines data from multiple sensors and turns it into comprehensive and actionable insights for environmental monitoring,” said Uwe Guenther, Sr. Director, Modules and Solutions Product Line at Renesas. “We are dedicated to providing integrated sensing solutions that simplify development for customers and will continue to drive innovation in sustainable products that reduce environmental impact and enhance safety and comfort in our lives.”
Public interest in air quality and its effects on health has increased significantly since the COVID-19 pandemic. People are now more aware of how air pollutants can affect respiratory health and overall well-being. Less known is that pollutants are typically six to ten times more concentrated indoors than outdoors. These include dust, paint fumes, smoke from cooking, pollen and particulates from HVAC filters, which can enter the respiratory system and cause lung damage, cancer and other health problems.
In order to meet these new challenges, Renesas’ new sensor module is equipped to monitor a broad range of air quality conditions. Using laser-based technology, which offers higher precision compared to conventional LED methods, it can monitor concentrations of PM1, PM2.5, PM10 particulates — particles with diameters of 0.3- to 10µm — as well as absolute or relative TVOC measurements in different power mode settings, providing the highest level of accuracy for these pollutants. The RRH62000 delivers seven sensor outputs simultaneously, and its on-board MCU allows the system to detect surrounding air quality data in real time.
The RRH62000 combo module comes with building standard firmware plus artificial intelligence (AI) algorithms, which lets engineers configure the sensors to conform to the requirements of various green air quality standards in public buildings, such as The Well Building Standard (WELL), Home Ventilating Institute (HVI) and RESET. With these features, for example, a school in China can use the same hardware as one in the U.S. or other location and simply update the AI-enabled firmware for its needs.
Intelligent sensor devices, such as the Renesas RRH62000 and recently announced RRH46410 gas sensor module, can support demand-controlled ventilation, allowing HVAC systems to adjust air flow based on carbon dioxide levels and occupancy information to maintain optimal air quality and energy efficiency. Similarly, these modules use AI algorithms to predict when HVAC filters must be replaced or detect an anomaly before system failure occurs, significantly saving cost and time for system maintenance.
Key Features of the RRH62000 All-in-One Sensor Module
  • Up to 7 simultaneous sensor outputs
  • Laser-based technology for accurate detection of PM1, PM2.5, PM10
  • Metal oxide-based gas sensor
  • Precise temperature and humidity sensor
  • Absolute measurement of TVOC
  • Estimated CO2 for low-cost CO2 room indication
  • Ultra compact size: 46.6 x 34.8 x 12mm to fit in many applications
  • On-board MCU for smart sensor management
  • Robust & Siloxane resistant
  • Support I²C and UART communication
Winning Combinations
Renesas has combined the RRH62000 with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations. This includes the In-home Air Quality Monitoring System and Air Quality Monitor (PM2.5) with Secure Cloud Connection, which combine the RRH62000 with the RA6M3 and RL78/G14 MCUs, and various power devices to enable cost-efficient, compact, modular solutions for modern appliances. These Winning Combinations are technically vetted system architectures designed from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.

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xMEMS Introduces 1mm-Thin Active Micro-Cooling “Fan on a Chip”

Wed, 08/21/2024 - 14:29

Market leader in solid-state, micro speaker technology brings revolutionary air cooling to ultraportable devices for uncompromised performance in AI and other demanding mobile applications.

xMEMS Labs, developers of the foremost platform for piezoMEMS innovation and creators of the world’s leading all-silicon micro speakers, today announced its latest industry-changing innovation: the xMEMS XMC-2400 µCooling chip, the first-ever all-silicon, active micro-cooling fan for ultramobile devices and next-generation artificial intelligence (AI) solutions.

For the first time, with active, fan-based micro-cooling (µCooling) at the chip level, manufacturers can integrate active cooling into smartphones, tablets, and other advanced mobile devices with the silent, vibration-free, solid-state xMEMS XMC-2400 µCooling chip, which measures just 1-millimeter thin.

“Our revolutionary µCooling ‘fan-on-a-chip’ design comes at a critical time in mobile computing,” said Joseph Jiang, xMEMS CEO and Co-Founder. “Thermal management in ultramobile devices, which are beginning to run even more processor-intensive AI applications, is a massive challenge for manufacturers and consumers. Until XMC-2400, there’s been no active-cooling solution because the devices are so small and thin.”

The XMC-2400 measures just 9.26 x 7.6 x 1.08 millimeters and weighs less than 150 milligrams, making it 96 percent smaller and lighter than non-silicon-based, active-cooling alternatives. A single XMC-2400 chip can move up to 39 cubic centimeters of air per second with 1,000Pa of back pressure. The all-silicon solution offers semiconductor reliability, part-to-part uniformity, high robustness, and is IP58 rated.

xMEMS µCooling is based on the same fabrication process as the award-winning, sound-from-ultrasound, xMEMS Cypress full-range micro speaker for ANC in-ear wireless earbuds, which will be in production in Q2, 2025 with several customers already committed to the device. xMEMS plans to sample XMC-2400 to customers in Q1, 2025.

“We brought MEMS micro speakers to the consumer electronics market and have shipped more than half a million speakers in the first 6 months of 2024,” Jiang continued. “With µCooling, we are changing people’s perception of thermal management. The XMC-2400 is designed to actively cool even the smallest handheld form factors, enabling the thinnest, most high-performance, AI-ready mobile devices. It’s hard to imagine tomorrow’s smartphones and other thin, performance-oriented devices without xMEMS µCooling technology.”

xMEMS will begin demonstrating XMC-2400 to lead customers and partners in September at its xMEMS Live events in Shenzhen and Taipei. For more information about xMEMS and its μCooling solutions, visit xmems.com.

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Servotech Power Systems to Build 12 EV Charging Stations for ANERT, Kerala Govt.

Wed, 08/21/2024 - 14:13

Servotech Power Systems Ltd., India’s largest EV Charger manufacturer, has secured a substantial contract for installing 12 EV charging stations from the Agency for New and Renewable Energy Research and Technology (ANERT), Department of Power, Govt. of Kerala. Under this contract Servotech has to build 12 electric vehicle (EV) charging stations with 30KW Fast DC EV Chargers at the various locations of Kerala Motor Vehicle Department. This contract involves Servotech supplying, commissioning, and construction of EV charging stations.

This pilot project whose execution has already begun will be executed in phases with the 1st phase involving the installation of 4 EV charging stations and the 2nd phase will involve the installation of 8 EV charging stations. This initiative will prove to be beneficial in facilitating Kerala’s shift towards sustainable transportation solutions by substantially improving the state’s EV charging network. As the demand for EV mobility grows, there is a corresponding requirement for convenient and accessible charging infrastructure for electric vehicles. These charging stations will enable EV owners to recharge their vehicles conveniently while on the move.

Sarika Bhatia, Director of Servotech Power Systems Ltd. said, “We are elated to be working on this pilot project for ANERT. As a leading EV Charging player who is very actively working towards making India transition towards green transportation, this step brings us closer to achieving our collective dream of seeing India as an EV-powered nation. We are creating our green footprints, starting from Kerala, we plan to increase our footprints to other states as well. Our efficient hardware and software solutions will ensure dependable EV charging stations, catering to the growing demand for sustainable travel options. This initiative will prove to be essential for facilitating infrastructure development to support the expanding EV customer base and enable its strategic expansion in EV charging infrastructure at places with high charging demand.

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Is it time to think beyond Lithium?

Wed, 08/21/2024 - 10:54

The prices of Lithium, the primary workhorse of energy storage solutions today, have dropped by over 60% in the past 18 months. Among many other reasons, this is attributed to a drop in EV demand globally as governments across US and EU started moderating EV related subsidies. There was also an aggressive ramp-up of capacity in China during the Covid period buoyed by the strong EV uptick which has now resulted in a supply glut. To give you a sense of the impact of this glut, we now see that LFP (Lithium Iron Phosphate) batteries are already commercially available at sub-$100 per kWh prices. This was forecast to happen only beyond 2026. At these prices, it is possible for EVs to have capital cost parity with conventional fossil fuel based vehicles which is supposed to be a massive inflection point. 

In the world of stationary energy storage, where Lead Acid batteries have ruled the roost for decades, Lithium based batteries become highly attractive substitutes with a significantly longer life and superior performance. Common sense dictates that this is about the worst time to invest in a new chemistry and that we should rather make the most of the ongoing supply glut to drive the agenda of accelerating decarbonization in India. We would however miss the forest for the trees in doing only that and nothing more.

It is a well known fact that the majority of the world’s active materials, the most critical components within a Lithium cell, are processed in China. Chinese players are also deeply backward integrated with interests in Lithium, Nickel and Cobalt mines across the world. So, financially speaking, we are merely converting our petro-dollars to lithium-dollars and directing them towards China instead of the countries that supply oil and gas. There are active investments in cell manufacturing in India propelled by the recent ACC-PLI incentives with over 50 GWh of capacity planned over the next few years. However, as long as the active material processing and the backward linkages rest with China or other countries the result will be broadly similar. This may also eliminate the possibility of using trade barriers even if local cell manufacturing capacity is fully established. India will need to do a similar backward integration and set up massive capacities for active materials processing which may largely end up becoming a catch-up game with low odds of success.

Secondly, Lithium, just like any other metal is a commodity which will go through its own commodity cycles. It is a risky gamble to leave a critical agenda like energy transition to the vagaries of commodity prices. We have had over five decades and continuing government intervention to insulate the economy from a similar commodity cycle impact of oil and gas and it has been anything but a smooth ride.

Lastly, the electrification of the economy will only be as green as the power sector that generates the electricity. While there is a lot of focus today on EVs, the other, potentially bigger, problem to solve is the greening of the generation through renewables which requires a large amount of energy storage capacity to mitigate the intermittency. For instance, NITI Aayog has estimated annual demand of around 300 GWh of storage capacity by 2030 of which about 60% would come from grid level storage alone. There is no other category, on a standalone basis, that even comes close to this requirement. This is pertinent because it should be a critical decision parameter as we think of the specific chemistries where we choose to invest the country’s limited resources.

So, in summary, we would do well to proactively invest in a chemistry or set of chemistries that are reasonably insulated from commodity cycles, could offer very attractive unit economics at scale, are well suited for grid scale storage and do not require aggressive critical mineral investments. There are many promising candidates on the horizon and Sodium-ion is one such candidate.

Sodium-ion has almost as long a history of development as Lithium-ion but did not take off earlier as Lithium-ion batteries were more compact allowing them to be used in consumer electronics resulting in their widespread adoption. Sodium-ion has however come a long way from the lab over the past few years. BYD, one of the world’s largest cell and EV manufacturers, broke ground on a 30 GWh Sodium-ion plant in January 2024 validating its role in the future of energy transition. A few weeks ago, in June 2024, the world’s largest Sodium-ion grid scale storage of 100 MW / 200 MWh was commissioned in Qianjiang, located in the Hubei province in China. 

The reason for the sudden interest in Sodium-ion and why it also makes a lot of sense for India is that it meets many of the criteria we identified earlier. For starters, Sodium is abundant and cheaply available in India which eliminates the need for backward integration.  It also enables domestic supply chains and reduces the overall cost of cells. As an added advantage, Sodium cells use low cost Aluminum collectors (instead of the more expensive Copper collectors required in Lithium) and the anode requires hard carbon (instead of the more expensive Graphite required in Lithium and also controlled largely by China). A key drawback of the Sodium-ion chemistry is that it has a lower energy density compared to Lithium. However for many applications like grid scale storage and 3W mobility, this is not a deterrent. Lastly, the process of Sodium-ion cell manufacturing is almost identical to Lithium-ion making it possible to use commercially available machinery and equipment to scale up manufacturing.

The need for India to invest in establishing local manufacturing capacities is inevitable. However, leaving that decision completely to the market forces through a chemistry-agnostic PLI scheme has the peril of driving a great short term optimization and missing the opportunity to build a truly self-reliant and thriving energy storage industry. The Chinese government took the imperative of driving investments specifically in LFP resulting in the dominance of that chemistry today. India would do well to build a point of view on the specific chemistry it would like to bet on and take control of the narrative.

Author: Venkat Rajaraman, Founder and CEO at Cygni Energy

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Expanded Single Pair Ethernet Portfolio with 100BASE-T1 and 1000BASE-T1 PHY Transceivers for Network Interoperability

Tue, 08/20/2024 - 14:11

Microchip’s LAN887x PHYs offer extended reach up to 40m and are designed to be compliant with industry standards

The automotive and industrial markets are widely adopting Single Pair Ethernet (SPE) solutions for network connectivity because of the system level benefits of reducing cost, weight and cable complexity. SPE, with its proven performance and reliability in automotive applications, is now also being deployed in other segments like avionics, robotics and automation. For exceptional flexibility and interoperability, Microchip Technology today announces it has expanded its SPE solutions with its family of LAN887x Ethernet PHY transceivers supporting 100 Mbps to 1000 Mbps using 1000BASE-T1 network speeds and cable lengths up to 40m for extended reach.

For interoperability across industries, Microchip’s LAN887x PHYs are designed to be fully compliant with IEEE 802.3bp for the 1000BASE-T1 specification and IEEE 802bw-2015 for the 100BASE-T1 specification. Microchip has collaborated with the University of New Hampshire InterOperability Laboratory (UNH-IOL) to create the development test platform for 1000BASE-T1 conformance. For many automotive and industrial applications that operate in harsh environments and need to withstand extreme temperatures, these devices are also designed to be ISO 26262 functional safety ready with ASIL B classification.

These devices provide advanced diagnostics including cable fault detection, signal quality indicator, link down and errors, built in self-test, and temperature and voltage monitoring for increased reliability. To provide flexibility with varying connectivity requirements across end applications, the LAN887x PHYs support Type A operation with cable lengths up to 15m and Type B operation to support extended cable lengths of up to 40m. Both operation types include four inline connectors.

The LAN887x is a low-power solution with EtherGREEN technology for increased energy efficiency. The OPEN Alliance TC10 Sleep and Wakeup feature provides additional power savings with a maximum of 16 µA standby power consumption, which extends operating time in battery applications. An optional integrated linear regulator can optimize BOM costs by reducing the number of components in the design.

“Our comprehensive solutions, which include PHY transceivers, bridge devices, switches and development boards, make it easier for designers to implement Single Pair Ethernet technology into their designs,” said Charles Forni, vice president of Microchip’s USB and networking business unit. “The low-power sleep, extended cable reach features and functional safety support make our LAN887x devices versatile and robust solutions to support our customers’ expanding networking needs.”

The LAN887x PHYs are compatible with Microchip’s broad portfolio of microcontrollers (MCUs), microprocessors (MPUs), System-on-Chip (SoC) devices and Ethernet switches. Microchip offers a growing range of SPE solutions including PHYs, controllers and switches to support data transmission speeds from 10 Mbps to 1000 Mbps. To learn more about Microchip’s SPE solutions, visit the website.

Development Tools

The LAN887x family of PHY transceivers is supported by comprehensive hardware evaluation platforms; Type A and Type B media converter kits, SFP (SGMII), USB and PCIe plug-in boards and Linux software drivers.

Pricing and Availability

The LAN8870, LAN8871 and LAN8872 are now available in production quantities. For additional information and to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

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Littelfuse Enhances KSC2 Tactile Switch Series to Empower Designers with Precise Electrical Height

Tue, 08/20/2024 - 13:47

Ideal for medical, industrial, transportation, and high-end consumer applications

Littelfuse, Inc., an industrial technology manufacturing company empowering a sustainable, connected, and safer world, announced a product update on the C&K Switches KSC2 Sealed Tactile Switch product line. This surface-mounted, waterproof tactile switch series now incorporates the Electrical Height enhancement.

The KSC2 series of tactile switches for surface-mount technology (SMT) is an IP67-rated, 3.5 mm high momentary-action tactile switch featuring a soft actuator. The switches are available in several models and provide numerous electrical lifespans that can withstand various operating forces.

The latest KSC2 tactile switch, with its superior durability and extended lifespan, outperforms other switches in the market, reducing the need for frequent replacements. Its consistent performance over time instills confidence in users, ensuring reliable functionality. The KSC2 tactile switch provides clear tactile feedback, making it easier for users to know when an input has been registered. Using the redesigned KSC2 series results in a more reliable, user-friendly, and secure product, ultimately benefiting end users.

The KSC2 series design gives users a positive, adaptable tactile feeling, ideally suited for a wide range of markets and applications, including:

  • Medical: Surgical tools, healthcare wearables
  • Transportation: Door handles, window lifters, steering wheel columns
  • High-end consumer: Power tools, lawnmowers, snow blowers
  • Industrial: Elevators, automation, machinery
The KSC2 Tactile Switches offer these key features and benefits:
  • Electrical Height of Sealed Tactile Switch: Guarantees precise and reliable electrical connections by precisely defining the distance between the actuation point and bottom contact.
  • IP67 Rating: Ensures durability and reliability in harsh environments by providing resistance to dust and water up to 1 meter for 30 minutes.
  • Compatibility with Lead-Free Reflow Soldering: Enables efficient, reliable, environmentally friendly manufacturing by withstanding high temperatures and thermal cycling in lead-free, RoHS-compliant soldering processes.
  • Soft Actuator (3.5 mm high): Provides comfortable, improved user experience and precise operation via a soft actuator that offers gentle touch and consistent activation.

How it works: Electrical Height enhancement enables better precision on the electrical switching position compared to the printed circuit board (PCB) reference, which is necessary for stack-up tolerances. This new feature makes the KSC2 switch easier to integrate than other products on the market with Electrical Travel. Generally, designers need to determine the switching point position from the PCB and apply the formula: Product Height ±0.2 mm minus Electrical travel ±0.2 mm, giving a total tolerance of ±0.4 mm as a minimum. The target of dimensioning with the Electrical Height value is to avoid cumulated tolerances and to propose a functional value with tighter tolerance. Electrical Height is stable, and a standard tolerance at only ±0.15 mm or ±0.2 mm is recommended.

“This newly specified feature (Electrical Height) demonstrates the decades of experiences the Littelfuse engineers have when it comes to the integration of our products into the final application, as well as the level of control we have on our manufacturing capabilities,” said Jeremy Hebras, Vice President Digital & Technical Developments, Electronics Business Unit at Littelfuse. “By committing to the switch electrical height on this popular series, together with its tight tolerance, we are helping our customers to optimally design their products, obtain the most qualitative and consistent haptic and performance results, and ultimately enhance their product’s quality.”

The same Electrical Height enhancement is planned for additional tactile switch series in the Littelfuse/C&K Switches portfolio.

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Microchip Technology Adds ECC20x and SHA10x Families of Secure Authentication ICs to TrustFLEX Platform

Fri, 08/16/2024 - 15:24

Pre-Configured CryptoAuthentication ICs help reduce development time and minimize design costs

Secure key provisioning is vital to protect sensitive keys against third-party tampering and malicious attacks. For securing consumer, industrial, data center and medical applications, secure key storage is essential but the process to develop and document secure key provisioning can be complex and costly. To lower the barrier of entry into secure key provisioning and enable more rapid prototyping, Microchip Technology has added the ECC204, SHA104 and SHA105 CryptoAuthentication ICs to its TrustFLEX portfolio of devices, services and tools.

ECC20x and SHA10x ICs are hardware-based, secure storage devices that are designed to keep secret keys hidden from unauthorized attacks. As part of the TrustFLEX platform, ECC204, SHA104 and SHA105 ICs are preconfigured with defined use cases, customizable cryptographic keys and code examples to streamline the development process.

“Adding the ECC20x and SHA10x pre-configured devices to our TrustFLEX platform will facilitate leveraging Microchip’s secure provisioning services for a broader set of applications,” Nuri Dagdeviren, corporate vice president of Microchip’s secure computing group. “With this platform expansion, Microchip is continuing to strengthen its portfolio, making security authentication ICs more accessible and more specifically optimized for high-volume, cost-sensitive applications.”

ECC20x and SHA10x devices meet Common Criteria Joint Interpretation Library (JIL) High rated secure key storage requirements and have been certified by the NIST Entropy Source Validation (ESV) and Cryptographic Algorithm Validation Program (CAVP) in compliance with the Federal Information Processing Standard (FIPS). The secure IC families are designed to implement trusted authentication to maintain the confidentiality, integrity and authenticity of data and communications in a wide range of systems and applications.

Microchip’s CryptoAuthentication ICs are small, low-power devices that are designed to be compatible with any microprocessors (MPUs) or microcontrollers (MCUs). They provide flexible solutions for securing industrial, medical devices, battery-powered equipment and disposable applications. Additionally, the ECC204 is a Wireless Power Consortium (WPC) approved Qi authentication Secure Storage Subsystem (SSS). Visit the Microchip website to learn more about the  Trust Platform and its portfolio of security solutions.

Development Tools

ECC20x and SHA10x ICs are supported by Microchip’s Trust Platform Design Suite, which provides code examples and learning materials and enables the secure transfer of credentials to more easily leverage Microchip’s secure key provisioning services. The devices are also supported by the MPLAB® X Integrated Development Environment (IDE), product-specific evaluation boards and CryptoAuthLib library support.

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New Vishay Intertechnology Silicon PIN Photodiode Improves Sensitivity in Biomedical Applications

Fri, 08/16/2024 - 12:26

Key Features Include Larger Sensitive Area of 6.0 mm², Increased Reverse Light Current, and Small Form Factor of 4.8 mm by 2.5 mm by 0.5 mm

Vishay Intertechnology, Inc. has released a new silicon PIN photodiode that brings a higher level of sensitivity in the visible / near infrared wavelength to biomedical applications such as heart rate and blood oxygen monitoring. The new VEMD8082 features increased reverse light current, decreased diode capacitance, and faster rise and fall times compared to previous-generation solutions. Additionally, its small form factor of 4.8 mm by 2.5 mm by 0.5 mm makes it suitable for integration into low profile devices such as smart watches.

The high sensitivity provided by the VEMD8082 is particularly important in biomedical applications such as photoplethysmography (PPG), where the photodiode is used to detect changes in blood volume and flow by measuring the amount of light absorbed or reflected by blood vessels. In such applications, precise measurements are crucial for diagnosing and monitoring conditions such as cardiovascular disease.

Specifications for the new device contributing to its high sensitivity compared to previous-generation devices include a radiant sensitive area of 6.0 mm² and an increase in reverse light current of 18 % to 20 %, depending on wavelength. Decreased diode capacitance from 50 pF to 46 pF, as well as faster rise times of 40 ns vs. 110 ns, allow for higher sampling rates.

Samples and production quantities of the VEMD8082 are available now.

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Data transformation- Meaning, Aim, Processes involved, Phases, Classification, and Significance

Wed, 08/14/2024 - 15:24

Meaning of data transformation

Data transformation is the process of converting data from one format or structure into another format or structure.  For instance, converting a raw dataset into a well arranged, scientifically analysed, vetted, and a user-friendly format.

As the aim of data transformation is to present the data into a very user-friendly format, it invariably involves converting dataset from one format of file into another format. For instance, CSV (comma separated values), excel spreadsheet, XML (extensible markup language), etc.

It involves conversion of both the format and/ or structure of a data set into a format or structure that is congruent to the requirements of the target system.

Aim of data transformation

The aim behind executing any data transformation process is to ensure that the available data is scientifically arranged, well-analysed, vetted from reliable sources and as per the internationally accepted standards, and presented in a user-friendly format.

This ensures that the decision making based on the available data is rational, logical, scientific, and correct to the best of knowledge. Hence, it aids in analyses and developing insights. Besides, further analyses of the data available after executing the process of data transformation brings to fore some of the hitherto unexplored facts or dimensions about any topic.

Data transformation is only change in the format of the data and not the content of the data

An important feature of data transformation is that it only involves conversion of data from one format to another. It does not change anything in the content of the data.

Who are the people involved in the process of data transformation?

Majorly, the data engineers, data analysts, and data scientists collaborate amongst each other to execute the process of data transformation.

Processes involved in data transformation

Data transformation is executed by accomplishing three processes. They are as follows:

First, data integration.

Second, data migration.

Third, warehousing.

Phases of data transformation

Data transformation is accomplished over five phases. They are as follows:

First, data discovery.

Second, data mapping.

Third, code generation.

Fourth, code execution.

Fifth, data review.

Classification of the process of data transformation

The process of data transformation is classified into four types. They are as follows:

First, constructive data transformation. In this type, data is copied, replicated, or added.

Second, destructive data transformation. In this type, data pertaining to fields or records is deleted.

Third, structural data transformation. In this type, columns in data is combined, moved or renamed.

Fourth, aesthetic data transformation. In this type, data pertaining to certain values are standardized.

Significance of data transformation

First, data transformation is a critical stage of both the ETL (Extract, Transform, Load) and ELT (extract, load, transform) processes.

The difference between the ETL approach and the ELT approach is that the ETL approach uses a fixed criteria to sort data from multiple sources before compiling it a central place. On the other hand, the ELT approach aggregates data as it is from the beginning and then transforms it later depending upon the requirements of the case and analytics.

Second, data transformation is an important aspect of big data analytics. Hence, it is of immense importance in today’s age of big data, an age when the data is already huge in volume and is rapidly growing in gargantuan proportions.

Common life examples of data transformation

Data transformation is undertaken in various applications in our life. Few such examples are as follows:

First, converting file from CSV format to XML format.

Second, conversion of speech into text by means of speech conversion software.

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Microchip and Acacia Collaborate to Enable Optimized Terabit-Scale Data Center Interconnect Systems

Wed, 08/14/2024 - 13:52

The companies enable an interoperable coherent optics ecosystem that can help streamline the development of data center interconnect and metro transport systems

The latest data center architectures and increased traffic are driving higher bandwidth requirements between data centers. To address this challenge, system developers must streamline the development of a new generation of 1.2 Tbps (1.2T) transport solutions across a wide range of client configurations. This requires that today’s terabit-scale Ethernet PHY devices and coherent optical modules interoperate with each other in Data Center Interconnect (DCI) and metro transport networks. Microchip Technology today announces that it has worked with Acacia to demonstrate the fourth generation of interoperability between Microchip’s META-DX2 Ethernet PHY family and Acacia’s Coherent Interconnect Module 8 (CIM 8).

The two companies’ interoperable devices enable low-power, bandwidth-optimized, scalable solutions for pluggable optics in DCI and transport networks. They deliver three key benefits as they jointly enable high-capacity, multi-rate muxponders for optical transport platforms:

  • Optimized DCI bandwidth: The META-DX2 family, through its META-DX2+ PHY, uses its unique Lambda Splitting feature to split 400 GbE or 800 GbE clients across multiple wavelengths driven by the CIM 8 modules. This maximizes the capacity between data centers in rate configurations such as 3×800 GbE over 2×1.2 Tbps waves or 5×400 GbE over 2×1.0 Tbps waves.
  • Reduced design risk: Microchip and Acacia have jointly verified successful SerDes interoperation at up to 112G per lane for Ethernet and OTN clients, which reduces design validation and system qualification requirements.
  • Better support for full bandwidth, multi-rate operation: The META-DX2+ crosspoint and gearbox functions enable 100 GbE to 800 GbE client modules to connect with full bandwidth to CIM 8 modules.

“This interoperability extends a long-established partnership with Acacia to help accelerate and optimize the build-out of cloud computing and AI-ready optical networks while reducing development risk for our customers,” said Maher Fahmi, vice president for Microchip’s communications business unit. “Our META-DX2 is the first solution of its kind to integrate 1.6T of encryption, port aggregation and Lambda Splitting into the most compact 112G PAM4 device in the market.”

“With Acacia’s CIM 8 coherent modules verified to interoperate with Microchip’s META-DX2 devices, we see this as a robust solution that reduces system time-to-market,” said Markus Weber, senior director DSP product line management of Acacia. “The compact size and power efficiency of our CIM 8 coherent modules were designed to help network operators deploy and scale capacity of high-bandwidth DWDM connectivity between data centers and throughout transport networks.”

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Infineon expands its Bluetooth portfolio with eight new parts, including the AIROC CYW89829 Bluetooth LE MCU for automotive applications

Wed, 08/14/2024 - 09:10

Infineon Technologies AG has announced the expansion of its Bluetooth portfolio by eight new products in the AIROC CYW20829 Bluetooth Low Energy 5.4 microcontroller (MCU) family, featuring Systems-on-Chip (SoCs) and modules optimized for industrial, consumer, and automotive use cases. The high integration of the CYW20829 product family allows designers to reduce bill-of-material (BOM) cost and device footprint in a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, health and lifestyle, home automation and others. Product designers also benefit from Infineon’s rich development infrastructure and commitment to robust security, with support for secure boot and execution environments and cryptography acceleration to safeguard sensitive data.

The latest automotive part in the product family, the AIROC CYW89829 Bluetooth Low-Energy MCU, is ideal for car access and wireless battery management systems (wBMS) applications, due to its robust RF performance, long range and latest Bluetooth 5.4 features including PAwR (Periodic Advertising with Responses). The dual ARM Cortex core design of the chip family features separate application and Bluetooth Low Energy subsystems that deliver full featured support for Bluetooth 5.4, low-power, 10 dBm output power without a PA, integrated flash, CAN FD, crypto accelerators, high security including Root of Trust (RoT), and is PSA level 1 ready.

“Infineon offers one of the industry’s broadest portfolios of IoT solutions. Our Bluetooth solutions offer robust connectivity and the latest features,” said Shantanu Bhalerao, Vice President of the Bluetooth Product Line, Infineon Technologies. “Our automotive AIROC CYW89829 Bluetooth LE MCU, and versatile AIROC Bluetooth CYW20829 LE MCU deliver ultra-low power and a high degree of integration for a better user experience across various applications in automotive, industrial, and consumer markets.”

Infineon has been working with customers to design with current products in the CYW20829 family and has received positive reviews:

“The Infineon CYW20829 is the leading Bluetooth part in the market, which has passed the latest Bluetooth 5.4 certification,” said Kevin Wang, CEO of ITON. “CYW20829 has very good RF performance, supports PAwR and LE Audio. These features bring more possibilities in consumer and industrial markets.”

“CYW20829, with perfect RF performance, flexible API, and good long-range features, provides a good solution for commercial lighting, industrial IoT, and more,” said Cai Yi, CEO of Pairlink.

“Earlier this year, the Bluetooth SIG released version 5.4 of the specification with new features: Periodic Advertising with Responses and Encrypted Advertising Data. These features implemented on Infineon’s CYW20829 chips allow Addverb to develop a secure monitoring and controlling system for a fleet of wireless robots in the industrial warehouse, satisfying safety requirements,” said Tapan Pattnayak, Chief Scientist at Addverb, a global leader in robotics.

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The Energy Crisis in AI and the Analog Chip Solution

Tue, 08/13/2024 - 13:23

Artificial Intelligence (AI) has ushered in a new era of innovation, transforming industries with its ability to process vast amounts of data, make complex decisions, and automate tasks. However, this rapid advancement comes at a significant cost: AI’s intense computational demands are raising alarm bells about energy consumption and environmental sustainability. Currently, AI technologies account for approximately 7% of global electricity usage, a figure comparable to the entire annual electricity consumption of India. As AI continues its exponential growth, it becomes increasingly urgent to explore more sustainable alternatives in AI hardware. One promising solution lies in the development and adoption of analog chips.

Why Pursue Sustainable AI?

The dramatic rise in AI applications has led to a corresponding surge in energy consumption, primarily due to the vast computational resources required. Traditional digital computing, the backbone of most AI systems today, is notoriously energy-intensive, contributing significantly to the global carbon footprint. Data centers, which are central to AI computations, currently consume about 1% of the world’s electricity—a figure projected to rise to between 3% and 8% in the coming decades if current trends continue.

The environmental impact of AI extends beyond just energy use. The production and disposal of electronic hardware contribute to the growing problem of electronic waste (e-waste), which poses serious environmental hazards. Furthermore, the cooling systems required to maintain large data centers exacerbate water consumption and environmental degradation. These challenges underscore the need for sustainable AI technologies that can reduce energy and resource use while minimizing e-waste. Developing energy-efficient hardware and optimizing algorithms to lower power consumption are critical steps toward achieving sustainable AI. Analog chips, which have the potential to significantly reduce energy consumption, offer a promising path forward.

IBM and Startups Lead Analog Chip Innovation

IBM has been a leader in the development of analog chips for AI, pioneering innovations with its brain-inspired designs. IBM’s analog chip utilizes phase-change memory (PCM) technology, which operates with much lower energy consumption than traditional digital chips. PCM technology works by altering the material state between crystalline and amorphous forms, enabling high-density storage and rapid access times—key qualities for efficient AI data processing. In IBM’s design, PCM is employed to replicate synaptic weights in artificial neural networks, enabling energy-efficient learning and inference processes.

Beyond IBM, various startups and research institutions are also exploring the potential of analog chips in AI. For instance, Austin-based startup Mythic has developed analog AI processors that integrate memory and computation. This integration allows AI tasks to be performed directly within the memory, reducing data movement and enhancing energy efficiency. Additionally, Rain Neuromorphics is focused on neuromorphic computing, using analog chips designed to mimic biological neural networks. These chips process signals continuously and perform neuronal computations, making them ideal for scalable and adaptable AI systems that can learn and respond in real-time.

Applications of Analog Chips in AI

Analog chips could revolutionize several AI applications by providing energy-efficient and scalable hardware solutions. Some key areas where analog chips could have a significant impact include:

  1. Edge Computing: Edge computing involves processing data near the source, such as sensors or IoT devices, rather than relying on centralized data centres. This approach can reduce latency, enhance real-time decision-making, and lower the energy costs associated with data transmission. Analog chips, with their low power consumption and compact designs, are well-suited for edge computing applications. They allow AI-powered devices to execute complex computations directly at the edge, thereby cutting down on data transfer requirements and significantly lowering energy consumption.
  2. Neuromorphic Computing: Neuromorphic computing aims to replicate the structure and function of the human brain to create more efficient and adaptive AI systems. Analog chips are particularly well-suited for neuromorphic computing because they can process continuous signals and perform parallel computations. By mimicking the analog nature of neural processes, analog chips can enable energy-efficient and scalable AI systems capable of learning and adapting in real time.
  3. Efficiency in AI Inference and Training: Analog chips are inherently well-equipped for AI inference and training, not just as an application but as a core design feature. These chips excel at performing matrix multiplication operations—a fundamental component of neural network computations—with far greater efficiency than digital chips. This efficiency translates into substantial energy savings during AI training and inference, allowing for the scalable deployment of AI models without the prohibitive energy costs typically associated with digital chips. As a result, analog chips are a natural choice for enhancing the sustainability and scalability of AI technologies.
Challenges and the Path Forward

While the potential of analog chips for sustainable AI is immense, several challenges must be addressed to fully realize their potential. A major challenge lies in developing analog computing architectures that can match the precision and accuracy of digital computations. Analog computations are naturally prone to noise and variations, potentially impacting the reliability of AI models.

Ongoing research is focused on developing techniques to mitigate these concerns and improve the robustness of analog AI systems. Despite these challenges, analog chips remain highly suitable for applications such as sensor data processing and real-time environmental monitoring, where slight variability introduced by noise does not outweigh the benefits of reduced power consumption and faster processing speeds. Another challenge is integrating analog chips into the predominantly digital infrastructure of current AI systems. This transition will require significant modifications to both hardware and software stacks.

Efforts are underway to create hybrid architectures that combine the strengths of analog and digital computing, facilitating a smoother transition to more sustainable AI hardware. Despite these obstacles, the future of analog chips in AI looks promising. Ongoing progress in materials science, circuit design, and AI algorithms is fueling the creation of more efficient and scalable analog AI systems. As the demand for environmentally friendly AI solutions grows, analog chips are poised to play a critical role in powering energy-efficient AI technologies.

Case Study: IBM’s Brain-Inspired Analog Chip

Generative AI technologies such as ChatGPT, DALL-E, and Stable Diffusion have dramatically impacted various fields, from marketing to drug discovery. Despite their innovative potential, these systems are substantial energy consumers, demanding data centers that emit considerable carbon dioxide and use enormous amounts of energy. As neural networks grow more complex and their usage expands, energy consumption is expected to rise even more.

IBM has made a significant advancement in tackling this issue with a novel 14-nanometer analog chip equipped with 35 million memory units. Unlike conventional chips, where data must constantly move between processing units, IBM’s chip performs computations directly within these memory units, drastically reducing energy consumption. Typically, data transfer can cause energy usage to soar by a factor of 3 to 10,000 times the actual computational requirement.

This chip showcased remarkable energy efficiency in two speech recognition tasks. The first task, Google Speech Commands, is relatively small but requires high-speed processing. The second, Librispeech, is a more extensive system designed for converting speech into text, testing the chip’s ability to handle large volumes of data. When compared to traditional computing systems, IBM’s chip delivered comparable accuracy but completed tasks more quickly and with significantly lower energy consumption—using as little as one-tenth of the energy required by standard systems for certain tasks.

Analog Chips: Bridging the Gap Between Digital and Neuromorphic Computing

This analog chip is part of IBM’s broader efforts to push neuromorphic computing from theory to practicality—a chip that could one day power everyday devices with efficiency approaching that of the human brain.

Traditional computers are built on the Von Neumann architecture, which separates the central processing unit (CPU) and memory, requiring data to be shuttled between these components. This process consumes time and energy, reducing efficiency. In contrast, the brain combines computation and memory in a single unit, allowing it to process information with far greater efficiency.

IBM’s analog chips mimic this brain-like structure, using phase-change materials that can encode multiple states, not just binary 0s and 1s. This ability to exist in a hybrid state allows the chip to perform multiple calculations without moving a single bit of data, dramatically increasing efficiency.

Overcoming Challenges in Analog AI Chips

Despite the promise of analog chips, they are still in their early stages of development. One major challenge is the initialization of the AI chip, given the vast number of parameters involved. IBM addressed this issue by pre-programming synaptic weights before computations begin, akin to “seasoning” the chip for optimal performance. The results were impressive, with the chip achieving energy efficiency tens to hundreds of times greater than the most powerful CPUs and GPUs.

However, the path forward for analog chips requires overcoming several hurdles. One key area for improvement is the design of the memory technology and its surrounding components. IBM’s current chip does not yet contain all the elements needed for full functionality. The next crucial step involves consolidating all components into a single chip without compromising its effectiveness.

On the software side, developing algorithms specifically tailored to analog chips and creating software that can readily translate code into machine-understandable language are essential. As these chips become more commercially viable, developing dedicated applications will be crucial to keeping the dream of an analog chip future alive.

Building the computational ecosystems in which CPUs and GPUs operate successfully took decades, and it will likely take years to establish a similar environment for analog AI. Nevertheless, the enormous potential of analog chips for combating AI’s sustainability challenges suggests that the effort will be well worth it.

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Highest power density for DCDC converters demonstrated by Vitesco Technologies using Infineon’s CoolGaN Transistors

Tue, 08/13/2024 - 12:18

DCDC converters are essential in any electric or hybrid vehicle to connect the high-voltage battery to the low-voltage auxiliary circuits. This includes 12 V power headlights, interior lights, wiper and window motors, fans, and at 48 V, pumps, steering drives, lighting systems, electrical heaters, and air conditioning compressors. In addition, the DCDC converter is important for developing more affordable and energy-efficient vehicles with an increasing number of low voltage functions. According to TechInsights, the global automotive DC-DC converter market size was valued at USD 4 billion in 2023 and is projected to grow to USD 11 billion by 2030, exhibiting a CAGR of 15 percent during the forecast period. Gallium nitride (GaN) in particular plays a crucial role here, as it can be used to improve the power density in DCDC converters and on-board chargers (OBC). For this reason, Vitesco Technologies, a leading supplier of modern drive technologies and electrification solutions, has selected GaN to improve the power efficiency of its Gen5+ GaN Air DCDC converter. The CoolGaN Transistors 650 V from Infineon Technologies AG significantly improve the overall system performance while minimizing system cost and increasing ease of use. As a result, Vitesco created a new generation of DCDC converters that set new standards in power density (efficiency of over 96 percent) and sustainability for power grids, power supplies, and OBCs.

The advantages of GaN-based transistors in high-frequency switching applications are considerable, but even more important is the high switching speed, which has been increased from 100 kHz to over 250 kHz. This enables very low switching losses, even in hard-switched half-bridges, with minimized thermal and overall system losses. In addition, Infineon’s CoolGaN Transistors feature high turn-on and turn-off speeds and are housed in a top-cooled TOLT package. They are air-cooled, eliminating the need for liquid cooling and thereby reducing overall system costs. The 650 V devices also improve power efficiency and density, enabling an output of 800 V. In addition, they feature an ON-resistance (RDS(on)) of 50 mΩ, a transient drain-to-source voltage of 850 V, an IDS,max of 30 A, and an IDSmax,pulse of 60 A.

“We are delighted to see industry leaders like Vitesco Technologies using our GaN devices and innovating with their applications,” said Johannes Schoiswohl, Senior Vice President &General Manager, GaN Systems Business Line Head at Infineon. “The ultimate value of GaN is demonstrated when it changes paradigms, as in this example of moving from a liquid-cooled system to an air-cooled system.”

With GaN Transistors, Vitesco Technologies was able to design its Gen5+ GaN Air DCDC converters with passive cooling, which reduces the system’s overall cost. The GaN devices also allow for simplified converter design and mechanical integration. As a result, the DCDC converters can be flexibly positioned in the vehicle, reducing the workload for manufacturers. The use of GaN also allows the power of the converters to be scaled up to 3.6 kW and the power density to be increased to over 4.2 kW/l. The Gen5+ GaN Air DCDC converters offer an efficiency of over 96 percent and improved thermal behavior compared to the Gen5 Liquid-Cooled converters. They provide a two-phase output of 248 A at 14.5 V continuous. The phases can be combined to achieve the maximum output power. Still, it is also possible to switch off one phase under partial load conditions and interleave the switching frequency between the two phases. In addition, by switching the input of two phases in series, the converters based on the CoolGaN power transistors 650 V can be used to implement 800 V architectures without exceeding the maximum blocking voltage of the device. The converters also feature an isolated half-bridge topology consisting of a GaN-based half-bridge, a fully isolated transformer, and an active rectifier unit for each phase.

Availability

Infineon’s CoolGaN Transistors 650 V are available now. More information about Infineon’s GaN solutions can be found at www.infineon.com/gan.

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ASMPT Wins Exclusive Texas Instruments Supplier Excellence Award for Second Year Running

Tue, 08/13/2024 - 10:44

ASMPT Limited, the world’s leading maker of integrated solutions for the manufacture of semiconductors and electronics, was recently honoured with the 2023 Supplier Excellence Award from Texas Instruments (TI) for the second year running. This prestigious recognition underscores ASMPT’s unmatched commitment to excellence in supplying products and services that consistently meet TI’s high standards.

Texas Instruments’ (TI) extensive global supplier network comprises over 10,000 companies, which ASMPT is among an elite group of suppliers selected for exemplary performance in the areas of cost, environmental and social responsibility, technology, responsiveness, assurance of supply, and quality.

“ASMPT is honoured to receive this prestigious award from Texas Instruments for the second year running,” said Joseph Poh Tson Cheong, Senior Vice President, ASMPT. “The standards for this award are very high, and to achieve it for two years is a wonderful testament highlighting our commitment to sustained customer success and strong partnerships.”

“As a key supplier to TI, we are committed to actively engage in offering continuous comprehensive support for assembly equipment across all types of supply chain conditions, thereby helping them to drive progress with their roadmap and achieve their goals.”

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Infineon presents high-performance CIPOS Maxi Intelligent Power Modules for industrial motor drives of up to 4 kW

Tue, 08/13/2024 - 10:16

Infineon Technologies AG expands its 7th generation TRENCHSTOP IGBT7 product family with the CIPOS Maxi Intelligent Power Module (IPM) series for low-power motor drives. The new IM12BxxxC1 series is based on the new TRENCHSTOP IGBT7 1200 V and rapid diode EmCon 7 technology. Thanks to the latest micro-pattern trench design, it offers exceptional control and performance. This results in significant loss reduction, increased efficiency, and higher power density. The portfolio includes three new products in variants ranging from 10 A to 20 A for power ratings of up to 4.0 kW: IM12B10CC1, IM12B15CC1 and IM12B20EC1.

The IM12BxxxC1 series is packaged in a DIP 36x23D housing. It integrates various power and control components to increase reliability, optimize PCB size and reduce system costs. This makes it the smallest package for 1200 V IPMs with the highest power density and best performance in its class. The IM12BxxxC1 series is particularly suitable for low-power drives in applications such as motors, pumps, fans, heat pumps and outdoor fans for heating, ventilation, and air conditioning.

The new IPM series offers an isolated dual-in-line molded housing for excellent thermal performance and electrical isolation. It also meets the EMI and overload protection requirements of demanding designs. In addition to the protection features, the IPM is equipped with an independent UL-certified temperature thermistor. The CIPOS Maxi integrates a rugged 6-channel SOI gate driver to provide built-in dead time to prevent damage from transients. It features under-voltage lockout at all channels and over-current shutdown. With its multi-function pin, this IPM allows for high design flexibility for various purposes. The low side emitter pins can be accessed for all phase current monitoring making the device easy to control.

Availability

The three variants of the CIPOS Maxi IM12BxxxC1 portfolio can be ordered now. More information is available at www.infineon.com/CIPOS-Maxi.

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Data linkage- Meaning, Aims, Applications, and Tools for the collection of data

Tue, 08/13/2024 - 10:02

Meaning of data linkage

Data linkage is an exercise of collating data from multiple sources about a particular entity at one place. This exercise generates a completely new data about that particular entity.

The benefit of this newly generated data about that particular entity is that it is more comprehensive, organized, scientific, rational, and logical. Besides, it can be arranged as per any preferred criterion of any analysis or reporting about that particular entity.

Aim of data linkage

The aim of data linkage is to collate data about a particular entity at one place from multiple sources.

These entities can range from an individual, place, company, country, performance over various indices or parameters, per capita income, national income of different countries, criminal records of an individual, tax paid by different companies, prevalence of any disease across different countries or in a community, etc.

The sources of information about these entities can range from research papers, books, magazines, government’s statistical data such as census, surveys, and reports published on various media platforms such as print, electronic, digital, etc.

What the collation of data from multiple sources at one place intends to achieve?

Once the data about a particular entity from multiple sources is collated at one place, it provides a completely new data about that entity.

This arrangement of data brings to fore new analyses about any entity. It makes the understanding about it more lucid and logical. Many a times, it brings to conclusion hitherto unexplored aspects or dimensions about that particular entity.

Approaches to data linkage

There are four approaches to data linkage. They are as follows:

First, clerical approach. In this approach, each record that matches with the concerned entity is entered manually. Since matching and entering of data is done manually, it is a very difficult and time-taking process.

Second, deterministic approach. It is also called rule-based approach. In this approach, attributes for a given record pair is matched according to some rule. All records that satisfy that rule are compiled to generate a new data.

Third, probabilistic approach. It is also called score-based approach. In this approach, the probability of matching of a record pair as per a fixed rule is calculated. Based on this, whichever record satisfies the rule is collated to generate a new data.

Fourth, a combination of any of the aforesaid three approaches.

Earliest examples of data linkage in modern times

In the modern-day world, the earliest examples of data linkage that can be cited are census and reporting about revenue collection from agricultural land.

Earlier, the census data was collected manually. Its details were entered by the application of clerical methods. Every census used to profile various aspects of each and every citizen of a country.

Whereas, the computation of revenue collection from agricultural land was based on the quantum of different crops grown on a piece of land in a year.

Applications of data linkage in today’s world

In today’s information age, data is the new gold. It is the new power. Access to a scientifically arranged data is the pre-requisite for any analysis and research. All strategic decisions are based on access to original, scientifically arranged, and a well analysed data.

All such applications are possible only if data linkage is successfully accomplished. Hence, data linkage has become a necessity today. There is no scope to evade it. As long as humanity will use data as a decisive factor in decision-making, data linkage will remain a must-do thing.

Data linkage is playing a decisive role in the fourth industrial revolution, that is, industry 4.0. Till now, three industrial revolutions have taken place. And, this fourth industrial revolution is solely based on changes resulting from automation and data exchange due to new technologies.

Challenges to data linkage

Data linkage is a complex process. It involves analysing data from multiple sources of information about a particular entity. Besides, a very complicated methodology is involved in the process of data linkage.

As a result, many challenges to data linkage emerge. Few of them are as follows:

First, different softwares are used across different departments of the government and the private sector companies. This makes data linkage difficult. Hence, there is an urgent need to develop convergence of these different softwares. Besides, commonly used open source software must be developed for data linkage. This would reduce the cost of data linkage tools. This would make it easily available for the government departments and the private sector.

Second, different data linkage methodology and skills are applied by the workforce of different departments of the government and the private sector. Hence, there is a need for scientific rationalisation of methodologies and skills used for data linkage.

Third, there is a need to develop new softwares to eliminate errors in data linkage. For instance, longitudinal linkage, that is, linking of data across time, is a cumbersome process and leads to errors. Such errors can be eliminated by developing new softwares that would be used for data linkage and analysis of data. For instance, the software Statistical Package for the Social Sciences (SPSS) is used for data linkage.

Examples of data linkage in India

India is undertaking massive data linkage projects. Few such examples are as follows:

First, all criminal records of an individual are being compiled at one place. This includes all the FIRs, sections of various laws under which an individual has been arraigned, sections of different laws under which that individual has been convicted or acquitted. This is being done under the Crime and Criminal Tracking Network & Systems (CCTNS).

Second, data pertaining to research undertaken by different scientists and academics are being compiled at one place. The aim behind this is to create a database of research undertaken by an individual professor or scientist and compilation of all research papers pertaining to a specific research topic/ area.

Third, the medical history of an individual from all hospitals across the length and breadth of our country is being compiled at one place under the initiative Online Registration System (ORS) under the Digital India programme. This data has also been linked with the Ayushman Bharat Health Account.

 

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